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1. 发明申请

US20050170087A1 Coating film forming method and apparatus 有权
公开(公告)号：US20050170087A1
公开(公告)日：2005-08-04
申请号：US11091760
申请日：2005-03-29
申请人： Tomohide Minami , Shinichi Sugimoto , Takahiro Kitano , Jun Ookura , Hiroaki Kurishima
发明人： Tomohide Minami , Shinichi Sugimoto , Takahiro Kitano , Jun Ookura , Hiroaki Kurishima
IPC分类号： B05D1/00 , B05D1/02 , H01L21/00 , B05D3/12
CPC分类号： H01L21/6715 , B05D1/005 , B05D1/02
摘要： A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.

2. 发明授权

US07488505B2 Coating film forming method and system 失效
公开(公告)号：US07488505B2
公开(公告)日：2009-02-10
申请号：US10885577
申请日：2004-07-08
申请人： Tomohide Minami , Shinichi Sugimoto , Takahiro Kitano , Jun Ookura , Hiroaki Kurishima
发明人： Tomohide Minami , Shinichi Sugimoto , Takahiro Kitano , Jun Ookura , Hiroaki Kurishima
IPC分类号： B05D3/12
CPC分类号： H01L21/67253 , B05D1/005 , B05D1/26 , H01L21/6715
摘要： When a coating film is formed on a substrate, the inplane uniformity of the thickness of the coating film is enhanced to improve through put. Above the substrate, there are provided main and auxiliary nozzles separately movable, and monitoring means for monitoring the state of the surface of the substrate to detect the occurrence of an uncoated region on the surface of the substrate. On the basis of previously prepared coating data, a coating liquid is spirally applied on the substrate by the main nozzle. Then, if the monitoring means detects the occurrence of the uncoated region in a coated region in which the coating liquid has been applied by the main nozzle, a control part detects whether it is required to supply the coating liquid to the uncoated region. If it is required, the coating liquid is supplied to the uncoated region by the auxiliary nozzle. On the other hand, the portion of occurrence of the uncoated region has been grasped by the control part. If the uncoated region is continuously detected at the same place with respect to two substrates, it is determined that the setting of coating data is erroneous, and this is modified.

3. 发明授权

US07510611B2 Coating film forming method and apparatus 有权
公开(公告)号：US07510611B2
公开(公告)日：2009-03-31
申请号：US11091760
申请日：2005-03-29
申请人： Tomohide Minami , Shinichi Sugimoto , Takahiro Kitano , Jun Ookura , Hiroaki Kurishima
发明人： Tomohide Minami , Shinichi Sugimoto , Takahiro Kitano , Jun Ookura , Hiroaki Kurishima
IPC分类号： B05B3/00 , B05C11/02 , B05C11/00 , B08B3/00
CPC分类号： H01L21/6715 , B05D1/005 , B05D1/02
摘要： A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.

4. 发明授权

US06884294B2 Coating film forming method and apparatus 失效
标题翻译：涂膜形成方法和装置
公开(公告)号：US06884294B2
公开(公告)日：2005-04-26
申请号：US10122390
申请日：2002-04-16
申请人： Tomohide Minami , Shinichi Sugimoto , Takahiro Kitano , Jun Ookura , Hiroaki Kurishima
发明人： Tomohide Minami , Shinichi Sugimoto , Takahiro Kitano , Jun Ookura , Hiroaki Kurishima
IPC分类号： B05D1/00 , B05D1/02 , H01L21/00 , B05C5/00
CPC分类号： H01L21/6715 , B05D1/005 , B05D1/02
摘要： A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.
摘要翻译：当喷嘴从晶片中心移动到晶片外部区域上时，将涂布溶液喷涂在从设置在晶片上方的喷嘴水平保持的旋转晶片上，从而将涂布溶液螺旋地喷涂在晶片上。当涂层溶液已经到达晶片外部区域时，喷嘴停止，并且在晶片旋转的同时将涂布溶液圆形喷涂在晶片外部区域上。包括涂膜和溶剂的组分的涂布溶液可以喷涂在晶片和涂布溶液的待涂覆的第一区域上，并且用于涂膜的溶剂可以喷涂在位于第一区域外部的第二边缘区域的晶片。

5. 发明授权

US06776845B2 Coating film forming method and system 失效
公开(公告)号：US06776845B2
公开(公告)日：2004-08-17
申请号：US10152562
申请日：2002-05-23
申请人： Tomohide Minami , Shinichi Sugimoto , Takahiro Kitano , Jun Ookura , Hiroaki Kurishima
发明人： Tomohide Minami , Shinichi Sugimoto , Takahiro Kitano , Jun Ookura , Hiroaki Kurishima
IPC分类号： B05C1100
CPC分类号： H01L21/67253 , B05D1/005 , B05D1/26 , H01L21/6715
摘要： When a coating film is formed on a substrate, the inplane uniformity of the thickness of the coating film is enhanced to improve through put. Above the substrate, there are provided main and auxiliary nozzles separately movable, and monitoring means for monitoring the state of the surface of the substrate to detect the occurrence of an uncoated region on the surface of the substrate. On the basis of previously prepared coating data, a coating liquid is spirally applied on the substrate by the main nozzle. Then, if the monitoring means detects the occurrence of the uncoated region in a coated region in which the coating liquid has been applied by the main nozzle, a control part detects whether it is required to supply the coating liquid to the uncoated region. If it is required, the coating liquid is supplied to the uncoated region by the auxiliary nozzle. On the other hand, the portion of occurrence of the uncoated region has been grasped by the control part. If the uncoated region is continuously detected at the same place with respect to two substrates, it is determined that the setting of coating data is erroneous, and this is modified.

