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1. 发明申请

US20080246105A1 Detector System and Detector Subassembly 有权
标题翻译：检测器系统和检测器子组件
公开(公告)号：US20080246105A1
公开(公告)日：2008-10-09
申请号：US12064759
申请日：2006-08-17
申请人： Thomas Hofer , Werner Kuhlmann
发明人： Thomas Hofer , Werner Kuhlmann
IPC分类号： H01L31/00 , H01L23/52
CPC分类号： H01L31/02162 , B82Y20/00 , H01L24/48 , H01L24/49 , H01L24/73 , H01L27/14618 , H01L31/035236 , H01L31/105 , H01L2224/29339 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49171 , H01L2224/73265 , H01L2224/83851 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A detector system (100) with a microelectronic semiconductor chip (20) and a separate optoelectronic detector chip (10) is specified, wherein the detector chip is positioned on the semiconductor chip. A detector subassembly with such a detector system is also specified.
摘要翻译：具有微电子半导体芯片（20）和独立光电检测器芯片（10）的检测器系统（100）被规定，其中检测器芯片位于半导体芯片上。还规定了具有这种检测器系统的检测器子组件。

2. 发明授权

US08030685B2 Detector system and detector subassembly 有权
标题翻译：检测器系统和检测器组件
公开(公告)号：US08030685B2
公开(公告)日：2011-10-04
申请号：US12064759
申请日：2006-08-17
申请人： Thomas Hofer , Werner Kuhlmann
发明人： Thomas Hofer , Werner Kuhlmann
IPC分类号： H01L31/102
CPC分类号： H01L31/02162 , B82Y20/00 , H01L24/48 , H01L24/49 , H01L24/73 , H01L27/14618 , H01L31/035236 , H01L31/105 , H01L2224/29339 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49171 , H01L2224/73265 , H01L2224/83851 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A detector system with a microelectronic semiconductor chip and a separate optoelectronic detector chip is specified, wherein the detector chip is positioned on the semiconductor chip. A detector subassembly with such a detector system is also specified.
摘要翻译：规定了具有微电子半导体芯片和单独的光电检测器芯片的检测器系统，其中检测器芯片位于半导体芯片上。还规定了具有这种检测器系统的检测器子组件。

3. 发明申请

US20100097609A1 Radiation Detector 有权
标题翻译：辐射检测器
公开(公告)号：US20100097609A1
公开(公告)日：2010-04-22
申请号：US12516831
申请日：2007-11-29
申请人： Arndt Jaeger , Peter Stauss , Klaus Streubel , Werner Kuhlmann
发明人： Arndt Jaeger , Peter Stauss , Klaus Streubel , Werner Kuhlmann
IPC分类号： G01J3/50
CPC分类号： G01J1/4228 , G01J1/0488 , G01J3/36 , G01J3/46 , G01J3/465 , G01J3/50 , G01J3/51 , G01J3/513 , G01J2003/507 , H01L31/105
摘要： A radiation detector is disclosed with a detector arrangement, which has a plurality of detector elements, by means of which a detector signal is obtained during operation of the radiation detector, and with a control device, wherein the detector elements each have a spectral sensitivity distribution, and are suited for generating signals. At least one detector element includes a compound semiconductor material, and this detector element is designed for detecting radiation in the visible spectral region. The radiation detector is designed such that the sensitivity distributions of the detector elements are used to form different spectral sensitivity channels of the radiation detector. A channel signal assigned to the respective sensitivity channel can be generated in these sensitivity channels using the detector elements, and the control device is designed such that the contributions of different channel signals to the detector signal of the radiation detector are differently controlled.
摘要翻译：公开了一种具有检测器装置的检测器装置，其具有多个检测器元件，通过该检测器元件在放射线检测器的操作期间获得检测器信号，并且具有控制装置，其中检测器元件各自具有光谱灵敏度分布，并且适于产生信号。至少一个检测器元件包括化合物半导体材料，并且该检测器元件被设计用于检测可见光谱区域中的辐射。辐射检测器被设计成使得检测器元件的灵敏度分布用于形成辐射检测器的不同光谱灵敏度通道。可以使用检测器元件在这些灵敏度通道中产生分配给相应灵敏度通道的通道信号，并且控制装置被设计成使得不同通道信号对辐射检测器的检测器信号的贡献被不同地控制。

