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1. 发明授权

US08484761B2 Method for cost-efficient manufacturing diamond tips for ultra-high resolution electrical measurements and devices obtained thereof 有权
标题翻译：用于超高分辨率电气测量的成本有效的制造金刚石尖端的方法及其获得的装置
公开(公告)号：US08484761B2
公开(公告)日：2013-07-09
申请号：US12483160
申请日：2009-06-11
申请人： Thomas Hantschel , Wilfried Vandervorst , Kai Arstila
发明人： Thomas Hantschel , Wilfried Vandervorst , Kai Arstila
IPC分类号： G01Q70/14
CPC分类号： G01Q60/40 , G01Q60/30 , G01Q70/10 , G01Q70/14 , G01Q70/16
摘要： An atomic force microscopy probe configuration and a method for manufacturing the same are disclosed. In one aspect, the probe configuration includes a cantilever, and a planar tip attached to the cantilever. The cantilever only partially overlaps the planar tip, and extends along a longitudinal direction thereof. The planar tip is of a two-dimensional geometry having at least one corner remote from the cantilever, which corner during use contacts a surface to be scanned.
摘要翻译：公开了一种原子力显微镜探针结构及其制造方法。在一个方面，探针配置包括悬臂和连接到悬臂的平面末端。悬臂仅部分地与平坦的尖端重叠，并且沿其纵向方向延伸。平面尖端是具有远离悬臂的至少一个角的二维几何形状，在使用过程中，该角接触待扫描的表面。

2. 发明申请

US20090313730A1 METHOD FOR COST-EFFICIENT MANUFACTURING DIAMOND TIPS FOR ULTRA-HIGH RESOLUTION ELECTRICAL MEASUREMENTS AND DEVICES OBTAINED THEREOF 有权
标题翻译：用于超高分辨率电气测量的成本有效的制造金刚石提示的方法及其获得的装置
公开(公告)号：US20090313730A1
公开(公告)日：2009-12-17
申请号：US12483160
申请日：2009-06-11
申请人： Thomas Hantschel , Wilfried Vandervorst , Kai Arstila
发明人： Thomas Hantschel , Wilfried Vandervorst , Kai Arstila
IPC分类号： G12B21/08
CPC分类号： G01Q60/40 , G01Q60/30 , G01Q70/10 , G01Q70/14 , G01Q70/16
摘要： An atomic force microscopy probe configuration and a method for manufacturing the same are disclosed. In one aspect, the probe configuration includes a cantilever, and a planar tip attached to the cantilever. The cantilever only partially overlaps the planar tip, and extends along a longitudinal direction thereof. The planar tip is of a two-dimensional geometry having at least one corner remote from the cantilever, which corner during use contacts a surface to be scanned.
摘要翻译：公开了一种原子力显微镜探针结构及其制造方法。在一个方面，探针配置包括悬臂和连接到悬臂的平面末端。悬臂仅部分地与平坦的尖端重叠，并且沿其纵向方向延伸。平面尖端是具有远离悬臂的至少一个角的二维几何形状，在使用过程中，该角接触待扫描的表面。

3. 发明授权

US06504152B2 Probe tip configuration and a method of fabrication thereof 有权
标题翻译：探针尖端配置及其制造方法
公开(公告)号：US06504152B2
公开(公告)日：2003-01-07
申请号：US10005446
申请日：2001-12-03
申请人： Thomas Hantschel , Wilfried Vandervorst
发明人： Thomas Hantschel , Wilfried Vandervorst
IPC分类号： G01N2300
CPC分类号： G01Q70/16 , G01Q70/10 , Y10S977/874
摘要： A probe tip configuration, being part of a probe (FIG. 2) for use in a scanning proximity microscope, is disclosed, comprising a cantilever beam (1) and a probe tip. Said tip comprises a first portion of a tip (2) and at least one second portion of a tip (5). Said first portion of a tip is connected to said cantilever beam whereas said second portion of a tip is placed on said first portion of a tip. Cantilever beam, first portion of a tip and second portion(s) of a tip can be composed of different materials and can be isolated each from another which makes an easy adjustment of the maximum penetration depth of the tip possible without limiting the resolution and makes it also possible to detect more than one signal of a sample at the same time using one cantilever beam. Methods of making the probe tip configuration are further described.
摘要翻译：公开了一种探针尖端配置，其是用于扫描接近显微镜的探针（图2）的一部分，其包括悬臂梁（1）和探针尖端。所述尖端包括尖端（2）的第一部分和尖端（5）的至少一个第二部分。尖端的所述第一部分连接到所述悬臂梁，而尖端的第二部分被放置在尖端的所述第一部分上。悬臂梁，尖端的第一部分和尖端的第二部分可以由不同的材料组成，并且可以彼此隔离，这使得能够容易地调整尖端的最大穿透深度而不限制分辨率，并且使得也可以使用一个悬臂梁同时检测样本的多于一个信号。进一步描述制造探针尖端配置的方法。

