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    • 6. 发明授权
    • Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures
    • 使用原位电容测量来监测复杂PCB组件和其他结构中界面材料的稳定性
    • US08589102B2
    • 2013-11-19
    • US13010854
    • 2011-01-21
    • Timothy J. ChainerMichael A. GaynesEdward J. Yarmchuk
    • Timothy J. ChainerMichael A. GaynesEdward J. Yarmchuk
    • G01N27/22
    • G01N27/228H01L23/34H01L23/3733H01L23/42H01L2924/0002H05K3/30Y10T29/49002Y10T29/4913H01L2924/00
    • An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The electrical capacitance between the electrodes is monitored during the changing physical condition. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances between the first and second electrodes. The technique may be employed for monitoring physical changes in electronic devices and other structures having interfaces between components.
    • 在电子部件和散热器之间的间隙的相对侧上的第一和第二电极上施加电位。 间隙中的热界面材料,电子部件和散热器中的至少一个受到变化的物理条件的影响。 在变化的物理条件期间监测电极之间的电容。 可以使用共享共用散热器的部件阵列来实施这种方法。 用于测试热界面的组件包括印刷电路板,安装到印刷电路板并且与印刷电路板可操作地相关联的多个电子部件,定位成用于吸收由电子部件产生的热量的散热器,与散热器相关联的第一电极, 分别与电子部件相关联的多个第二电极和用于监测第一和第二电极之间的电容的装置。 该技术可以用于监测电子设备中的物理变化以及具有组件之间的接口的其他结构。
    • 7. 发明申请
    • USING IN SITU CAPACITANCE MEASUREMENTS TO MONITOR THE STABILITY OF INTERFACE MATERIALS IN COMPLEX PCB ASSEMBLIES AND OTHER STRUCTURES
    • 使用现场电容测量来监测接口材料在复合PCB组件和其他结构中的稳定性
    • US20120053874A1
    • 2012-03-01
    • US13010854
    • 2011-01-21
    • Timothy J. ChainerMichael A. GaynesEdward J. Yarmchuk
    • Timothy J. ChainerMichael A. GaynesEdward J. Yarmchuk
    • G01N27/22G06F15/00H05K13/00G01R27/26
    • G01N27/228H01L23/34H01L23/3733H01L23/42H01L2924/0002H05K3/30Y10T29/49002Y10T29/4913H01L2924/00
    • An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The electrical capacitance between the electrodes is monitored during the changing physical condition. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances between the first and second electrodes. The technique may be employed for monitoring physical changes in electronic devices and other structures having interfaces between components.
    • 在电子部件和散热器之间的间隙的相对侧上的第一和第二电极上施加电位。 间隙中的热界面材料,电子部件和散热器中的至少一个受到变化的物理条件的影响。 在变化的物理条件期间监测电极之间的电容。 可以使用共享共用散热器的部件阵列来实施这种方法。 用于测试热界面的组件包括印刷电路板,安装到印刷电路板并且与印刷电路板可操作地相关联的多个电子部件,定位成用于吸收由电子部件产生的热量的散热器,与散热器相关联的第一电极, 分别与电子部件相关联的多个第二电极和用于监测第一和第二电极之间的电容的装置。 该技术可以用于监测电子设备中的物理变化以及具有组件之间的接口的其他结构。
    • 8. 发明授权
    • Method and apparatus for correcting for systematic errors in timing pattern generation
    • 用于校正定时模式生成中的系统误差的方法和装置
    • US07136243B2
    • 2006-11-14
    • US11015130
    • 2004-12-17
    • Timothy J. ChainerAnthony P. PrainoMark D. SchultzBucknell C. WebbEdward J. Yarmchuk
    • Timothy J. ChainerAnthony P. PrainoMark D. SchultzBucknell C. WebbEdward J. Yarmchuk
    • G11B5/09G11B21/02
    • G11B5/59633G11B5/5565G11B21/106
    • Improvements in placement of timing patterns in self-servowriting include correcting for systematic errors due to geometric effects. A correction is made for varying systematic errors, such as when the recording head has spatially separate read and write elements. Further, servopattern rotation due to residual or unmeasured systematic errors is reduced by using a once per revolution clock index derived from the motor drive current waveform or any other sensor. In one aspect of correcting for systematic errors in the writing of timing patterns on a storage medium of a storage device, a time interval between a trigger pattern written at a first radial position of the storage medium and a rotational index is measured. The rotational index is related to the rotational orientation of the storage medium with respect to a fixed frame of the storage device. The location of another trigger pattern to be written is shifted, using the measured time interval to determine the shift in location for the another trigger pattern.
    • 自我维护中定时模式布局的改进包括纠正由于几何效应引起的系统误差。 对变化的系统误差进行校正,例如当记录头具有空间上分离的读和写元件时。 此外,通过使用从电动机驱动电流波形或任何其他传感器导出的每转一次的时钟指数来减少由于残余或未测量的系统误差引起的伺服模式旋转。 在对存储装置的存储介质上的定时模式的写入进行校正系统错误的一个方面,测量在存储介质的第一径向位置上写入的触发模式与旋转指标之间的时间间隔。 旋转指数与存储介质相对于存储装置的固定框架的旋转取向有关。 使用测量的时间间隔来移动要写入的另一个触发模式的位置,以确定另一个触发模式的位置偏移。