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1. 发明授权

US06186008B1 Semiconductor sensor component 有权
标题翻译：半导体传感器元件
公开(公告)号：US06186008B1
公开(公告)日：2001-02-13
申请号：US09349551
申请日：1999-07-08
申请人： Thies Janczek , Bernd Stadler , Detlef Houdeau
发明人： Thies Janczek , Bernd Stadler , Detlef Houdeau
IPC分类号： G01L900
CPC分类号： B81B7/0058 , B81B3/007 , B81B7/0061 , B81C2203/0163 , G01L19/0038 , G01L19/0645 , G01L19/143 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A housing for a semiconductor sensor configuration, in which a sensor and an evaluation logic are integrated in a semiconductor body is disclosed. The housing has a base body upon which the semiconductor body is applied and a cover that encloses the semiconductor body in the base body. The cover is directly set on the base body of the housing and contains a membrane and/or labyrinth.
摘要翻译：公开了一种用于半导体传感器配置的壳体，其中传感器和评估逻辑集成在半导体本体中。壳体具有基体，半导体本体被施加到基体上，并且在基体内包围半导体本体。盖子直接设置在外壳的基体上并且包含膜和/或迷宫。

2. 发明授权

US06313514B1 Pressure sensor component 失效
标题翻译：压力传感器部件
公开(公告)号：US06313514B1
公开(公告)日：2001-11-06
申请号：US09093336
申请日：1998-06-08
申请人： Jürgen Winterer , Eric Bootz , Bernd Stadler , Achim Neu , Thies Janczek
发明人： Jürgen Winterer , Eric Bootz , Bernd Stadler , Achim Neu , Thies Janczek
IPC分类号： H01L2982
CPC分类号： B81B7/007 , G01L19/0084 , G01L19/0645 , G01L19/141 , H01L24/73 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00012
摘要： The pressure sensor component has a chip carrier carrying a semiconductor chip with an integrated pressure sensor having a pressure-detecting surface exposed to the pressure to be measured. A device encapsulation made from an electrically insulating material surrounds the entire assembly except for protruding electrode terminals. Bond wires connect the electrode terminals with the pressure sensor and/or the electronic circuit of the semiconductor chip. The device encapsulation consists entirely of a homogeneous pressure-transmitting medium comprising an enveloping compound, which transmits the pressure to be measured as free from delay and attenuation as possible but is mechanically resistant and dimensionally stable. The pressure to be measured is transmitted directly by the enveloping compound onto the pressure-detecting surface of the semiconductor chip, and the pressure sensor and/or the pressure sensor component is covered tightly on all sides against mechanical and/or chemical influences.
摘要翻译：压力传感器部件具有承载具有集成压力传感器的半导体芯片的芯片载体，其具有暴露于待测量的压力的压力检测表面。由电绝缘材料制成的器件封装围绕整个组件，除了突出的电极端子。接合线将电极端子与半导体芯片的压力传感器和/或电子电路连接。装置封装完全由均匀的压力传递介质组成，包括一个包封化合物，其将要测量的压力尽可能地不受延迟和衰减的影响，但具有机械抵抗和尺寸稳定性。被测量的压力直接由包络化合物传递到半导体芯片的压力检测表面上，并且压力传感器和/或压力传感器部件在所有方面被紧密地覆盖以抵抗机械和/或化学影响。

3. 发明授权

US06201467B1 Pressure sensor component and production method 有权
标题翻译：压力传感器部件及生产方法
公开(公告)号：US06201467B1
公开(公告)日：2001-03-13
申请号：US09382530
申请日：1999-08-25
申请人： Jürgen Winterer , Eric Bootz , Bernd Stadler , Achim Neu , Thies Janczek
发明人： Jürgen Winterer , Eric Bootz , Bernd Stadler , Achim Neu , Thies Janczek
IPC分类号： H01C1010
CPC分类号： G01L19/141 , G01L19/0038 , G01L19/0084
摘要： The pressure sensor component has a chip carrier with an approximately planar chip carrier surface. A semiconductor chip with an integrated pressure sensor is placed on the chip carrier surface. A pressure-detecting surface area of the pressure sensor is exposed to a pressure to be measured. The component is encapsulated with electrically insulating material that encloses the semiconductor chip and/or the chip carrier at least in regions. A chimney-shaped connection piece that projects up relative to the pressure-detecting area of the pressure sensor penetrates through the encapsulation and is connected to the pressure sensor. The connection piece, which is a separate structural element is incorporated in the component encapsulation and it encloses at least the pressure-detecting surface area in a pressure-tight manner with its end bearing on the semiconductor chip. The connection piece is open toward the outside at its opposite end so as to expose the pressure sensor to the pressure to be measured. The invention furthermore relates to a method for producing such a pressure sensor component.
摘要翻译：压力传感器部件具有具有近似平面的芯片载体表面的芯片载体。具有集成压力传感器的半导体芯片放置在芯片载体表面上。压力传感器的压力检测表面积暴露于要测量的压力。该部件用至少在区域中封装半导体芯片和/或芯片载体的电绝缘材料封装。相对于压力传感器的压力检测区域向上突出的烟囱形连接件穿透封装并连接到压力传感器。作为单独的结构元件的连接件被结合在部件封装中，并且其端部承载在半导体芯片上的至少压力检测表面区域以压力密封的方式封闭。连接件在其相对端向外打开，以将压力传感器暴露于要测量的压力。本发明还涉及一种用于制造这种压力传感器部件的方法。

