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    • 1. 发明授权
    • Operation methods for memory cell and array for reducing punch through leakage
    • 用于减少穿孔渗漏的存储单元和阵列的操作方法
    • US08218364B2
    • 2012-07-10
    • US13159413
    • 2011-06-13
    • Lit-Ho ChongWen-Jer TsaiTien-Fan OuJyun-Siang Huang
    • Lit-Ho ChongWen-Jer TsaiTien-Fan OuJyun-Siang Huang
    • G11C11/34
    • G11C5/04G11C16/0416G11C16/10H01L27/11521H01L27/11568
    • An integrated circuit includes a memory array having a plurality of memory cells arranged in rows and columns, each memory cell including two doped regions and a channel region therebetween, each pair of adjacent memory cells sharing a common doped region, each memory cell having a charge storage member over the channel region and a control gate over the charge storage member. A first word line is coupled to the memory cells in the same row, each of the memory cells designated as the Nth memory cell. Each of a plurality of bit lines is designated as the Nth bit line, the Nth bit line coupled to a doped region shared by the Nth memory cell and the (N−1)th memory cell. The integrated circuit also has a plurality of global bit lines, each of which coupled to two of the bit lines via a switch.
    • 集成电路包括具有以行和列排列的多个存储单元的存储器阵列,每个存储单元包括两个掺杂区和它们之间的沟道区,每对相邻的存储单元共用公共掺杂区,每个存储单元具有一个电荷 存储部件,以及位于电荷存储部件上的控制栅极。 第一字线耦合到相同行中的存储器单元,每个存储器单元被指定为第N个存储器单元。 多个位线中的每一行被指定为第N位线,第N位线耦合到由第N存储器单元和第(N-1)个存储器单元共享的掺杂区域。 集成电路还具有多个全局位线,每个位线经由开关耦合到两个位线。
    • 7. 发明授权
    • Operation methods for memory cell and array thereof immune to punchthrough leakage
    • 记忆单元及其阵列的操作方法免于穿透泄漏
    • US08369148B2
    • 2013-02-05
    • US12264893
    • 2008-11-04
    • Tien-Fan OuWen-Jer TsaiJyun-Siang Huang
    • Tien-Fan OuWen-Jer TsaiJyun-Siang Huang
    • G11C11/34
    • G11C5/04G11C16/0416G11C16/10H01L27/11521H01L27/11568
    • An integrated circuit includes a memory cell structure including a first cell and a second cell. The first cell includes a first storage structure and a first gate over a substrate. The first gate is over the first storage structure. The second cell includes a second storage structure and a second gate over the substrate. The second gate is over the second storage structure. The first gate is separated from the second gate. A first doped region is adjacent to the first cell and is coupled to a first source. A second doped region is configured within the substrate and adjacent to the second cell. The second doped region is coupled to a second source. At least one third doped region is between the first cell and the second cell, wherein the third doped region is floating.
    • 集成电路包括包括第一单元和第二单元的存储单元结构。 第一单元包括第一存储结构和衬底上的第一栅极。 第一个门是第一个存储结构。 第二单元包括第二存储结构和衬底上的第二栅极。 第二个门是第二个存储结构。 第一个门与第二个门分开。 第一掺杂区域与第一单元相邻并且耦合到第一源极。 第二掺杂区域被配置在衬底内且与第二单元相邻。 第二掺杂区域耦合到第二源极。 至少一个第三掺杂区域在第一单元和第二单元之间,其中第三掺杂区域是浮置的。
    • 9. 发明授权
    • Operation methods for memory cell and array for reducing punch through leakage
    • 用于减少穿孔渗漏的存储单元和阵列的操作方法
    • US08139416B2
    • 2012-03-20
    • US13159410
    • 2011-06-13
    • Lit-Ho ChongWen-Jer TsaiTien-Fan OuJyun-Siang Huang
    • Lit-Ho ChongWen-Jer TsaiTien-Fan OuJyun-Siang Huang
    • G11C11/34
    • G11C5/04G11C16/0416G11C16/10H01L27/11521H01L27/11568
    • A method for programming a first memory cell in a memory array. In a specific embodiment, each memory cell has a drain, a source, a channel, and a control gate overlying a charge storage material and the channel. The source of the first memory cell is coupled to the drain of a second memory cell. A voltage is applied to the drain of the first memory cell, and the source of the second memory cell is grounded. The method includes floating the drain of the second memory cell and the source of the first memory cell and turning on the channels of the first and second memory cells, effectively forming an extended channel region. Hot carriers are injected to the charge storage material of the first cell to program the first memory cell. The extended channel lowers electrical fields and reduces punch through leakage in unselected memory cells.
    • 一种用于对存储器阵列中的第一存储器单元进行编程的方法。 在具体实施例中,每个存储单元具有覆盖电荷存储材料和沟道的漏极,源极,沟道和控制栅极。 第一存储单元的源极耦合到第二存储单元的漏极。 电压施加到第一存储单元的漏极,并且第二存储单元的源极接地。 该方法包括使第二存储单元的漏极和第一存储单元的源极浮置,并且导通第一和第二存储单元的通道,从而有效地形成扩展通道区域。 将热载流子注入第一单元的电荷存储材料以对第一存储单元进行编程。 扩展通道降低电场,并减少未选择的存储单元中的冲击。