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    • 1. 发明授权
    • Operation methods for memory cell and array thereof immune to punchthrough leakage
    • 记忆单元及其阵列的操作方法免于穿透泄漏
    • US08369148B2
    • 2013-02-05
    • US12264893
    • 2008-11-04
    • Tien-Fan OuWen-Jer TsaiJyun-Siang Huang
    • Tien-Fan OuWen-Jer TsaiJyun-Siang Huang
    • G11C11/34
    • G11C5/04G11C16/0416G11C16/10H01L27/11521H01L27/11568
    • An integrated circuit includes a memory cell structure including a first cell and a second cell. The first cell includes a first storage structure and a first gate over a substrate. The first gate is over the first storage structure. The second cell includes a second storage structure and a second gate over the substrate. The second gate is over the second storage structure. The first gate is separated from the second gate. A first doped region is adjacent to the first cell and is coupled to a first source. A second doped region is configured within the substrate and adjacent to the second cell. The second doped region is coupled to a second source. At least one third doped region is between the first cell and the second cell, wherein the third doped region is floating.
    • 集成电路包括包括第一单元和第二单元的存储单元结构。 第一单元包括第一存储结构和衬底上的第一栅极。 第一个门是第一个存储结构。 第二单元包括第二存储结构和衬底上的第二栅极。 第二个门是第二个存储结构。 第一个门与第二个门分开。 第一掺杂区域与第一单元相邻并且耦合到第一源极。 第二掺杂区域被配置在衬底内且与第二单元相邻。 第二掺杂区域耦合到第二源极。 至少一个第三掺杂区域在第一单元和第二单元之间,其中第三掺杂区域是浮置的。
    • 3. 发明授权
    • Operation methods for memory cell and array for reducing punch through leakage
    • 用于减少穿孔渗漏的存储单元和阵列的操作方法
    • US08139416B2
    • 2012-03-20
    • US13159410
    • 2011-06-13
    • Lit-Ho ChongWen-Jer TsaiTien-Fan OuJyun-Siang Huang
    • Lit-Ho ChongWen-Jer TsaiTien-Fan OuJyun-Siang Huang
    • G11C11/34
    • G11C5/04G11C16/0416G11C16/10H01L27/11521H01L27/11568
    • A method for programming a first memory cell in a memory array. In a specific embodiment, each memory cell has a drain, a source, a channel, and a control gate overlying a charge storage material and the channel. The source of the first memory cell is coupled to the drain of a second memory cell. A voltage is applied to the drain of the first memory cell, and the source of the second memory cell is grounded. The method includes floating the drain of the second memory cell and the source of the first memory cell and turning on the channels of the first and second memory cells, effectively forming an extended channel region. Hot carriers are injected to the charge storage material of the first cell to program the first memory cell. The extended channel lowers electrical fields and reduces punch through leakage in unselected memory cells.
    • 一种用于对存储器阵列中的第一存储器单元进行编程的方法。 在具体实施例中,每个存储单元具有覆盖电荷存储材料和沟道的漏极,源极,沟道和控制栅极。 第一存储单元的源极耦合到第二存储单元的漏极。 电压施加到第一存储单元的漏极,并且第二存储单元的源极接地。 该方法包括使第二存储单元的漏极和第一存储单元的源极浮置,并且导通第一和第二存储单元的通道,从而有效地形成扩展通道区域。 将热载流子注入第一单元的电荷存储材料以对第一存储单元进行编程。 扩展通道降低电场,并减少未选择的存储单元中的冲击。
    • 5. 发明授权
    • Operation methods for memory cell and array for reducing punch through leakage
    • 用于减少穿孔渗漏的存储单元和阵列的操作方法
    • US07974127B2
    • 2011-07-05
    • US12264886
    • 2008-11-04
    • Lit-Ho ChongWen-Jer TsaiTien-Fan OuJyun-Siang Huang
    • Lit-Ho ChongWen-Jer TsaiTien-Fan OuJyun-Siang Huang
    • G11C11/34
    • G11C5/04G11C16/0416G11C16/10H01L27/11521H01L27/11568
    • A method for programming a first memory cell in a memory array. In a specific embodiment, each memory cell has a drain, a source, a channel, and a control gate overlying a charge storage material and the channel. The source of the first memory cell is coupled to the drain of a second memory cell. A voltage is applied to the drain of the first memory cell, and the source of the second memory cell is grounded. The method includes floating the drain of the second memory cell and the source of the first memory cell and turning on the channels of the first and second memory cells, effectively forming an extended channel region. Hot carriers are injected to the charge storage material of the first cell to program the first memory cell. The extended channel lowers electrical fields and reduces punch through leakage in unselected memory cells.
