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    • 5. 发明授权
    • Heat dissipation device retention assembly
    • 散热器保持组件
    • US06538889B1
    • 2003-03-25
    • US09981146
    • 2001-10-16
    • Stephan Karl BarsunJeremy Ian WilsonThomas J. Augustin
    • Stephan Karl BarsunJeremy Ian WilsonThomas J. Augustin
    • H05K720
    • H05K7/209H01L21/4871
    • A method and apparatus to encourage correct operator assembly and disassembly of a component in a socket, and the component has a heat dissipation device attached to a substrate. A first embodiment of the invention involves a method to assemble a component and a heat dissipation device to a socket on a substrate using a retention assembly. A second embodiment of the invention involves a method to disassemble a component and a heat dissipation device from a socket on a substrate using a retention assembly. A third embodiment of the invention involves an assembled substrate with a retention assembly to limit operator ability to open and close a socket holding a component, relative to the engagement and disengagement of the retention assembly attached to the component.
    • 一种鼓励正确的操作者组装和拆卸插座中的部件的方法和装置,并且该部件具有连接到基板上的散热装置。 本发明的第一实施例涉及使用保持组件将部件和散热装置组装到基板上的插座上的方法。 本发明的第二实施例涉及一种使用保持组件从基板上的插座拆卸部件和散热装置的方法。 本发明的第三实施例涉及具有保持组件的组装的基板,以限制操作者相对于附接到部件的保持组件的接合和分离来打开和闭合保持部件的插座的能力。
    • 8. 发明申请
    • Multistage mounting printed circuit board system and method
    • 多级安装印刷电路板系统及方法
    • US20050157481A1
    • 2005-07-21
    • US10758982
    • 2004-01-16
    • Stephan Karl BarsunRobert William Dobbs
    • Stephan Karl BarsunRobert William Dobbs
    • H05K7/02H05K7/04H05K7/14
    • H05K7/142H05K7/1409
    • A multi stage mounting printed circuit board system and method is presented. In one embodiment, a multi stage mounting printed circuit board system includes a first printed circuit board for mounting electrical components on. A first printed circuit board interface component is coupled to the first printed circuit board. The first printed circuit board interface component communicatively couples the first printed board to a second printed board via a second printed circuit board interface component. A plurality of printed circuit board extractors are coupled to the first printed circuit board. The plurality of printed circuit board extractors couple the first printed circuit board to card guides (e.g., a single pair of card guides in which the second printed circuit board is mounted).
    • 提出了一种多级安装印刷电路板系统和方法。 在一个实施例中,多级安装印刷电路板系统包括用于将电气部件安装在其上的第一印刷电路板。 第一印刷电路板接口部件耦合到第一印刷电路板。 第一印刷电路板接口组件经由第二印刷电路板接口部件将第一印刷电路板通信地耦合到第二印刷电路板。 多个印刷电路板提取器耦合到第一印刷电路板。 多个印刷电路板提取器将第一印刷电路板耦合到卡引导件(例如,安装第二印刷电路板的单对卡引导件)。