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1. 发明授权

US6018853A Knockdown coffin structure 失效
标题翻译：击倒棺材结构
公开(公告)号：US6018853A
公开(公告)日：2000-02-01
申请号：US159874
申请日：1998-09-24
申请人： Ting-Sheng Chen , Hsien-Chin Hsu
发明人： Ting-Sheng Chen , Hsien-Chin Hsu
IPC分类号： A61G17/00
CPC分类号： A61G17/00 , A61G17/004 , A61G17/0073
摘要： A knockdown coffin structure includes a bottom plate made of a plurality of layers of paper sheet which has a honeycomb structure. The bottom plate has four edges, each having an arc slot coextensive therewith. Four side plates, made of a plurality of sheets of corrugated paper stacked over and adhered to each other and having an arc extension, are connected to the edges of the bottom plates by having the arc extensions thereof received in the arc slots of the bottom plate to such a position where the side plates are substantially perpendicular to the bottom plate. A holding plate is fit into coffin to be positioned on the bottom plate with edges of the holding plate abutting against and thus securely holding the side plates in the perpendicular position. The side plates also have rib-like projections. A cover plate is positioned on the side plates when the side plates are in the perpendicular position. The cover plate has grooves formed thereon to be corresponding to and receiving the rib-like projections therein so as to securely hold the side plates together. The side plates are readily detached from the bottom plate which renders the coffin a knockdown structure to facilitate warehousing and transportation of the coffin.
摘要翻译：敲击棺材结构包括由具有蜂窝结构的多层纸片制成的底板。底板具有四个边缘，每个边缘具有与其共同延伸的弧槽。四个侧板由堆叠在其上并具有弧形延伸部的多个瓦楞纸片制成，通过其底部板的弧形槽中的弧形延伸部连接到底板的边缘到这样的位置，其中侧板基本垂直于底板。保持板被装配到棺材中以定位在底板上，保持板的边缘抵靠并且因此将侧板牢固地保持在垂直位置。侧板也具有肋状突起。当侧板处于垂直位置时，盖板位于侧板上。盖板具有形成在其上的凹槽，以便将侧板牢固地保持在一起，以对应于并接纳肋状突起。侧板容易从底板脱离，这使得棺材成为击倒结构，以便于棺材的仓储和运输。

2. 发明授权

US08912015B2 Operating method of hardwired switch 有权
标题翻译：硬连线开关的操作方法
公开(公告)号：US08912015B2
公开(公告)日：2014-12-16
申请号：US13477057
申请日：2012-05-22
申请人： Ting-Sheng Chen , Yung-Fa Chou , Ding-Ming Kwai
发明人： Ting-Sheng Chen , Yung-Fa Chou , Ding-Ming Kwai
IPC分类号： H01L21/66 , H01L23/525 , H01L23/48 , H01L25/065
CPC分类号： H01L23/525 , H01L22/22 , H01L23/481 , H01L25/0657 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An operating method of a hardwired switch is provided. First, a first die is provided. The first die is configured as the first die in the hardwired switch. Next, a function of the first die is inspected to obtain an inspected result. Upon the inspected result, whether a second TSV is selectively disposed between the first landing pad and the fifth landing pad, between the second landing pad and the sixth landing pad, between the third landing pad and the seventh landing pad, or between the fourth landing pad and the eighth landing pad or not is determined. The first die is stacked above a second die, so that the second surface is located between the first die and the second die.
摘要翻译：提供了一种硬连线开关的操作方法。首先，提供第一个模具。第一个裸片配置为硬连线开关中的第一个裸片。接下来，检查第一管芯的功能以获得检查结果。在检查结果中，第二TSV是否选择性地设置在第一着陆垫和第五着陆垫之间，在第二着陆垫和第六着陆垫之间，第三着陆垫和第七着陆垫之间，或在第四着陆垫之间垫和第八着陆垫是否被确定。第一模具堆叠在第二模具上方，使得第二表面位于第一模具和第二模具之间。