    • 一种用于对存储器阵列中的第一存储器单元进行编程的方法。 在具体实施例中,每个存储单元具有覆盖电荷存储材料和沟道的漏极,源极,沟道和控制栅极。 第一存储单元的源极耦合到第二存储单元的漏极。 电压施加到第一存储单元的漏极,并且第二存储单元的源极接地。 该方法包括使第二存储单元的漏极和第一存储单元的源极浮置,并且导通第一和第二存储单元的通道,从而有效地形成扩展通道区域。 将热载流子注入第一单元的电荷存储材料以对第一存储单元进行编程。 扩展通道降低电场,并减少未选择的存储单元中的冲击。
    • 6. 发明授权
    • Vertical non-volatile memory
    • 垂直非易失性存储器
    • US07795673B2
    • 2010-09-14
    • US11781423
    • 2007-07-23
    • Tien-Fan OuWen-Jer Tsai
    • Tien-Fan OuWen-Jer Tsai
    • H01L23/62
    • H01L27/115H01L27/11568H01L29/66833H01L29/792H01L29/7926
    • A manufacturing method of a vertical non-volatile memory is provided. A first semiconductor layer, a first barrier, a second semiconductor layer, a second barrier and a third semiconductor layer are formed on a substrate sequentially. The first and the third semiconductor layers have a first conductive state, while the second semiconductor layer has a second conductive state. Several strips of active stacked structures are formed by removing portions of the first, second and third semiconductor layers, and portions of the first and second barrier on the substrate. After forming a storage structure on the substrate, the storage structure is covered with a conductive layer filling spaces among the active stacked structures. A portion of the conductive layer is removed to form word lines across the active stacked structures.
    • 提供了垂直非易失性存储器的制造方法。 顺序地在基板上形成第一半导体层,第一势垒,第二半导体层,第二阻挡层和第三半导体层。 第一和第三半导体层具有第一导电状态,而第二半导体层具有第二导电状态。 通过去除第一,第二和第三半导体层的部分以及衬底上的第一和第二阻挡层的部分,形成多个有源堆叠结构的条带。 在基板上形成存储结构之后,在活性堆叠结构中用导电层填充空间覆盖存储结构。 去除导电层的一部分以形成穿过有源堆叠结构的字线。
    • 9. 发明申请
    • OPERATION METHODS FOR MEMORY CELL AND ARRAY FOR REDUCING PUNCH THROUGH LEAKAGE
    • 用于记忆细胞和阵列的操作方法,用于通过泄漏减少冲击
    • US20090116286A1
    • 2009-05-07
    • US12264886
    • 2008-11-04
    • Lit-Ho ChongWen-Jer TsaiTien-Fan OuJyun-Siang Huang
    • Lit-Ho ChongWen-Jer TsaiTien-Fan OuJyun-Siang Huang
    • G11C11/34
    • G11C5/04G11C16/0416G11C16/10H01L27/11521H01L27/11568
    • A method for programming a first memory cell in a memory array. In a specific embodiment, each memory cell has a drain, a source, a channel, and a control gate overlying a charge storage material and the channel. The source of the first memory cell is coupled to the drain of a second memory cell. A voltage is applied to the drain of the first memory cell, and the source of the second memory cell is grounded. The method includes floating the drain of the second memory cell and the source of the first memory cell and turning on the channels of the first and second memory cells, effectively forming an extended channel region. Hot carriers are injected to the charge storage material of the first cell to program the first memory cell. The extended channel lowers electrical fields and reduces punch through leakage in unselected memory cells.
    • 一种用于对存储器阵列中的第一存储器单元进行编程的方法。 在具体实施例中,每个存储单元具有覆盖电荷存储材料和沟道的漏极,源极,沟道和控制栅极。 第一存储单元的源极耦合到第二存储单元的漏极。 电压施加到第一存储单元的漏极,并且第二存储单元的源极接地。 该方法包括使第二存储器单元的漏极和第一存储单元的源极浮置并导通第一和第二存储单元的通道,从而有效地形成扩展通道区域。 将热载流子注入第一单元的电荷存储材料以对第一存储单元进行编程。 扩展通道降低电场,并减少未选择的存储单元中的冲击。