4. 发明授权

US06690008B2 Probe and method of manufacturing mounted AFM probes 有权
标题翻译：制造安装的AFM探头的探头和方法
公开(公告)号：US06690008B2
公开(公告)日：2004-02-10
申请号：US09954681
申请日：2001-09-14
申请人： Thomas Hantschel , Wilfried Vandervorst
发明人： Thomas Hantschel , Wilfried Vandervorst
IPC分类号： H01J3726
CPC分类号： G01Q60/40 , G01Q60/34 , G01Q60/38 , Y10S977/873
摘要： An atomic force microscopy (AFM) probe and a method of manufacturing mounted probes for AFM applications. The method implements an optimized soldering procedure for mounting a probe to a holder chip. In one embodiment, a metallisation system of Ti:W+Ni+Au is applied with a SnBi58 solder paste in combination with a hotplate. The mechanical connection between the probe and holder chip is preferably rigid. The soldered probe is highly conductive and the probe-holder chip assembly shows clear resonance peaks in tapping mode AFM.
摘要翻译：原子力显微镜（AFM）探针和制造用于AFM应用的安装探针的方法。该方法实现了将探头安装到保持器芯片的优化焊接程序。在一个实施例中，Ti：W + Ni + Au的金属化系统与SnBi58焊锡膏一起加热。探针和保持器芯片之间的机械连接优选是刚性的。焊接的探头是高导电性的，并且探头支架芯片组件在攻丝模式AFM中显示清晰的共振峰值。

5. 发明授权

US06328902B1 Probe tip configuration and a method of fabrication thereof 有权
标题翻译：探针尖端配置及其制造方法
公开(公告)号：US06328902B1
公开(公告)日：2001-12-11
申请号：US09134264
申请日：1998-08-14
申请人： Thomas Hantschel , Wilfried Vandervorst
发明人： Thomas Hantschel , Wilfried Vandervorst
IPC分类号： H01L21302
CPC分类号： G01Q70/16 , G01Q70/10 , Y10S977/874
摘要： A probe tip configuration, being part of a probe (FIG. 2) for use in a scanning proximity microscope, is disclosed, comprising a cantilever beam (1) and a probe tip. Said tip comprises a first portion of a tip (2) and at least one second portion of a tip (5). Said first portion of a tip is connected to said cantilever beam whereas said second portion of a tip is placed on said first portion of a tip. Cantilever beam, first portion of a tip and second portion(s) of a tip can be composed of different materials and can be isolated each from another which makes an easy adjustement of the maximum penetration depth of the tip possible without limiting the resolution and makes it also possible to detect more than one signal of a sample at the same time using one cantilever beam.
摘要翻译：公开了一种探针尖端配置，其是用于扫描接近显微镜的探针（图2）的一部分，其包括悬臂梁（1）和探针尖端。所述尖端包括尖端（2）的第一部分和尖端（5）的至少一个第二部分。尖端的所述第一部分连接到所述悬臂梁，而尖端的第二部分被放置在尖端的所述第一部分上。悬臂梁，尖端的第一部分和尖端的第二部分可以由不同的材料组成，并且可以彼此隔离，这使得可以容易地调整尖端的最大穿透深度而不限制分辨率，并且使得也可以使用一个悬臂梁同时检测样本的多于一个信号。

6. 发明授权

US06756584B2 Probe tip and method of manufacturing probe tips by peel-off 有权
标题翻译：探针尖端和通过剥离制造探针尖端的方法
公开(公告)号：US06756584B2
公开(公告)日：2004-06-29
申请号：US09955565
申请日：2001-09-12
申请人： Thomas Hantschel , Wilfried Vandervorst
发明人： Thomas Hantschel , Wilfried Vandervorst
IPC分类号： H01J516
CPC分类号： G01Q70/06 , G01Q70/16 , Y10S977/875
摘要： A full metal probe and a method of making the metal probe for electrical atomic force microscopy. In one embodiment, the method comprises manufacturing the full metal probe using two lithography steps. The step of etching thin membranes is dropped or eliminated to substantially reduce the processing time. Thus, topside processing is sufficient. The probe and tip can be peeled off from the wafer using a metallization procedure.
摘要翻译：全金属探针和制造电原子力显微镜金属探针的方法。在一个实施例中，该方法包括使用两个光刻步骤制造全金属探针。蚀刻薄膜的步骤被丢弃或消除，以显着减少处理时间。因此，上侧处理就足够了。探针和尖端可以使用金属化步骤从晶片剥离。

7. 发明授权

US6091248A Method for measuring the electrical potential in a semiconductor element 失效
标题翻译：用于测量半导体元件中的电位的方法
公开(公告)号：US6091248A
公开(公告)日：2000-07-18
申请号：US32906
申请日：1998-03-02
申请人： Louis C. Hellemans , Thomas Trenkler , Peter De Wolf , Wilfried Vandervorst
发明人： Louis C. Hellemans , Thomas Trenkler , Peter De Wolf , Wilfried Vandervorst
IPC分类号： G01Q70/14 , G01R1/067 , G01R31/26 , G01R31/28 , H01L21/66 , G01K31/26 , H01J37/26
CPC分类号： G01R31/2648 , G01Q60/30 , G01R1/06711 , G01R31/2831 , H01L22/14 , H01L2924/0002 , H01L2924/014 , Y10S977/854
摘要： Measuring an electrical potential in a semiconductor element by applying one or more voltages over the semiconductor element, placing at least one conductor in contact with the semi-conductor element using a scanning proximity microscope while injecting a substantially zero current in the semiconductor element with the conductor, measuring an electrical potential in the conductor while injecting a substantially zero current in the semiconductor element with the conductor, changing the position of the conductor, and repeating the measuring and changing steps.
摘要翻译：通过在半导体元件上施加一个或多个电压来测量半导体元件中的电位，使用扫描接近显微镜将至少一个导体与半导体元件接触，同时在半导体元件中注入基本零电流的导体测量导体中的电位，同时在半导体元件中与导体注入大致零电流，改变导体的位置，并重复测量和改变步骤。

