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    • 2. 发明授权
    • Electrically conductive matching layers and methods
    • 导电匹配层和方法
    • US07368852B2
    • 2008-05-06
    • US10646130
    • 2003-08-22
    • Gregg W. FreyTodor SheljaskowWalt T. WilserWorth B. WaltersNelson H. Oliver
    • Gregg W. FreyTodor SheljaskowWalt T. WilserWorth B. WaltersNelson H. Oliver
    • H01L41/00H04R17/00
    • B06B1/0622Y10T428/24612
    • Matching layers are provided, including: electrically conductive acoustic matching layers, methods for conducting electric current through matching layers, methods for manufacturing multi-dimensional arrays using conductive matching layers, and multi-dimensional arrays with electrically conducting matching layers. Matching layers with conductors aligned for providing electrical conduction through the thickness or range dimension of the matching layer are provided. For example, vias, aligned magnetic particles, or conductive films at least partially or entirely within the matching layer of each element allow electrical conduction from the transducer material to a ground foil or flex circuit. By using multiple electrical conductive matching layers, a gradation in acoustic impedance for better matching is provided while allowing dicing of the entire stack, including the matching layers and the electroceramic material, in one step.
    • 提供了匹配层,包括:导电声匹配层,用于通过匹配层传导电流的方法,使用导电匹配层制造多维阵列的方法,以及具有导电匹配层的多维阵列。 提供了匹配层,导体对齐以提供通过匹配层的厚度或范围尺寸的导电。 例如,通孔,对准的磁性颗粒或至少部分或完全在每个元件的匹配层内的导电膜允许从换能器材料到接地箔或柔性电路的电传导。 通过使用多个导电匹配层,提供了用于更好匹配的声阻抗等级,同时允许包括匹配层和电陶瓷材料在内的整个叠层的切割。
    • 4. 发明授权
    • Method for manufacturing transducer assembly with curved transducer array
    • 用于制造具有弯曲换能器阵列的换能器组件的方法
    • US5711058A
    • 1998-01-27
    • US581139
    • 1995-12-29
    • Gregg W. Frey
    • Gregg W. Frey
    • B06B1/06G10K11/00G10K11/02G10K11/32H01L41/22
    • B06B1/0622G10K11/004G10K11/02G10K11/32Y10T29/42
    • A method of manufacturing a transducer assembly having a curved transducer array. The method includes the steps of fabricating a laminated assembly by bonding the following layers together: a layer of electrically conductive, acoustic matching material, a layer of piezoelectric ceramic, a flexible printed circuit board and a layer of acoustic damping material. The acoustic damping material changes from an inflexible state to a flexible state when heated. The laminated assembly is then diced to a depth so that the only undiced portion is a portion of the acoustic damping layer. A core body having a curved front face in the shape of a cylindrical section is fabricated. Then at least the undiced portion of the layer of acoustic damping material is heated into a flexible state. The heated undiced portion of the layer of acoustic damping material is flexed to conform to the curved front face of the core body. Then the flexed undiced portion of the layer of acoustic damping material is bonded to the curved front face of said core body. As a result, the piezoelectric elements are arranged along a curve.
    • 一种制造具有弯曲换能器阵列的换能器组件的方法。 该方法包括以下步骤:通过将以下层结合在一起来制造层压组件:导电的声学匹配材料层,压电陶瓷层,柔性印刷电路板和声阻尼材料层。 声阻尼材料在加热时从不弯曲状态变为柔性状态。 然后将层叠的组件切成一定深度,使得唯一未开始的部分是声阻尼层的一部分。 制造具有圆柱形截面形状的弯曲前表面的芯体。 然后至少将声阻尼材料层的未开始部分加热成柔性状态。 声阻尼材料层的加热未开始部分被弯曲以符合芯体的弯曲正面。 然后,声阻尼材料层的弯曲未开始部分结合到所述芯体的弯曲正面。 结果,压电元件沿着曲线布置。
    • 8. 发明授权
    • Compound lens for ultrasound transducer probe
    • 复合镜头用于超声换能器探头
    • US5577507A
    • 1996-11-26
    • US343078
    • 1994-11-21
    • Jonathan E. SnyderLeslie J. KeresGregg W. Frey
    • Jonathan E. SnyderLeslie J. KeresGregg W. Frey
    • A61B8/00
    • A61B8/4281
    • A compound lens for focusing ultrasound emitted from an ultrasound probe having an array of piezoelectric transducer elements. The compound lens has an inner lens part with a convex cylindrical front face and a rear face which is acoustically coupled to the front face of the transducer array, and an outer lens part with a concave cylindrical rear face which is acoustically coupled to the convex cylindrical front face of the inner lens part. The inner lens part may be in the form of a conventional silicone rubber focusing lens. The outer lens part is made of an acoustic medium having a higher acoustic velocity and greater durability than silicone rubber, e.g., polymethylpentene, nylon and high-density polyethylene. Also the outer lens part has greater chemical resistance than silicone rubber.