6. 发明授权

US07534467B2 Reduced-pressure drying unit and coating film forming method 失效
标题翻译：减压干燥装置和涂膜成型方法
公开(公告)号：US07534467B2
公开(公告)日：2009-05-19
申请号：US10932042
申请日：2004-09-02
申请人： Takahiro Kitano , Manabu Hama , Shinichi Sugimoto , Naoya Hirakawa
发明人： Takahiro Kitano , Manabu Hama , Shinichi Sugimoto , Naoya Hirakawa
IPC分类号： B05D3/00 , B05D3/12
CPC分类号： H01L21/67034 , B05D3/0493
摘要： The invention includes a hermetic container provided with a substrate mount; a vacuum exhauster connected to the hermetic container; a current member; and a current member raising and lowering mechanism. When the current member is raised and lowered as a function of the pressure inside the hermetic container, a liquid flow of the coating solution on the substrate is controlled, thereby controlling the uniformity of the film thickness of the coating solution.
摘要翻译：本发明包括设置有基板安装件的密封容器; 连接到密封容器的真空排气器; 现任会员和当前成员升降机制。当根据密封容器内部的压力升高和降低当前构件时，控制基底上的涂布液的液体流动，从而控制涂布溶液的膜厚均匀性。

7. 发明授权

US07179504B2 Substrate processing method and substrate processing system 失效
标题翻译：基板加工方法和基板处理系统
公开(公告)号：US07179504B2
公开(公告)日：2007-02-20
申请号：US10964684
申请日：2004-10-15
申请人： Takahiro Kitano , Shinichi Sugimoto , Shinji Kobayashi , Naoya Hirakawa , Akira Fukutomi , Nobukazu Ishizaka
发明人： Takahiro Kitano , Shinichi Sugimoto , Shinji Kobayashi , Naoya Hirakawa , Akira Fukutomi , Nobukazu Ishizaka
IPC分类号： B05D3/02 , B05D3/12
CPC分类号： H01L21/6715 , B05D3/0466 , B05D3/0486 , G03F7/162
摘要： The present invention relates to a processing method for processing a substrate, and comprises a step of coating a coating solution on a surface of the substrate while relatively moving a coating solution discharge nozzle and the substrate and discharging the coating solution from the nozzle onto the substrate. Thereafter, the substrate is exposed to a solvent atmosphere of the coating solution or the pressure is temporarily applied thereto in a container. Thereafter, the pressure inside the container in which the substrate is housed is reduced to dry the coating solution on the substrate. According to the present invention, it is possible to narrow the so-called edge cutting width, which is at a periphery part of the substrate and is not commercialized, and to maintain an in-plane uniformity of the coating film.
摘要翻译：本发明涉及一种处理基板的处理方法，包括在使涂布液排出喷嘴和基板相对移动并将涂布溶液从喷嘴排出到基板上的同时在基板的表面上涂布涂布液的步骤。此后，将基板暴露于涂布溶液的溶剂气氛中，或者将压力暂时施加到容器中。此后，将容纳基板的容器内部的压力减小，以使基材上的涂布溶液干燥。根据本发明，可以缩小位于基板的周边部分并且不商业化的所谓的边缘切割宽度，并且保持涂膜的面内均匀性。

8. 发明授权

US07205025B2 Apparatus and method for drying under reduced pressure, and coating film forming apparatus 失效
标题翻译：减压干燥装置及方法，以及涂膜成膜装置
公开(公告)号：US07205025B2
公开(公告)日：2007-04-17
申请号：US11212725
申请日：2005-08-29
申请人： Shinji Kobayashi , Takahiro Kitano , Shinichi Sugimoto
发明人： Shinji Kobayashi , Takahiro Kitano , Shinichi Sugimoto
IPC分类号： B05D3/00
CPC分类号： H01L21/67034 , B05D3/0254 , B05D3/0493
摘要： In drying a coating liquid such as a resist applied to a substrate under reduced pressure, a coating film in a peripheral portion tends to lose good shape regardless of duration of a drying period, and it is difficult to set an appropriate exhaust flow rate. After the substrate is loaded in an airtight container, a pressure is reduced from atmospheric pressure to a pressure slightly higher than the vapor pressure of a solvent, for example. Then, the solvent actively evaporates from the coating liquid. Here, evacuation is performed initially based on a first flow rate set value Q1, and thereafter, it is performed based on a second flow rate set value larger than Q1. Rounding of the surface in the peripheral portion is corrected by evacuation based on Q1, and more active evaporation of a solvent component is attained by switching to Q2.
摘要翻译：在减压下涂布抗蚀剂等涂布液的干燥中，不管干燥时间长短如何，周边部分的涂膜容易失去良好的形状，难以设定合适的排气流量。在将基板装载到气密容器中之后，例如将压力从大气压降至略高于溶剂蒸气压的压力。然后，溶剂从涂布液中主动蒸发。这里，首先基于第一流量设定值Q 1进行排气，之后，基于大于Q 1的第二流量设定值进行排气。通过基于Q 1的排气来校正周边部分的表面的四舍五入，并且通过切换到Q 2来获得更有效的溶剂成分的蒸发。