8. 发明授权

US5369372A Method for resistance measurements on a semiconductor element with controlled probe pressure 失效
标题翻译：具有受控探针压力的半导体元件上的电阻测量方法
公开(公告)号：US5369372A
公开(公告)日：1994-11-29
申请号：US838419
申请日：1992-03-09
申请人： Wilfried Vandervorst , Marc Meuris
发明人： Wilfried Vandervorst , Marc Meuris
IPC分类号： G01Q60/16 , G01R27/00 , G01R27/20 , G01R31/26 , G01R27/08
CPC分类号： B82Y35/00 , G01R27/00 , G01R27/205 , G01R31/2648 , Y10S977/854
摘要： A method for measuring the resistance or conductivity between two or more conductors which are placed against a semiconductor element, wherein in order to bring the contact resistance between the conductors and the element to, to hold it at,a predetermined value during measuring, the conductors are held at a constant distance and/or under constant pressure relative to the semiconductor element.
摘要翻译： PCT No.PCT / EP91 / 01294 Sec。 371日期：1992年3月9日 102（e）1992年3月9日PCT PCT 1991年7月9日PCT公布。出版物WO92 / 01233 日本1992年1月23日。一种用于测量放置在半导体元件上的两个或多个导体之间的电阻或电导率的方法，其中为了使导体和元件之间的接触电阻保持在测量期间的预定值，导体相对于半导体元件保持恒定的距离和/或恒定的压力。

9. 发明授权

US06201401B1 Method for measuring the electrical potential in a semiconductor element 有权
标题翻译：用于测量半导体元件中的电位的方法
公开(公告)号：US06201401B1
公开(公告)日：2001-03-13
申请号：US09197611
申请日：1998-11-23
申请人： Louis C. Hellemans , Thomas Trenkler , Peter De Wolf , Wilfried Vandervorst
发明人： Louis C. Hellemans , Thomas Trenkler , Peter De Wolf , Wilfried Vandervorst
IPC分类号： G01R3126
CPC分类号： G01R31/2648 , G01Q60/30 , G01R29/12 , G01R31/2831 , H01L22/14 , H01L2924/0002 , H01L2924/014 , Y10S977/854 , H01L2924/00
摘要： Measuring an electrical potential in a semiconductor element by applying one or more voltages over the semiconductor element, placing at least one conductor in contact with the semi-conductor element using a scanning proximity microscope while injecting a substantially zero current in the semiconductor element with the conductor, measuring an electrical potential in the conductor while injecting a substantially zero current in the semiconductor element with the conductor, changing the position of the conductor, and repeating the measuring and changing steps.
摘要翻译：通过在半导体元件上施加一个或多个电压来测量半导体元件中的电位，使用扫描接近显微镜将至少一个导体与半导体元件接触，同时在半导体元件中注入基本零电流的导体测量导体中的电位，同时在半导体元件中与导体注入大致零电流，改变导体的位置，并重复测量和改变步骤。

10. 发明授权

US5995912A Database and method for measurement correction for cross-sectional carrier profiling techniques 失效
标题翻译：横断面载体分析技术的数据库和测量校正方法
公开(公告)号：US5995912A
公开(公告)日：1999-11-30
申请号：US840390
申请日：1997-04-29
申请人： Peter DeWolf , Trudo Clarysse , Wilfried Vandervorst
发明人： Peter DeWolf , Trudo Clarysse , Wilfried Vandervorst
IPC分类号： G01R31/26 , H01L21/66 , G01R27/02 , G01R27/08
CPC分类号： G01R31/2648 , H01L22/14
摘要： A database method and method of using the database for determining the carrier concentration profile of a semiconductor, wherein the database includes a first set of first data, the first data being a correction factor; and a second set of second data, each of the second data including first and a second set of parameters, the first set of parameters characterizing the carrier concentration profile and the second set of parameters characterizing the measurement technique. Each data of the first set of first data is obtained from one data of the second set of data through simulation or calculation.
摘要翻译：一种使用数据库确定半导体的载流子浓度分布的数据库方法和方法，其中所述数据库包括第一组第一数据，所述第一数据是校正因子; 和第二组第二数据，每个第二数据包括第一和第二组参数，表征载波浓度分布的第一组参数和表征测量技术的第二组参数。通过模拟或计算从第二组数据的一个数据获得第一组第一数据的每个数据。

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