4. 发明授权

US07582909B2 Mounting and adhesive layer for semiconductor components 有权
标题翻译：用于半导体元件的安装和粘合层
公开(公告)号：US07582909B2
公开(公告)日：2009-09-01
申请号：US11450902
申请日：2006-06-09
申请人： Melanie Ring , Benjamin Prodinger , Werner Kuhlmann
发明人： Melanie Ring , Benjamin Prodinger , Werner Kuhlmann
IPC分类号： H01L27/15 , H01L31/12 , H01L33/00
CPC分类号： H01L23/485 , H01L23/147 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/83 , H01L33/62 , H01L2224/2919 , H01L2224/45124 , H01L2224/48091 , H01L2224/73265 , H01L2224/83801 , H01L2224/8389 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01032 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/0665 , H01L2924/07811 , H01L2924/12041 , H01L2924/12043 , H01L2924/3025 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： An assembly and adhesive layer for semiconductor components is arranged between a silicon support (submount) and an electronic functional element for the formation of an electrically-conducting connection between the silicon support and the functional element. The assembly and adhesive layer are arranged on the support. The assembly and adhesive layer are made from a Ti/TiN layer (6), applied to an aluminum contact surface (5) of the silicon support (1), by means of a deposition method. The aluminum contact surface (5) is located on a landing pad (2) on the silicon support (1).
摘要翻译：用于半导体部件的组装和粘合剂层被布置在硅支撑件（基座）和用于在硅支撑件和功能元件之间形成导电连接的电子功能元件之间。组件和粘合剂层布置在支撑件上。组装和粘合层由通过沉积方法施加到硅载体（1）的铝接触表面（5）上的Ti / TiN层（6）制成。铝接触表面（5）位于硅支撑件（1）上的定位垫（2）上。

5. 发明授权

US5990499A Integrated semiconductor circuit 有权
标题翻译：集成半导体电路
公开(公告)号：US5990499A
公开(公告)日：1999-11-23
申请号：US163599
申请日：1998-09-28
申请人： Werner Kuhlmann , Norbert Stath , Hans-Ludwig Althaus , Werner Spath
发明人： Werner Kuhlmann , Norbert Stath , Hans-Ludwig Althaus , Werner Spath
IPC分类号： H01L33/64 , H01S5/00 , H01S5/026 , H01L33/00
CPC分类号： H01L33/641 , H01L25/167 , H01L2224/48464
摘要： An integrated semiconductor circuit has a component formed of a semiconductor substrate with an active pn junction formed between a first semiconductor region of a first conductivity type and a second semiconductor region of a second conductivity type. The semiconductor circuit also has a protective circuit that is associated with the component and serves to dissipate overvoltages and/or electrostatic charges. The protective circuit has a protective pn junction formed in a semiconductor mount with a first semiconductor mount region of the first conductivity type and a second semiconductor mount region of the second conductivity type. The second semiconductor mount region of the second conductivity type is electrically coupled to the first semiconductor region formed in the semiconductor substrate of the first conductivity type.
摘要翻译：集成半导体电路具有由在第一导电类型的第一半导体区域和第二导电类型的第二半导体区域之间形成的具有活性pn结的半导体衬底形成的部件。半导体电路还具有与部件相关联的保护电路，并用于消除过电压和/或静电电荷。保护电路具有形成在具有第一导电类型的第一半导体安装区域和第二导电类型的第二半导体安装区域的半导体安装件中的保护性pn结。第二导电类型的第二半导体安装区域电耦合到形成在第一导电类型的半导体衬底中的第一半导体区域。