3. 发明申请

US20120231563A1 OPERATING METHOD OF HARDWIRED SWITCH 审中-公开
标题翻译：硬开关的操作方法
公开(公告)号：US20120231563A1
公开(公告)日：2012-09-13
申请号：US13477057
申请日：2012-05-22
申请人： Ting-Sheng Chen , Yung-Fa Chou , Ding-Ming Kwai
发明人： Ting-Sheng Chen , Yung-Fa Chou , Ding-Ming Kwai
IPC分类号： H01L21/66
CPC分类号： H01L23/525 , H01L22/22 , H01L23/481 , H01L25/0657 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An operating method of a hardwired switch is provided. First, a first die is provided. The first die is configured as the first die in the hardwired switch. Next, a function of the first die is inspected to obtain an inspected result. Upon the inspected result, whether a second TSV is selectively disposed between the first landing pad and the fifth landing pad, between the second landing pad and the sixth landing pad, between the third landing pad and the seventh landing pad, or between the fourth landing pad and the eighth landing pad or not is determined. The first die is stacked above a second die, so that the second surface is located between the first die and the second die.
摘要翻译：提供了一种硬连线开关的操作方法。首先，提供第一个模具。第一个裸片配置为硬连线开关中的第一个裸片。接下来，检查第一管芯的功能以获得检查结果。在检查结果中，第二TSV是否选择性地设置在第一着陆垫和第五着陆垫之间，在第二着陆垫和第六着陆垫之间，第三着陆垫和第七着陆垫之间，或在第四着陆垫之间垫和第八着陆垫是否被确定。第一模具堆叠在第二模具上方，使得第二表面位于第一模具和第二模具之间。

4. 发明申请

US20100320565A1 WAFER AND METHOD FOR IMPROVING YIELD RATE OF WAFER 有权
标题翻译：用于改善波浪的屈服速率的方法和方法
公开(公告)号：US20100320565A1
公开(公告)日：2010-12-23
申请号：US12566632
申请日：2009-09-24
申请人： Ting-Sheng Chen , Yung-Fa Chou , Ding-Ming Kwai
发明人： Ting-Sheng Chen , Yung-Fa Chou , Ding-Ming Kwai
IPC分类号： H01L23/525 , H01L21/768
CPC分类号： H01L23/5252 , H01L22/22 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A wafer and a method for improving the yield rate of the wafer are provided. The wafer includes a first and a second circuit units, a first and a second through silicon vias (TSVs), and a first spare TSV. The first and the second circuit units are disposed inside the wafer. The first TSV vertically runs through the wafer and is coupled to the first circuit unit through the front metal of the wafer. The second TSV vertically passes through the wafer and is coupled to the second circuit unit through the front metal of the wafer. When the first or the second TSV has failed, the first spare TSV vertically passes through the wafer to replace the failed first or second TSV.
摘要翻译：提供晶片和提高晶片的屈服率的方法。晶片包括第一和第二电路单元，第一和第二通孔硅通孔（TSV）和第一备用TSV。第一和第二电路单元设置在晶片内。第一TSV垂直穿过晶片，并通过晶片的前金属耦合到第一电路单元。第二TSV垂直穿过晶片，并通过晶片的前金属耦合到第二电路单元。当第一或第二TSV失效时，第一备用TSV垂直通过晶片以替换故障的第一或第二TSV。

