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    • 3. 发明授权
    • Archery target
    • 射箭目标
    • US4470603A
    • 1984-09-11
    • US477757
    • 1983-03-22
    • David R. Myers
    • David R. Myers
    • F41J3/00F41J7/04
    • F41J3/0004F41J7/04
    • A silhouette archery target includes one or more support legs which are supportably received in respective support holes in a base member. The legs and holes are cross-sectionally configured to preclude rotation of the leg in the hole. A rear pivot block is secured to the leg at the base member top surface and has a rearward bottom edge which is located below the center of gravity of the target and serves as a target pivot axis. The forward-facing side of the leg is cut away from just below the top surface of the base member in a manner which permits backward rotation of the target and leg out of the support hole and about the target pivot axis. By selecting the front-to-back depth dimension of the pivot block, one can select the required impact force which causes the target to rotate out of the support hole and topple over. A forward bias block is secured to the leg at the base member top surface to prevent wind directed at the back of the target from toppling the target out of the base member. The blocks may be magnetically or otherwise secured to the leg to permit interchange of different sized blocks and thereby adjust the sensitivity of the target to both arrow impact and wind.
    • 剪影射箭靶包括一个或多个支撑腿,其可支撑地容纳在基座构件中的相应支撑孔中。 腿和孔的横截面构造以防止腿在孔中的旋转。 后枢转块在基部构件顶表面处固定到腿部,并且具有位于靶的重心下方并用作目标枢转轴线的后底边缘。 腿部的前向侧以允许目标和腿部从支撑孔和关于目标枢转轴线向后旋转的方式从基部构件的顶表面的正下方切割。 通过选择枢轴块的前后深度尺寸,可以选择所需的冲击力,使冲击力使目标从支撑孔旋出并倾倒。 正向偏置块在基部构件顶表面处固定到腿部,以防止指向目标物后部的风将目标物从基部构件翻倒。 块可以磁性地或以其他方式固定到腿部,以允许不同大小的块的交换,从而调整目标对箭头冲击和风的敏感性。
    • 4. 发明授权
    • Carrier-lifetime-controlled selective etching process for semiconductors
using photochemical etching
    • 使用光化学蚀刻的半导体的载流子寿命控制选择性蚀刻工艺
    • US5092957A
    • 1992-03-03
    • US441025
    • 1989-11-24
    • Carol I. H. AshbyDavid R. Myers
    • Carol I. H. AshbyDavid R. Myers
    • H01L21/306H01L21/3065H01L21/465
    • H01L21/30604H01L21/30612H01L21/30621H01L21/3065H01L21/465
    • The minority carrier lifetime is significantly much shorter in semiconductor materials with very high impurity concentrations than it is in semiconductor materials with lower impurity concentration levels. This phenomenon of reduced minority carrier lifetime in semiconductor materials having high impurity concentration is utilized to advantage for permitting highly selective semiconductor material etching to be achieved using a carrier-driven photochemical etching reaction. Various means may be employed for increasing the local impurity concentration level in specific near-surface regions of a semiconductor prior to subjecting the semiconductor material to a carrier-driven photochemical etching reaction. The regions having the localized increased impurity concentration form a self-aligned mask inhibiting photochemical etching at such localized regions while the adjacent regions not having increased impurity concentrations are selectively photochemically etched. Liquid- or gas-phase etching may be performed.
    • 与具有较低杂质浓度水平的半导体材料相比,杂质浓度非常高的半导体材料的少数载流子寿命明显短得多。 利用具有高杂质浓度的半导体材料中的少数载流子寿命降低的现象被用于允许使用载流子驱动的光化学蚀刻反应来实现高选择性半导体材料蚀刻。 在半导体材料进行载流子驱动的光化学蚀刻反应之前,可以采用各种方法来增加半导体的特定近表面区域中的局部杂质浓度水平。 具有局部增加的杂质浓度的区域形成抑制这种局部区域的光化学蚀刻的自对准掩模,而不增加杂质浓度的相邻区域被选择性光刻蚀刻。 可以进行液相或气相蚀刻。