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    • 3. 发明授权
    • Method for fabricating a semiconductor element from a dispersion of semiconductor particles
    • 从半导体粒子的分散体制造半导体元件的方法
    • US07517719B2
    • 2009-04-14
    • US11125138
    • 2005-05-10
    • Thomas KuglerChristopher NewsomeDavid RusselShunpu Li
    • Thomas KuglerChristopher NewsomeDavid RusselShunpu Li
    • H01L51/40
    • H01L21/02568H01L21/0256H01L21/02576H01L21/02579H01L21/02601H01L21/02628H01L51/0003H01L51/0037H01L51/0053H01L51/007H01L51/0545
    • Provided is a method for forming a semiconductor element such as film. The method comprises the steps of: (i) depositing a suspension of particles of a first semiconductor and a solution of a second semiconductor or a precursor thereof on a surface of a substrate such that a mixture comprising the particles of the first semiconductor suspended in a liquid phase comprising the second semiconductor or precursor thereof results thereon; and (ii) solidifying the mixture to form the semiconductor element comprising particles of the first semiconductor in a matrix of the second semiconductor which electrically connects adjacent particles of the first semiconductor, the first and second semiconductors being of the same conductivity type and being formed from either the same or different materials. The method does not require any step of vacuum deposition or sintering.Also provided is a semiconductor element itself. The element comprises semiconductor particles in a matrix of a semiconductor binder that has the same conductivity type as the semiconductor particles and which is the same or a different material than that forming the particles, the semiconductor binder electrically connecting adjacent semiconductor particles.
    • 提供了一种形成诸如膜的半导体元件的方法。 该方法包括以下步骤:(i)将第一半导体和第二半导体或其前体的溶液的悬浮液沉积在基板的表面上,使得包含悬浮在基板中的第一半导体颗粒的混合物 在其上产生包含第二半导体或其前体的液相; 和(ii)固化所述混合物以形成所述半导体元件,所述半导体元件包括所述第二半导体的矩阵中的所述第一半导体的粒子,所述第二半导体的矩阵电连接所述第一半导体的相邻颗粒,所述第一和第二半导体具有相同的导电类型,并且由 相同或不同的材料。 该方法不需要真空沉积或烧结的任何步骤。 还提供了半导体元件本身。 该元件包括半导体粘合剂的基质中的半导体颗粒,其具有与半导体颗粒相同的导电类型,并且与形成颗粒的材料相同或不同,所述半导体粘结剂将相邻的半导体颗粒电连接。
    • 7. 发明申请
    • Self-aligning patterning method
    • 自对准图案化方法
    • US20060128076A1
    • 2006-06-15
    • US11253756
    • 2005-10-20
    • Shunpu LiThomas KuglerChristopher NewsomeDavid Russell
    • Shunpu LiThomas KuglerChristopher NewsomeDavid Russell
    • H01L21/461
    • H01L51/105H01L21/823456H01L27/1292H01L27/285H01L51/0037H01L51/0516H01L51/0545
    • The present invention relates to a self-aligning patterning method which can be used to manufacture a plurality of multi-layer thin film transistors on a substrate. The method comprises firstly forming a patterned mask 20 on the surface of a sacrificial layer 18 which is part of a multi-layer structure 10 which comprises the substrate 12, a conductive layer 14, an insulating layer 16 and the sacrificial layer 18. Unpatterned areas are then etched to remove the corresponding areas of the sacrificial layer, the insulating layer 16 and the conductive layer 14 thereby leaving voids. A layer of dielectric 22 is then deposited over the etched multi-layer structure to at least substantially fill the voids. The deposited dielectric is then etched in order to at least partially expose the sides of the remaining areas 28 of the sacrificial layer. Conductive material 30 is then deposited on the surface of the etched dielectric. Finally, the remaining areas 28 of the sacrificial layer are removed together with any overlying material. The resulting plurality of multi-layer thin film transistors is preferably in the form of an array which may in turn be formed into a display device by coupling each transistor in the array to a light-emitting cell.
    • 本发明涉及可用于在基板上制造多个多层薄膜晶体管的自对准图案化方法。 该方法包括首先在牺牲层18的表面上形成图案化掩模20,牺牲层18是多层结构10的一部分,其包括基底12,导电层14,绝缘层16和牺牲层18.未图案化的区域 然后蚀刻以除去牺牲层,绝缘层16和导电层14的相应区域,从而留下空隙。 然后将一层电介质22沉积在蚀刻的多层结构上以至少基本上填充空隙。 然后蚀刻沉积的电介质以便至少部分地暴露牺牲层的剩余区域28的侧面。 然后将导电材料30沉积在蚀刻的电介质的表面上。 最后,牺牲层的剩余区域28与任何上覆材料一起被去除。 所得到的多个多层薄膜晶体管优选地是阵列的形式,其可以通过将阵列中的每个晶体管耦合到发光单元而依次形成为显示装置。
    • 9. 发明授权
    • Method of fabricating a heterojunction of organic semiconducting polymers
    • 制备有机半导体聚合物异质结的方法
    • US07468287B2
    • 2008-12-23
    • US11363063
    • 2006-02-28
    • Christopher NewsomeThomas KuglerShunpu LiDavid Russell
    • Christopher NewsomeThomas KuglerShunpu LiDavid Russell
    • H01L21/00
    • H01L51/0005H01L51/0007H01L51/424Y02E10/549
    • Provided is a method of forming a heterojunction of contiguous layers of organic semiconducting polymers. The method comprises firstly forming a layer of a first organic semiconducting polymer on a substrate. A solution of a film-forming material is then deposited on the layer of the first organic semiconducting polymer. The first organic semiconducting polymer is insoluble in this solution and so is not disturbed by its deposition. The deposited solution is then dried to form a temporary film having a thickness of less then 20 nm formed from the film-forming material. Next a solution of a second organic semiconducting polymer dissolved in an organic solvent is deposited on the temporary film and this solution dried. The solubility of the material forming the temporary film in the organic solvent and the thickness of the temporary film are such that the organic solvent permeates through the thickness of the temporary film during drying of the solution of the second organic semiconducting polymer. This causes the temporary film to break down but without disturbing the layer of the first organic semiconducting polymer so that the layer of the second organic semiconducting polymer is formed contiguously on the layer of the first organic semiconducting polymer.
    • 提供了形成有机半导体聚合物的连续层的异质结的方法。 该方法包括首先在衬底上形成第一有机半导体聚合物层。 然后将成膜材料的溶液沉积在第一有机半导体聚合物的层上。 第一种有机半导体聚合物不溶于该溶液,因此不会因其沉积而受到干扰。 然后将沉积的溶液干燥以形成由成膜材料形成的厚度小于20nm的临时膜。 接下来,将溶解在有机溶剂中的第二有机半导体聚合物的溶液沉积在临时膜上,并将该溶液干燥。 形成临时膜的材料在有机溶剂中的溶解度和临时膜的厚度使得有机溶剂在第二有机半导体聚合物的溶液的干燥期间渗透临时膜的厚度。 这导致临时膜破裂但不干扰第一有机半导体聚合物的层,使得第二有机半导体聚合物的层在第一有机半导体聚合物的层上连续形成。