5. 发明申请

US20150277096A1 DISPLAY MAGNIFYING DEVICE 审中-公开
标题翻译：显示放大器
公开(公告)号：US20150277096A1
公开(公告)日：2015-10-01
申请号：US14304987
申请日：2014-06-16
申请人： Huei-Jen Kuo , Yung-Fa Chou , Ting-Sheng Chen
发明人： Huei-Jen Kuo , Yung-Fa Chou , Ting-Sheng Chen
IPC分类号： G02B25/00
CPC分类号： G02B25/005
摘要： A display magnifying device adapted for an electronic device having one or more external sockets is provided. The display magnifying device includes a magnifying glass, a plug, and a stand. The plug fits the external socket. The stand has a first end connected to the magnifying glass and a second end connected to the plug. The display magnifying device is adapted to be detachably assembled to the electronic device by connecting the plug to the external socket. A display magnifying device including a magnifying glass, a casing and a stand is further provided. The casing at least covers a part of the electronic device. The stand has a first end connected to the magnifying glass and a second end connected to the casing. The display magnifying device is adapted to be detachably assembled to the electronic device by covering the part of the electronic device with the casing.
摘要翻译：提供一种适于具有一个或多个外部插座的电子设备的显示放大装置。显示放大装置包括放大镜，插头和支架。插头适合外部插座。支架具有连接到放大镜的第一端和连接到插头的第二端。显示放大装置适于通过将插头连接到外部插座而可拆卸地组装到电子设备。还提供了包括放大镜，外壳和支架的显示放大装置。壳体至少覆盖电子设备的一部分。支架具有连接到放大镜的第一端和连接到壳体的第二端。显示放大装置适于通过用壳体覆盖电子装置的一部分而可拆卸地组装到电子装置。

6. 发明授权

US08384201B2 Wafer and method for improving yield rate of wafer 有权
标题翻译：晶圆和提高晶圆产率的方法
公开(公告)号：US08384201B2
公开(公告)日：2013-02-26
申请号：US12566632
申请日：2009-09-24
申请人： Ting-Sheng Chen , Yung-Fa Chou , Ding-Ming Kwai
发明人： Ting-Sheng Chen , Yung-Fa Chou , Ding-Ming Kwai
IPC分类号： H01L23/02
CPC分类号： H01L23/5252 , H01L22/22 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A wafer and a method for improving the yield rate of the wafer are provided. The wafer includes a first and a second circuit units, a first and a second through silicon vias (TSVs), and a first spare TSV. The first and the second circuit units are disposed inside the wafer. The first TSV vertically runs through the wafer and is coupled to the first circuit unit through the front metal of the wafer. The second TSV vertically passes through the wafer and is coupled to the second circuit unit through the front metal of the wafer. When the first or the second TSV has failed, the first spare TSV vertically passes through the wafer to replace the failed first or second TSV.
摘要翻译：提供晶片和提高晶片的屈服率的方法。晶片包括第一和第二电路单元，第一和第二通孔硅通孔（TSV）和第一备用TSV。第一和第二电路单元设置在晶片内。第一TSV垂直穿过晶片，并通过晶片的前金属耦合到第一电路单元。第二TSV垂直穿过晶片，并通过晶片的前金属耦合到第二电路单元。当第一或第二TSV失效时，第一备用TSV垂直通过晶片以替换故障的第一或第二TSV。

7. 发明申请

US20110152033A1 PHYSICAL TRAINING SYSTEM 审中-公开
标题翻译：物理训练系统
公开(公告)号：US20110152033A1
公开(公告)日：2011-06-23
申请号：US12700366
申请日：2010-02-04
申请人： Bing-Shiang Yang , Ting-Sheng Chen , Sung-Wei Chou , Hsin-Tien Wu
发明人： Bing-Shiang Yang , Ting-Sheng Chen , Sung-Wei Chou , Hsin-Tien Wu
IPC分类号： A63B71/00
CPC分类号： A63B24/0062 , A63B24/0003 , A63B71/0622
摘要： A physical training system is provided combining biomechanics and neurophysiological measurement for providing users with instant advisory feedback about adjustment to body movements of a user or parameter setting of a gymnastic apparatus for a training objective, especially for specific muscle groups, without incurring sports injuries.
摘要翻译：提供了结合生物力学和神经生理学测量的身体训练系统，为用户提供关于用户的身体运动的调整的即时咨询反馈或用于训练目标的体操装置的参数设置，特别是对于特定的肌肉群，而不会引起运动损伤。

