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    • 5. 发明授权
    • Method, apparatus and system for use in processing wafers
    • 用于处理晶片的方法,设备和系统
    • US08052504B2
    • 2011-11-08
    • US11829798
    • 2007-07-27
    • William J. KalenianTom WalshDave Halley
    • William J. KalenianTom WalshDave Halley
    • B24B49/00
    • B24B37/345B24B37/30H01L21/67161H01L21/67219H01L21/68785
    • The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.
    • 本实施例提供了用于处理诸如晶片的物体的方法和系统,包括抛光和/或研磨晶片。 一些实施例提供了包括前端模块和处理模块的系统。 前端模块与存储用于处理的对象的存储设备耦合。 前端模块可以包括单个机器人,传送站和多个端部执行器。 处理模块与前端模块耦合,使得单个机器人将物体从存储装置传送到处理模块。 所述处理模块包括旋转台和具有承载件的主轴,所述托架被配置为检索所递送的物体并且处理所述旋转台上的物体。
    • 6. 发明授权
    • Multi-functional roofing tool
    • 多功能屋面工具
    • US06266834B1
    • 2001-07-31
    • US09488224
    • 2000-01-19
    • Tom WalshJohn GilchristLeonard Peterson
    • Tom WalshJohn GilchristLeonard Peterson
    • B25D104
    • B25F1/00B25C11/00B25D1/04
    • A multipurpose hand-held tool having a handle and a head wherein the head has a plurality of implements. The head has a middle portion, which is connected the handle, a first head end and a second head end. The first head end has three cutters such that there is a cutting edge on the top side, the end, and the bottom side of the first head. The first head end also includes a plurality of gauge holes in the top side, and a nail slot on the bottom side. The second head end includes both a hammer head connected to the end and a hammer claw connected to the top side of the second head end. The multipurpose hand-held tool meets a need for roofers to have a multipurpose tool which helps to quickly, efficiently and accurately remove and replace roofing materials.
    • 一种具有把手和头部的多用途手持工具,其中头部具有多个工具。 头部具有连接手柄的中间部分,第一头部端部和第二头部端部。 第一头端具有三个切割器,使得在第一头部的顶侧,端部和底侧上存在切割边缘。 第一头端还包括在顶侧中的多个计量孔和底侧上的钉槽。 第二头端包括连接到端部的锤头和连接到第二头端的顶侧的锤爪。 多用途手持工具满足屋顶工具需要多用途工具,有助于快速,有效和准确地移除和更换屋顶材料。
    • 7. 发明申请
    • METHOD, APPARATUS AND SYSTEM FOR USE IN PROCESSING WAFERS
    • 用于处理波形的方法,装置和系统
    • US20070269986A1
    • 2007-11-22
    • US11829798
    • 2007-07-27
    • William KalenianTom WalshDave Halley
    • William KalenianTom WalshDave Halley
    • H01L21/302
    • B24B37/345B24B37/30H01L21/67161H01L21/67219H01L21/68785
    • The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.
    • 本实施例提供了用于处理诸如晶片的物体的方法和系统,包括抛光和/或研磨晶片。 一些实施例提供了包括前端模块和处理模块的系统。 前端模块与存储用于处理的对象的存储设备耦合。 前端模块可以包括单个机器人,传送站和多个端部执行器。 处理模块与前端模块耦合,使得单个机器人将物体从存储装置传送到处理模块。 所述处理模块包括旋转台和具有承载件的主轴,所述托架被配置为检索所递送的物体并且处理所述旋转台上的物体。
    • 8. 发明授权
    • Method, apparatus and system for use in processing wafers
    • 用于处理晶片的方法,设备和系统
    • US07249992B2
    • 2007-07-31
    • US11173992
    • 2005-07-01
    • William J. KalenianTom Walsh
    • William J. KalenianTom Walsh
    • B24B51/00
    • B24B37/345B24B37/30H01L21/67161H01L21/67219H01L21/68785
    • The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.
    • 本实施例提供了用于处理诸如晶片的物体的方法和系统,包括抛光和/或研磨晶片。 一些实施例提供了包括前端模块和处理模块的系统。 前端模块与存储用于处理的对象的存储设备耦合。 前端模块可以包括单个机器人,传送站和多个端部执行器。 处理模块与前端模块耦合,使得单个机器人将物体从存储装置传送到处理模块。 所述处理模块包括旋转台和具有承载件的主轴,所述托架被配置为检索所递送的物体并且处理所述旋转台上的物体。