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    • 1. 发明申请
    • OPTICAL SEMICONDUCTOR SEALING MATERIAL
    • 光学半导体密封材料
    • US20120305982A1
    • 2012-12-06
    • US13587250
    • 2012-08-16
    • Tomoaki TAKEBETsuyoshi OtaYutaka ObataHiroyuki Higuchi
    • Tomoaki TAKEBETsuyoshi OtaYutaka ObataHiroyuki Higuchi
    • H01L33/56
    • C08F220/10C08F220/18C08F220/28C09J133/14H01L31/0203
    • The present invention provides an optical semiconductor sealing material comprising a radically polymerized polymer of a methacrylate ester having an alicyclic hydrocarbon group containing 7 or more carbon atoms, e.g. an adamantyl group, a norbornyl group, or a dicyclopentanyl group; and an optical semiconductor sealing material comprising a radically polymerized polymer of 50 to 97 mass % of the methacrylate ester and 3 to 50 mass % of acrylate ester having a hydroxyl group. The optical semiconductor sealing material of the present invention is highly transparent and stable to UV light and thus does not undergo yellowing. In addition, the material exhibits excellent compatibility between heat resistance and refractive index, does not undergo deformation or cracking during heating processes such as reflow soldering, and shows high processability. The material can be preferably used as a sealing material for light-emitting elements and light-receiving elements of optical semiconductor devices (semiconductor light-emitting devices).
    • 本发明提供一种光学半导体密封材料,其包含具有含有7个或更多个碳原子的脂环族烃基的甲基丙烯酸酯的自由基聚合的聚合物, 金刚烷基,降冰片基或二环戊基; 以及包含50〜97质量%的甲基丙烯酸酯的自由基聚合物和3〜50质量%的具有羟基的丙烯酸酯的光学半导体密封材料。 本发明的光半导体密封材料高度透明,对紫外光稳定,因此不会发黄。 此外,该材料在耐热性和折射率之间表现出优异的相容性,在诸如回流焊接的加热过程中不会发生变形或开裂,并且显示出高加工性。 该材料可以优选用作光半导体器件(半导体发光器件)的发光元件和光接收元件的密封材料。