8. 发明授权

US08217521B2 Hardwired switch of die stack and operating method of hardwired switch 有权
标题翻译：硬接线开关和硬连线开关的操作方法
公开(公告)号：US08217521B2
公开(公告)日：2012-07-10
申请号：US12566626
申请日：2009-09-24
申请人： Ting-Sheng Chen , Yung-Fa Chou , Ding-Ming Kwai
发明人： Ting-Sheng Chen , Yung-Fa Chou , Ding-Ming Kwai
IPC分类号： H01L23/48
CPC分类号： H01L23/525 , H01L22/22 , H01L23/481 , H01L25/0657 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A hardwired switch of a die stack including eight landing pads is provided. A first, a second, a third, and a fourth landing pads are disposed on a first surface of a die. The second and the fourth landing pads are electrically connected to the first and the third landing pads respectively. A fifth, a sixth, a seventh, and an eighth landing pads are disposed on a second surface of the die. The seventh and the eighth landing pads are electrically connected to the sixth and the fifth landing pads respectively. In a vertical direction of the die, the first, the second, the third, and the fourth landing pads overlap partially or fully with the fifth, the sixth, the seventh, and the eighth landing pads respectively. In addition, an operating method of a hardwired switch is also provided.
摘要翻译：提供了包括八个着陆垫的管芯堆叠的硬连线开关。第一，第二，第三和第四着陆焊盘设置在管芯的第一表面上。第二和第四着陆焊盘分别电连接到第一和第三着陆焊盘。第五，第六，第七和第八着陆焊盘设置在管芯的第二表面上。第七和第八着陆垫分别电连接到第六和第五着陆垫。在模具的垂直方向上，第一，第二，第三和第四着陆焊盘分别与第五，第六，第七和第八着陆焊盘部分或完全重叠。此外，还提供了硬连线开关的操作方法。

9. 发明申请

US20100289139A1 HARDWIRED SWITCH OF DIE STACK AND OPERATING METHOD OF HARDWIRED SWITCH 有权
标题翻译：硬件开关硬件开关和硬件开关的操作方法
公开(公告)号：US20100289139A1
公开(公告)日：2010-11-18
申请号：US12566626
申请日：2009-09-24
申请人： Ting-Sheng Chen , Yung-Fa Chou , Ding-Ming Kwai
发明人： Ting-Sheng Chen , Yung-Fa Chou , Ding-Ming Kwai
IPC分类号： H01L23/48 , H01L23/498 , H01L21/66
CPC分类号： H01L23/525 , H01L22/22 , H01L23/481 , H01L25/0657 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A hardwired switch of a die stack including eight landing pads is provided. A first, a second, a third, and a fourth landing pads are disposed on a first surface of a die. The second and the fourth landing pads are electrically connected to the first and the third landing pads respectively. A fifth, a sixth, a seventh, and an eighth landing pads are disposed on a second surface of the die. The seventh and the eighth landing pads are electrically connected to the sixth and the fifth landing pads respectively. In a vertical direction of the die, the first, the second, the third, and the fourth landing pads overlap partially or fully with the fifth, the sixth, the seventh, and the eighth landing pads respectively. In addition, an operating method of a hardwired switch is also provided.
摘要翻译：提供了包括八个着陆垫的管芯堆叠的硬连线开关。第一，第二，第三和第四着陆焊盘设置在管芯的第一表面上。第二和第四着陆焊盘分别电连接到第一和第三着陆焊盘。第五，第六，第七和第八着陆焊盘设置在管芯的第二表面上。第七和第八着陆垫分别电连接到第六和第五着陆垫。在模具的垂直方向上，第一，第二，第三和第四着陆焊盘分别与第五，第六，第七和第八着陆焊盘部分或完全重叠。此外，还提供了硬连线开关的操作方法。

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