    • 一种用于聚焦从具有压电换能器元件阵列的超声波探头发射的超声波的复合透镜。 复合透镜具有内透镜部分,其具有凸出的圆柱形正面和与透镜阵列的前表面耦合的后表面,以及具有凹形圆柱形后表面的外透镜部分,其与凸圆柱体 内透镜部分的正面。 内透镜部分可以是常规硅橡胶聚焦透镜的形式。 外透镜部分由具有比硅橡胶(例如聚甲基戊烯,尼龙和高密度聚乙烯)的硅橡胶具有更高的声速和更大的耐久性的声学介质制成。 外透镜部分也比硅橡胶具有更大的耐化学性。
    • 9. 发明申请
    • BACKING, TRANSDUCER ARRAY AND METHOD FOR THERMAL SURVIVAL
    • 背板,传感器阵列和热存储方法
    • US20080163972A1
    • 2008-07-10
    • US12052625
    • 2008-03-20
    • Gregg W. Frey
    • Gregg W. Frey
    • B29C65/48
    • G10K11/004B06B1/0681Y10T156/10
    • Backing blocks, transducer arrays and methods are provided for thermal cycle survivability. By decoupling a portion of the backing block from a case used to contain the transducer stack, the greater thermal expansion properties of most backing blocks may be minimized. For example, a rim is formed on the backing block material. The rim is bonded to the case structure while other portions of the backing block remain free of bonding to the case structure. During thermal cycling or other temperature changes, the backing block may be less likely to expand or bulge and crack, delaminate or damage transducer elements or other transducer materials.
    • 提供支撑块,换能器阵列和方法用于热循环寿命。 通过将背衬块的一部分与用于容纳换能器堆叠的壳体分离,大多数背衬块的较大的热膨胀性能可以最小化。 例如,在背衬块材料上形成边缘。 轮缘结合到壳体结构,而背衬块的其它部分保持不与壳体结构的结合。 在热循环或其他温度变化期间,背衬块可能不太可能膨胀或膨胀并破裂,分层或损坏换能器元件或其它换能器材料。
    • 10. 发明授权
    • Backing, transducer array and method for thermal survival
    • 支撑,换能器阵列和热存活方法
    • US07358645B2
    • 2008-04-15
    • US10921565
    • 2004-08-19
    • Gregg W. Frey
    • Gregg W. Frey
    • H01L41/08
    • G10K11/004B06B1/0681Y10T156/10
    • Backing blocks, transducer arrays and methods are provided for thermal cycle survivability. By decoupling a portion of the backing block from a case used to contain the transducer stack, the greater thermal expansion properties of most backing blocks may be minimized. For example, a rim is formed on the backing block material. The rim is bonded to the case structure while other portions of the backing block remain free of bonding to the case structure. During thermal cycling or other temperature changes, the backing block may be less likely to expand or bulge and crack, delaminate or damage transducer elements or other transducer materials.
    • 提供支撑块,换能器阵列和方法用于热循环寿命。 通过将背衬块的一部分与用于容纳换能器堆叠的壳体分离,大多数背衬块的较大的热膨胀性能可以最小化。 例如,在背衬块材料上形成边缘。 轮缘结合到壳体结构,而背衬块的其它部分保持不与壳体结构的结合。 在热循环或其他温度变化期间,背衬块可能不太可能膨胀或膨胀并破裂,分层或损坏换能器元件或其它换能器材料。