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1. 发明申请

US20120299019A1 Systems and Methods Providing Semiconductor Light Emitters 有权
标题翻译：提供半导体发光器的系统和方法
公开(公告)号：US20120299019A1
公开(公告)日：2012-11-29
申请号：US13117320
申请日：2011-05-27
申请人： Tien-Ming Lin , Chih-Hsuan Sun , Wei-Yu Yeh
发明人： Tien-Ming Lin , Chih-Hsuan Sun , Wei-Yu Yeh
IPC分类号： H01L33/52 , H01L21/52
CPC分类号： H01L33/58 , H01L33/507 , H01L2224/48091 , H01L2924/0002 , H01L2933/0041 , H01L2933/0058 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.
摘要翻译：半导体结构包括具有多个管芯区域的模块，设置在衬底上的多个发光器件，使得每个管芯区域包括一个发光器件，以及在该模块上的透镜板，并且粘附到基材用胶。透镜板包括多个微透镜，每个微透镜各自对应于一个裸片区域，并且在每个裸片区域中，胶水通过相应的一个微透镜提供一个发光器件的气密封装。此外，作为透镜板的一部分包括磷光体。

2. 发明申请

US20120313518A1 LED LAMP AND METHOD OF MAKING THE SAME 有权
标题翻译： LED灯及其制作方法
公开(公告)号：US20120313518A1
公开(公告)日：2012-12-13
申请号：US13158962
申请日：2011-06-13
申请人： Chih-Hsuan Sun , Wei-Yu Yeh , Tien-Ming Lin
发明人： Chih-Hsuan Sun , Wei-Yu Yeh , Tien-Ming Lin
IPC分类号： H01K1/62 , H05K13/00 , H01J61/52
CPC分类号： F21V29/74 , F21K9/232 , F21K9/90 , F21V3/02 , F21Y2101/00 , F21Y2115/10 , Y10T29/49002
摘要： A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module.
摘要翻译：照明装置包括具有朝向外侧的中心部分的小面的多面散热器。小面形成中央封闭部分，并且散热器还具有多个翅片，其中每个翅片放置在相邻小面之间并从散热器向外突出。照明装置还具有安装有半导体发射体的多个电路板。每个电路板安装在散热器的相应面上。所述照明装置还具有覆盖所述多个电路板的光扩散壳体，与所述电路板连通并可操作以将功率转换为与所述半导体发射体兼容的功率模块，以及与所述电力电连通的电源连接器组件模块。

3. 发明授权

US08721097B2 LED lamp with improved light output 有权
标题翻译： LED灯具有改善的光输出
公开(公告)号：US08721097B2
公开(公告)日：2014-05-13
申请号：US13111222
申请日：2011-05-19
申请人： Sheng-Shin Guo , Chih-Hsuan Sun , Tien-Ming Lin , Wei-Yu Yeh
发明人： Sheng-Shin Guo , Chih-Hsuan Sun , Tien-Ming Lin , Wei-Yu Yeh
IPC分类号： F21V9/16 , F21V3/00
CPC分类号： F21K9/64 , F21K9/232 , F21K9/90 , F21V3/02 , F21V13/02 , F21V29/507 , F21V29/70 , F21V29/74 , F21Y2101/00 , F21Y2113/13 , F21Y2115/10 , Y10T29/4913
摘要： The present disclosure involves an LED lamp. The LED lamp includes a plurality of light-emitting diode (LED) light sources located on a substrate. At least a subset of the LED light sources is free of a phosphor coating. The LED lamp includes a multi-layered cap structure located over at least the subset of the LED light sources. The cap structure contains a phosphor material and a diffuser material. The cap structure is physically separated from the subset of the LED light sources by a gap. The LED lamp includes a cover structure positioned over and surrounding the LED light sources and the cap structure.
摘要翻译：本发明涉及一种LED灯。 LED灯包括位于基板上的多个发光二极管（LED）光源。 LED光源的至少一个子集没有磷光体涂层。 LED灯包括位于LED光源的至少子集上的多层帽结构。盖结构包含磷光体材料和漫射材料。盖结构通过间隙与LED光源的子集物理分离。 LED灯包括位于LED光源和盖结构之上并围绕LED光源的盖结构。

