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1. 发明申请

US20060141828A1 Overmolded electronic assembly and overmoldable interface component 失效
标题翻译：包覆成型的电子组件和包覆模制接口部件
公开(公告)号：US20060141828A1
公开(公告)日：2006-06-29
申请号：US11021429
申请日：2004-12-23
申请人： Timothy Dean , Daniel Rooney , Jeffrey Petsinger
发明人： Timothy Dean , Daniel Rooney , Jeffrey Petsinger
IPC分类号： H01R4/66
CPC分类号： H05K3/284 , H01R43/24 , H05K1/117 , H05K3/0052 , H05K2201/09127 , H05K2201/10037 , H05K2201/10325
摘要： An overmolded electronic assembly (900, 1000, 1200) is fabricated from one or more overmoldable interface components (300, 400, 500, 1220, 1750) that may be electrical contacts or electronic components that have physical interfaces, such as speakers or sensors. The overmoldable interface components have a sacrificial end that is cut off from the remainder of the overmoldable interface components after being overmolded in an electronic assembly, providing a sealed cavity into the overmolded electronic assembly.
摘要翻译：包覆成型的电子组件（900,1000,1200）由一个或多个包覆模制的接口部件（300,400,500,420,1750）制成，所述接口部件可以是具有诸如扬声器或传感器之类的物理接口的电触点或电子部件。包覆模制的界面部件具有牺牲端，在电子组件中包覆成型之后，其余的可包覆模制的界面部件被切掉，从而为包覆模制的电子组件提供了一个密封腔。

2. 发明申请

US20060049986A1 Integrated patch antenna and electronics assembly and method for fabricating 有权
标题翻译：集成贴片天线和电子组件及其制造方法
公开(公告)号：US20060049986A1
公开(公告)日：2006-03-09
申请号：US10936286
申请日：2004-09-08
申请人： Gregory Dunn , Jeffrey Petsinger , William Ziemer
发明人： Gregory Dunn , Jeffrey Petsinger , William Ziemer
IPC分类号： H01Q1/38
CPC分类号： H05K1/16 , H01Q1/22 , H01Q1/38 , H01Q9/0407 , H01Q23/00 , H05K1/024 , H05K3/429 , H05K3/4602 , H05K3/4688 , H05K2201/09454 , H05K2201/09509
摘要： An integrated patch antenna and electronics assembly (300) comprises an antenna dielectric layer (305), a ground plane layer (310) disposed on a first side of the antenna dielectric layer, a printed circuit dielectric layer (315) disposed on the ground plane layer opposite the antenna dielectric layer, a patterned conductive metal foil layer (320) on a component surface (323) of the assembly (300), and a conductive metal foil antenna patch (325) disposed on a second side of the antenna dielectric layer that is in a patch side (391) of the assembly. In some embodiments, a plated through hole (330) couples the antenna patch to the patterned conductive metal foil layer. In some embodiments, there are one or more printed circuit dielectric layers (316, 341, 346, 351) disposed over the antenna patch on the antenna patch side of the assembly. In some embodiments, pairs of printed circuit dielectric layers ([315, 316], [340, 341], [345, 346], [350, 351]) are formed simultaneously on each side of the assembly.
摘要翻译：集成贴片天线和电子组件（300）包括天线电介质层（305），设置在天线电介质层的第一侧上的接地平面层（310），设置在接地平面上的印刷电路介电层（315）与天线电介质层相对的层，在组件（300）的部件表面（323）上的图案化导电金属箔层（320）和设置在天线电介质层的第二侧上的导电金属箔天线贴片（325）即组件的补丁侧（391）。在一些实施例中，电镀通孔（330）将天线贴片耦合到图案化的导电金属箔层。在一些实施例中，在组件的天线贴片侧上的天线贴片上方设置有一个或多个印刷电路电介质层（316,341,346,351）。在一些实施例中，在组件的每一侧同时形成成对的印刷电路电介质层（[315,316]，[340,341]，[345,346]，[350,351]）。

3. 发明申请

US20050242997A1 Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit 失效
标题翻译：电介质片，用于制造电介质片的方法，使用电介质片的印刷电路和贴片天线以及制造印刷电路的方法
公开(公告)号：US20050242997A1
公开(公告)日：2005-11-03
申请号：US10837461
申请日：2004-04-30
申请人： Gregory Dunn , Jeffrey Petsinger , Jovica Savic
发明人： Gregory Dunn , Jeffrey Petsinger , Jovica Savic
IPC分类号： H01G2/12 , H05K1/03 , H05K1/16 , H05K3/00 , H05K3/06 , H05K3/42
CPC分类号： H05K3/0023 , H05K1/0366 , H05K1/162 , H05K3/064 , H05K3/429 , H05K2201/0175 , H05K2201/0355 , H05K2201/09309 , H05K2203/0571
摘要： A dielectric sheet (500, 600, 1621) includes a photodielectric support layer (505, 1630) that may be glass reinforced and a dielectric laminate (510, 605). The dielectric laminate includes first and second metal foil layers (415, 660; 210, 665, 1605, 1610), and a dielectric layer (405, 655, 1620) disposed between the first and second metal foil layers. The first metal foil layer is adhered to the photodielectric support layer. In a printed circuit and patch antenna that includes the dielectric sheet, the first metal layer is patterned by removal of metal according to a circuit pattern and the photodielectric support layer is patterned by removal of dielectric material according to the circuit pattern.
摘要翻译：电介质片（500,600,1621）包括可以被玻璃增强的光电介质支撑层（505,1630）和介电层压板（510,605）。介电层压板包括设置在第一和第二金属箔层之间的第一和第二金属箔层（415,660; 210,665,1605,1610）和介电层（405,655,1620）。第一金属箔层粘附到光致介电支撑层上。在包括电介质片的印刷电路和贴片天线中，通过根据电路图案去除金属来对第一金属层进行构图，并且通过根据电路图案去除介电材料来对光致介电支撑层进行图案化。

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