6. 发明授权

US5498546A Washing process 失效
标题翻译：洗涤过程
公开(公告)号：US5498546A
公开(公告)日：1996-03-12
申请号：US392757
申请日：1995-02-24
申请人： Werner Kuhlmann , Hans-Willi Kling
发明人： Werner Kuhlmann , Hans-Willi Kling
IPC分类号： G01N31/00 , D06F35/00 , D06L1/12 , G01N31/22 , G01N1/00 , G01N33/00 , G01N35/08
CPC分类号： G01N31/22 , Y10T436/117497 , Y10T436/12 , Y10T436/25125
摘要： A process for determining the concentration of washing-active substances in a wash liquor involving the steps of:(a) preparing a wash liquor containing washing-active substances;(b) adding a reducing sugar to the wash liquor in an amount proportional to the washing-active substances present in the wash liquor; and(c) measuring the content of reducing sugar present in the wash liquor.
摘要翻译： PCT No.PCT / EP93 / 02170 371日期：1995年2月24日 102（e）1995年2月24日PCT PCT 1993年8月16日PCT公布。第WO94 / 04741号公报 1。一种确定洗涤液中洗涤活性物质浓度的方法，包括以下步骤：（a）制备含有洗涤活性物质的洗涤液; （b）以与洗涤液中存在的洗涤活性物质成比例的量向洗涤液中加入还原糖; 和（c）测量洗涤液中存在的还原糖的含量。

7. 发明授权

US4875750A Optoelectronic coupling element and method for its manufacture 失效
标题翻译：光电耦合元件及其制造方法
公开(公告)号：US4875750A
公开(公告)日：1989-10-24
申请号：US151372
申请日：1988-02-02
申请人： Werner Spaeth , Guenther Waitl , Werner Kuhlmann , Hans-Ludwig Althaus , Rolf Birkmann , Waltraud Klos , Axel Schubert
发明人： Werner Spaeth , Guenther Waitl , Werner Kuhlmann , Hans-Ludwig Althaus , Rolf Birkmann , Waltraud Klos , Axel Schubert
IPC分类号： G02B6/32 , G02B6/36 , G02B6/42
CPC分类号： G02B6/4249 , G02B6/4204
摘要： An optoelectronic coupling element and method for manufacturing the coupling element. The coupling element includes a light wave guide, a microlens, a first carrier chip and a light emitting and/or light detecting semiconductor element. The microlens is preferably spherical in shape and is adapted for optically coupling the light wave guide and the semiconductor element. The semiconductor element can be part of the first carrier chip or, according to another embodiment, can be part of a second carrier chip. The purpose of this coupling element is to facilitate the precise mounting of the microlens in a position between the light wave guide and the semiconductor element and also facilitate the adjustment of the microlens to optimally perform its light coupling function. The method for manufacturing the coupling element provides for the formation of a receptacle having trapezoidal shape sides in the carrier chip. The microlens is mounted within the receptacle with a connecting medium such as glass. The size of the receptacle is determined by the size of the microlens and the point of contact between the microlens and carrier. Applications of the optoelectronic coupling element according to the invention are, in particular, in LED transmitter structural elements, receiver structural elements and laser modules. This method of production substantially avoids impairment of the carrier chip due to effects such as mechanical deformation. Additionally, this type of coupling element can be mass-produced cost-effectively in spite of the miniature size of these components.
摘要翻译：一种用于制造耦合元件的光电耦合元件和方法。耦合元件包括光波导，微透镜，第一载体芯片和发光和/或光检测半导体元件。微透镜的形状优选为球形，并且适于光学耦合光波导和半导体元件。半导体元件可以是第一载体芯片的一部分，或者根据另一实施例，半导体元件可以是第二载体芯片的一部分。该耦合元件的目的是便于将微透镜精确地安装在光波导和半导体元件之间的位置，并且还便于微透镜的调节以最佳地执行其光耦合功能。用于制造耦合元件的方法提供了在载体芯片中形成具有梯形形状侧面的插座。微透镜用诸如玻璃的连接介质安装在容器内。容器的尺寸由微透镜的尺寸和微透镜与载体之间的接触点决定。根据本发明的光电耦合元件的应用尤其在LED发射机结构元件，接收器结构元件和激光模块中。这种生产方法基本上避免了由于诸如机械变形的影响而导致的载体芯片的损伤。另外，尽管这些部件的尺寸很小，但是这种类型的联接元件可以经济高效地批量生产。

