会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 8. 发明申请
    • Reward-Based Access to Media Content
    • 基于奖励的媒体内容访问
    • US20090017750A1
    • 2009-01-15
    • US11776790
    • 2007-07-12
    • Walter M. Marcinkiewicz
    • Walter M. Marcinkiewicz
    • H04M3/42H04H1/00
    • H04L67/104G06F17/30902G06Q30/0277H04L67/1082H04W88/04
    • The present invention provides a reward-based process where sharing mobile devices receive a reward for sharing access to media content with one or more requesting mobile devices. A requesting mobile device asks the wireless communication system for access to media content via a sharing mobile device. A content provider identifies a sharing mobile device with the desired media content to the requesting mobile device. Subsequently, the requesting mobile device requests and receives access to the desired media content via the sharing mobile device. An accounting unit associated with the content provider accrues a reward for a user of the sharing mobile device that rewards the user for providing the requesting mobile device with access to the media content.
    • 本发明提供了一种基于奖励的过程,其中共享移动设备接收用于与一个或多个请求移动设备共享对媒体内容的访问的奖励。 请求移动设备经由共享移动设备请求无线通信系统访问媒体内容。 内容提供者将具有期望的媒体内容的共享移动设备标识给请求的移动设备。 随后,请求的移动设备通过共享移动设备请求并接收对期望的媒体内容的访问。 与内容提供商相关联的会计单元为共享移动设备的用户产生奖励,该用户奖励用户以向请求的移动设备提供对媒体内容的访问。
    • 10. 发明授权
    • Methods for packaging integrated circuit devices including cavities
adjacent active regions
    • 用于封装集成电路器件的方法,包括邻近有源区的腔
    • US6001673A
    • 1999-12-14
    • US248546
    • 1999-02-11
    • Walter M. Marcinkiewicz
    • Walter M. Marcinkiewicz
    • H01L29/161H01L21/56H01L23/02H01L23/31H01L23/66H01L29/201H01L21/82
    • H01L23/315H01L23/66H01L2924/0002
    • A method for packaging an integrated circuit device includes forming a dielectric support layer on the surface of a substrate wherein the dielectric support layer includes an opening therein exposing at least a portion of an active region of the substrate. A protective layer is provided on the dielectric support layer opposite the substrate wherein the protective layer covers the exposed portion of the active region of the substrate thereby defining a cavity between the protective layer and the active region. More particularly, the step of forming the dielectric support layer can include forming a continuous dielectric layer on the surface of the substrate including the active region, and removing portions of the continuous dielectric layer from the active region to provide the opening of the dielectric support layer. Related structures are also discussed.
    • 用于封装集成电路器件的方法包括在衬底的表面上形成电介质支撑层,其中电介质支撑层包括其中露出衬底的有源区的至少一部分的开口。 在与衬底相对的电介质支撑层上提供保护层,其中保护层覆盖衬底的有源区的暴露部分,从而在保护层和有源区之间限定空腔。 更具体地,形成电介质支撑层的步骤可以包括在包括有源区的衬底的表面上形成连续的电介质层,以及从有源区去除连续电介质层的部分以提供电介质支撑层的开口 。 还讨论了相关结构。