4. 发明授权

US08414160B2 LED lamp and method of making the same 有权
标题翻译： LED灯及其制作方法
公开(公告)号：US08414160B2
公开(公告)日：2013-04-09
申请号：US13158962
申请日：2011-06-13
申请人： Chih-Hsuan Sun , Wei-Yu Yeh , Tien-Ming Lin
发明人： Chih-Hsuan Sun , Wei-Yu Yeh , Tien-Ming Lin
IPC分类号： F21V29/00
CPC分类号： F21V29/74 , F21K9/232 , F21K9/90 , F21V3/02 , F21Y2101/00 , F21Y2115/10 , Y10T29/49002
摘要： A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module.
摘要翻译：照明装置包括具有朝向外侧的中心部分的小面的多面散热器。小面形成中央封闭部分，并且散热器还具有多个翅片，其中每个翅片放置在相邻小面之间并从散热器向外突出。照明装置还具有安装有半导体发射体的多个电路板。每个电路板安装在散热器的相应面上。所述照明装置还具有覆盖所述多个电路板的光扩散壳体，与所述电路板连通并可操作以将功率转换为与所述半导体发射体兼容的功率模块，以及与所述电力电连通的电源连接器组件模块。

5. 发明授权

US08507328B2 Systems and methods providing semiconductor light emitters 有权
公开(公告)号：US08507328B2
公开(公告)日：2013-08-13
申请号：US13117320
申请日：2011-05-27
申请人： Tien-Ming Lin , Chih-Hsuan Sun , Wei-Yu Yeh
发明人： Tien-Ming Lin , Chih-Hsuan Sun , Wei-Yu Yeh
IPC分类号： H01L21/20
CPC分类号： H01L33/58 , H01L33/507 , H01L2224/48091 , H01L2924/0002 , H01L2933/0041 , H01L2933/0058 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.

6. 发明申请

US20120293978A1 LED LAMP WITH IMPROVED LIGHT OUTPUT 有权
标题翻译： LED灯具改进的光输出
公开(公告)号：US20120293978A1
公开(公告)日：2012-11-22
申请号：US13111222
申请日：2011-05-19
申请人： Sheng-Shin Guo , Chih-Hsuan Sun , Tien-Ming Lin , Wei-Yu Yeh
发明人： Sheng-Shin Guo , Chih-Hsuan Sun , Tien-Ming Lin , Wei-Yu Yeh
IPC分类号： F21V9/16 , F21V29/00 , H01J9/00 , F21V5/00
CPC分类号： F21K9/64 , F21K9/232 , F21K9/90 , F21V3/02 , F21V13/02 , F21V29/507 , F21V29/70 , F21V29/74 , F21Y2101/00 , F21Y2113/13 , F21Y2115/10 , Y10T29/4913
摘要： The present disclosure involves an LED lamp. The LED lamp includes a plurality of light-emitting diode (LED) light sources located on a substrate. At least a subset of the LED light sources is free of a phosphor coating. The LED lamp includes a multi-layered cap structure located over at least the subset of the LED light sources. The cap structure contains a phosphor material and a diffuser material. The cap structure is physically separated from the subset of the LED light sources by a gap. The LED lamp includes a cover structure positioned over and surrounding the LED light sources and the cap structure.
摘要翻译：本发明涉及一种LED灯。 LED灯包括位于基板上的多个发光二极管（LED）光源。 LED光源的至少一个子集没有磷光体涂层。 LED灯包括位于LED光源的至少子集上的多层帽结构。盖结构包含磷光体材料和漫射材料。盖结构通过间隙与LED光源的子集物理分离。 LED灯包括位于LED光源和盖结构之上并围绕LED光源的盖结构。

7. 发明授权

US08757845B2 Wide angle based indoor lighting lamp 有权
标题翻译：广角室内照明灯
公开(公告)号：US08757845B2
公开(公告)日：2014-06-24
申请号：US13194538
申请日：2011-07-29
申请人： Chi Xiang Tseng , Hsiao-Wen Lee , Sheng-Shin Guo , Pei-Wen Ko , Chih-Hsuan Sun , Wei-Yu Yeh
发明人： Chi Xiang Tseng , Hsiao-Wen Lee , Sheng-Shin Guo , Pei-Wen Ko , Chih-Hsuan Sun , Wei-Yu Yeh
IPC分类号： F21V7/07
CPC分类号： F21K9/50 , F21K9/60 , F21K9/90 , F21V3/02 , F21V3/0625 , F21V5/008 , F21V5/04 , F21V7/0091 , F21V29/77 , F21V29/89 , F21Y2115/10 , H01L33/58 , H01L2933/0091 , Y10T29/49826
摘要： The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a light-emitting diode (LED) device on a substrate; a lens secured on the substrate and over the LED device; and a diffuser cap secured on the substrate and covering the lens, wherein the lens and diffuser cap are designed and configured to redistribute emitting light from the LED device for wide angle illumination.
摘要翻译：本公开提供了照明结构的一个实施例。照明结构包括在基板上的发光二极管（LED）装置; 固定在基板上并在LED器件上方的透镜; 以及固定在所述基板上并覆盖所述透镜的散射器盖，其中所述透镜和扩散器盖被设计和配置为重新分配来自所述LED装置的光以用于广角照明。