8. 发明授权

US07332725B2 Sensor arrangement for recording a radiation, computer tomograph comprising said sensor arrangement and corresponding production method 有权
标题翻译：用于记录辐射的传感器布置，包括所述传感器装置的计算机断层摄影机和相应的生产方法
公开(公告)号：US07332725B2
公开(公告)日：2008-02-19
申请号：US10525649
申请日：2003-08-08
申请人： Werner Kuhlmann
发明人： Werner Kuhlmann
IPC分类号： G01T1/24
CPC分类号： H01L31/02322 , H01L27/14658 , H01L31/022408
摘要： A sensor arrangement has a layer sequence that includes a holding substrate, an auxiliary layer, a detection layer and an insulating layer. The holding substrate holds detection elements. The auxiliary layer extends continuously over the detection elements or contains separate regions which are associated with a detection element. The detection layer has separate detection regions which are contained in a detection element and contain at least one semiconductor component which is sensitive to radiation. The insulating layer has separate insulating regions for electrically insulating the detection regions from a point of contact having electrically conductive connections and pads fitted on the free side. The pads are electrically connected to connecting points which are routed to the semiconductor components. This sensor arrangement can be used for detecting X-ray radiation and can be manufactured with particular ease.
摘要翻译：传感器装置具有包括保持基板，辅助层，检测层和绝缘层的层序列。保持基板保持检测元件。辅助层在检测元件上连续延伸，或者包含与检测元件相关联的分开的区域。检测层具有分离的检测区域，其包含在检测元件中并且包含至少一个对辐射敏感的半导体部件。绝缘层具有分离的绝缘区域，用于将检测区域与具有安装在自由侧上的导电连接和焊盘的接触点电绝缘。焊盘电连接到连接到半导体部件的连接点。该传感器装置可用于检测X射线辐射，并且可以特别容易地制造。

9. 发明授权

US06499846B1 Projection system with projector and deflection mirror 失效
标题翻译：带投影仪和偏转镜的投影系统
公开(公告)号：US06499846B1
公开(公告)日：2002-12-31
申请号：US09582814
申请日：2000-06-30
申请人： Klaus Hiller , Werner Kuhlmann , Roland Buerdorff
发明人： Klaus Hiller , Werner Kuhlmann , Roland Buerdorff
IPC分类号： G03B2128
CPC分类号： G09B27/02
摘要： In a projection arrangement with a projector and a deflecting mirror in which the image projection, proceeding from a projection direction along a principal projection axis impinges on the deflecting mirror which is supported so as to be movable in two spatial direction and whose mirror surface deflects a projected light bundle at an elevation angle and at an azimuth angle onto a projection surface standing on the ground the image projection is effected from the direction of a zenith at an angle &bgr; which is less than 60° in relation to a vertical line from the zenith and the deflecting mirror is arranged at the ground wherein the projected light bundle can be deflected toward the projection surface so that an image can be generated on the projection surface and moved on the latter.
摘要翻译：在具有投影仪和偏转镜的投影装置中，沿着主投影轴从投影方向进行的图像投影照射在被支撑为可在两个空间方向上移动并且其镜面偏转的偏转镜以仰角和方位角的投射光束到位于地面上的投影表面上，图像投影从天顶方向以相对于距离天顶的垂直线小于60°的角度β进行并且偏转镜布置在地面处，其中投射的光束可以朝向投影表面偏转，使得可以在投影表面上产生图像并且在投影表面上移动图像。

10. 发明授权

US5654559A Optical coupling device and method for manufacturing the same 失效
标题翻译：光耦合装置及其制造方法
公开(公告)号：US5654559A
公开(公告)日：1997-08-05
申请号：US637581
申请日：1996-04-25
申请人： Werner Spaeth , Norbert Stath , Ernst Nirschl , Walter Wegleiter , Werner Kuhlmann , Rudolf Buchberger
发明人： Werner Spaeth , Norbert Stath , Ernst Nirschl , Walter Wegleiter , Werner Kuhlmann , Rudolf Buchberger
IPC分类号： H01L23/48 , H01L25/065 , H01L31/173 , H01L31/167
CPC分类号： H01L23/48 , H01L31/173 , H01L2224/48463
摘要： An optical coupling device and method for manufacturing the same is disclosed wherein a light-emitting semiconductor transmitter chip is secured to a light-detecting semiconductor receiver chip via a transparent insulating layer, a structured spacer layer and a transparent connecting layer. The resultant optocoupler has a high coupling factor and may be reliably manufactured into SMT compatible packages.
摘要翻译：公开了一种光耦合器件及其制造方法，其中通过透明绝缘层，结构化间隔层和透明连接层将发光半导体发射器芯片固定到光检测半导体接收器芯片。所得的光耦合器具有高耦合系数，并且可以可靠地制造成与SMT兼容的封装。

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