9. 发明申请

US20060003105A1 Apparatus and method for drying under reduced pressure, and coating film forming apparatus 失效
标题翻译：减压干燥装置及方法，以及涂膜成膜装置
公开(公告)号：US20060003105A1
公开(公告)日：2006-01-05
申请号：US11212725
申请日：2005-08-29
申请人： Shinji Kobayashi , Takahiro Kitano , Shinichi Sugimoto
发明人： Shinji Kobayashi , Takahiro Kitano , Shinichi Sugimoto
IPC分类号： B05D3/02
CPC分类号： H01L21/67034 , B05D3/0254 , B05D3/0493
摘要： In drying a coating liquid such as a resist applied to a substrate under reduced pressure, a coating film in a peripheral portion tends to lose good shape regardless of duration of a drying period, and it is difficult to set an appropriate exhaust flow rate. After the substrate is loaded in an airtight container, a pressure is reduced from atmospheric pressure to a pressure slightly higher than the vapor pressure of a solvent, for example. Then, the solvent actively evaporates from the coating liquid. Here, evacuation is performed initially based on a first flow rate set value Q1, and thereafter, it is performed based on a second flow rate set value larger than Q1. Rounding of the surface in the peripheral portion is corrected by evacuation based on Q1, and more active evaporation of a solvent component is attained by switching to Q2.
摘要翻译：在减压下涂布抗蚀剂等涂布液的干燥中，不管干燥时间长短如何，周边部分的涂膜容易失去良好的形状，难以设定合适的排气流量。在将基板装载到气密容器中之后，例如将压力从大气压降至略高于溶剂蒸气压的压力。然后，溶剂从涂布液中主动蒸发。这里，首先基于第一流量设定值Q 1进行排气，之后，基于大于Q 1的第二流量设定值进行排气。通过基于Q 1的排气来校正周边部分的表面的四舍五入，并且通过切换到Q 2来获得更有效的溶剂成分的蒸发。

10. 发明授权

US06966949B2 Apparatus and method for drying under reduced pressure, and coating film forming apparatus 失效
标题翻译：减压干燥装置及方法，以及涂膜成膜装置
公开(公告)号：US06966949B2
公开(公告)日：2005-11-22
申请号：US10615800
申请日：2003-07-10
申请人： Shinji Kobayashi , Takahiro Kitano , Shinichi Sugimoto
发明人： Shinji Kobayashi , Takahiro Kitano , Shinichi Sugimoto
IPC分类号： B05D1/40 , B05C9/12 , B05C11/08 , B05D3/02 , B05D3/04 , B05D3/12 , H01L21/00 , H01L21/027 , B05C11/02
CPC分类号： H01L21/67034 , B05D3/0254 , B05D3/0493
摘要： In drying a coating liquid such as a resist applied to a substrate under reduced pressure, a coating film in a peripheral portion tends to lose good shape regardless of duration of a drying period, and it is difficult to set an appropriate exhaust flow rate. After the substrate is loaded in an airtight container, a pressure is reduced from atmospheric pressure to a pressure slightly higher than the vapor pressure of a solvent, for example. Then, the solvent actively evaporates from the coating liquid. Here, evacuation is performed initially based on a first flow rate set value Q1, and thereafter, it is performed based on a second flow rate set value larger than Q1. Rounding of the surface in the peripheral portion is corrected by evacuation based on Q1, and more active evaporation of a solvent component is attained by switching to Q2.
摘要翻译：在减压下涂布抗蚀剂等涂布液的干燥中，不管干燥时间长短如何，周边部分的涂膜容易失去良好的形状，难以设定合适的排气流量。在将基板装载到气密容器中之后，例如将压力从大气压降至略高于溶剂蒸气压的压力。然后，溶剂从涂布液中主动蒸发。这里，首先基于第一流量设定值Q 1进行排气，之后，基于大于Q 1的第二流量设定值进行排气。通过基于Q 1的排气来校正周边部分的表面的四舍五入，并且通过切换到Q 2来获得更有效的溶剂成分的蒸发。

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