8. 发明申请

US20120088397A1 LIGHT EMITTING DIODE LIGHT BAR MODULE WITH ELECTRICAL CONNECTORS FORMED BY INJECTION MOLDING 有权
标题翻译：带注射成型电气连接器的发光二极管灯模块
公开(公告)号：US20120088397A1
公开(公告)日：2012-04-12
申请号：US12899999
申请日：2010-10-07
申请人： Hsiao-Wen Lee , Chih-Hsuan Sun , Wei-Yu Yeh
发明人： Hsiao-Wen Lee , Chih-Hsuan Sun , Wei-Yu Yeh
IPC分类号： H01R43/24 , H01R43/18 , B29C45/14 , H01R13/00
CPC分类号： B29C45/0001 , B29C45/14262 , B29C45/14311 , B29C45/14639 , B29K2705/02 , F21S4/20 , F21V23/06 , F21Y2103/10 , F21Y2115/10 , H01R43/24 , Y10T29/53
摘要： The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.
摘要翻译：本公开涉及使用注射成型制造LED灯条模块的防水连接器 - 散热器组件的电连接器的方法。这些方法包括匹配用于连接器和散热器的注塑材料的热膨胀系数（CTE）。将散热器和导体销插入注射模具中，并将注射成型材料注入注射模具中。当注射成型材料固化时，当连接器的注射成型材料与散热器形成防水密封时，形成集成连接器 - 散热器组件。控制注射模具内的散热器和导体销的放置，以确保注射成型材料和散热片之间的粘合剂粘合力比最大剪切力更强。

9. 发明申请

US20130148346A1 ENERGY STAR COMPLIANT LED LAMP 有权
标题翻译：能源之星合规LED灯
公开(公告)号：US20130148346A1
公开(公告)日：2013-06-13
申请号：US13313153
申请日：2011-12-07
申请人： Chih-Hsuan Sun , Wei-Yu Yeh , Hsueh-Hung Fu , Dong Jung Suen
发明人： Chih-Hsuan Sun , Wei-Yu Yeh , Hsueh-Hung Fu , Dong Jung Suen
IPC分类号： F21V29/00 , F21V7/00
CPC分类号： F21K9/60 , B05D5/061 , B05D5/063 , F21K9/20 , F21K9/232 , F21K9/66 , F21V3/049 , F21V3/0625 , F21V3/10 , F21V7/0016 , F21V29/74 , F21V29/773 , F21Y2101/00 , F21Y2115/10
摘要： The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments.
摘要翻译：本公开提供一种照明装置。照明装置包括盖结构。盖结构部分地涂覆有可反射光的反射材料。照明装置包括设置在盖结构内的一个或多个发光装置。发光装置可以是发光二极管（LED）芯片。照明装置还包括散热结构。散热结构在第一方向上连接到盖结构。散热结构和盖结构具有耦合接口。联接接口在基本上垂直于第一方向的第二方向上延伸。散热结构具有以一定角度与耦合接口相交的部分。根据一些实施例，该角度在约60度至约90度的范围内。

10. 发明申请

US20120287635A1 Light Emitting Diode Light Bar Module with Electrical Connectors Formed by Injection Molding 有权
标题翻译：具有通过注塑成型的电连接器的发光二极管灯条模块
公开(公告)号：US20120287635A1
公开(公告)日：2012-11-15
申请号：US13557315
申请日：2012-07-25
申请人： Hsiao-Wen Lee , Chih-Hsuan Sun , Wei-Yu Yeh
发明人： Hsiao-Wen Lee , Chih-Hsuan Sun , Wei-Yu Yeh
IPC分类号： F21V29/00 , F21V31/00 , F21V5/04
CPC分类号： B29C45/0001 , B29C45/14262 , B29C45/14311 , B29C45/14639 , B29K2705/02 , F21S4/20 , F21V23/06 , F21Y2103/10 , F21Y2115/10 , H01R43/24 , Y10T29/53
摘要： The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.
摘要翻译：本公开涉及使用注射成型制造LED灯条模块的防水连接器 - 散热器组件的电连接器的方法。这些方法包括匹配用于连接器和散热器的注塑材料的热膨胀系数（CTE）。将散热器和导体销插入注射模具中，并将注射成型材料注入注射模具中。当注射成型材料固化时，当连接器的注射成型材料与散热器形成防水密封时，形成集成连接器 - 散热器组件。控制注射模具内的散热器和导体销的放置，以确保注射成型材料和散热片之间的粘合剂粘合力比最大剪切力更强。

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