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    • 10. 发明授权
    • MOS transistor
    • MOS晶体管
    • US06780694B2
    • 2004-08-24
    • US10338930
    • 2003-01-08
    • Bruce B. DorisOmer H. DokumaciJack A. MandelmanCarl J. Radens
    • Bruce B. DorisOmer H. DokumaciJack A. MandelmanCarl J. Radens
    • H01L21338
    • H01L21/28114H01L21/26586H01L21/82385H01L21/823864H01L29/42376H01L29/665
    • A method of fabricating a semiconductor transistor device comprises the steps as follows. Provide a semiconductor substrate with a gate dielectric layer thereover and a lower gate electrode structure formed over the gate dielectric layer with the lower gate electrode structure having a lower gate top. Form a planarizing layer over the gate dielectric layer leaving the gate top of the lower gate electrode structure exposed. Form an upper gate structure over the lower gate electrode structure to form a T-shaped gate electrode with an exposed lower surface of the upper gate surface and exposed vertical sidewalls of the gate electrode. Remove the planarizing layer. Form source/drain extensions in the substrate protected from the short channel effect. Form sidewall spacers adjacent to the exposed lower surface of the upper gate and the exposed vertical sidewalls of the T-shaped gate electrode. Form source/drain regions in the substrate. Form silicide layers on top of the T-shaped gate electrode and above the source/drain regions.
    • 制造半导体晶体管器件的方法包括以下步骤。 提供其上具有栅极介电层的半导体衬底和形成在栅极电介质层上的下部栅极电极结构,而下部栅电极结构具有较低的栅极顶部。 在栅极电介质层上形成平坦化层,离开下部栅电极结构的栅极顶部。 在下栅极电极结构上形成上栅极结构,形成具有上栅极表面的暴露下表面和暴露的栅电极垂直侧壁的T形栅电极。 取出平坦化层。 衬底中形成源/漏极扩展,防止短沟道效应。 形成邻近上部栅极的暴露的下表面和T形栅电极的暴露的垂直侧壁的侧壁间隔物。 在衬底中形成源/漏区。 在T形栅电极的顶部和源极/漏极区之上形成硅化物层。