4. 发明授权

US07562741B2 Rear muffler assembly 有权
标题翻译：后消声器总成
公开(公告)号：US07562741B2
公开(公告)日：2009-07-21
申请号：US11867738
申请日：2007-10-05
申请人： Jörg Winklel , Bernd Stadler
发明人： Jörg Winklel , Bernd Stadler
IPC分类号： F01N7/04 , F01N1/08 , F01N1/02
CPC分类号： F01N1/04 , F01N1/006 , F01N1/084 , F01N1/085 , F01N1/089 , F01N1/10 , F01N1/166 , F01N13/02 , F01N2470/14 , F01N2490/02
摘要： A rear muffler assembly for an internal combustion engine has a first and a second muffler through which exhaust gases flow and which are separated from one another. The first and second mufflers have in each case an exhaust gas delivery and discharge through an exhaust gas routing pipe issuing into an exhaust pipe which follows downstream and in which an exhaust gas shutoff flap which can be closed temporarily is disposed. The rear muffler assembly contains two exhaust gas routing pipes, the first exhaust gas routing pipe having within the rear muffler an issue orifice for exhaust gases positively emerging from the second exhaust gas routing pipe, with the exhaust gas shutoff flap closed, into which first exhaust gas routing pipe the exhaust gases from the internal combustion engine flow directly.
摘要翻译：用于内燃机的后消音器组件具有第一和第二消声器，废气流过该消声器并且彼此分离。第一和第二消音器在每种情况下都具有通过排放气体排放管排出的废气的排放物，该废气排放管排放到沿着下游排出的排气管中，并且其中布置有临时封闭的排气关闭挡板。后消音器组件包含两个废气排放管，第一废气排放管在后消音器内具有用于从第二废气排放管正向排出的废气的排放孔，废气关闭挡板关闭，第一排气管气体导管从内燃机的排气直接流出。

5. 发明申请

US20050151246A1 Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier 有权
标题翻译：多层电路载体，面板，电子器件，以及多层电路载体的制造方法
公开(公告)号：US20050151246A1
公开(公告)日：2005-07-14
申请号：US11046892
申请日：2005-02-01
申请人： Frank Daeche , Jochen Dangelmaier , Stefan Paulus , Bernd Stadler , Horst Theuss , Michael Weber
发明人： Frank Daeche , Jochen Dangelmaier , Stefan Paulus , Bernd Stadler , Horst Theuss , Michael Weber
IPC分类号： H01L21/48 , H01L23/055 , H01L23/31 , H01L23/498 , H01L23/538 , H01L27/146 , H01L31/0203 , H05K1/11 , H05K3/20 , H05K3/46 , H01L21/44 , H01L21/50 , H01L23/34
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/055 , H01L23/3121 , H01L23/49805 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/49861 , H01L23/5389 , H01L24/48 , H01L24/73 , H01L27/14618 , H01L31/0203 , H01L2224/05599 , H01L2224/16225 , H01L2224/32013 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01029 , H01L2924/01068 , H01L2924/01077 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15313 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K1/113 , H05K3/205 , H05K3/4647 , H05K3/4682 , H05K2201/2072 , H05K2203/0733 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a rewiring structure, and at least one insulation layer, which has passage structures.
摘要翻译：多层电路载体，电子器件和面板以及制造多层电路载体的方法包括至少一个半导体芯片，至少一个具有重新布线结构的重新布线层以及具有通道结构的至少一个绝缘层。

6. 发明申请

US20080197485A1 Module comprising a semiconductor chip comprising a movable element 有权
标题翻译：模块包括包括可移动元件的半导体芯片
公开(公告)号：US20080197485A1
公开(公告)日：2008-08-21
申请号：US11709337
申请日：2007-02-21
申请人： Horst Theuss , Bernd Stadler
发明人： Horst Theuss , Bernd Stadler
IPC分类号： H01L23/04 , H01L21/00
CPC分类号： H01L23/055 , B81B7/0077 , B81B2201/0257 , H01L23/552 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/48 , H01L25/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/29101 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15151 , H01L2924/15787 , H01L2924/16151 , H01L2924/16152 , H01L2924/3025 , H04R1/04 , H04R1/06 , H01L2924/00 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： The invention relates to a module comprising a carrier, a first semiconductor chip applied to the carrier and having a movable element and a second semiconductor chip applied to the first semiconductor chip, wherein an active first main surface of the first semiconductor chip faces the carrier and a first cavity is formed between the two semiconductor chips.
摘要翻译：本发明涉及一种模块，包括载体，施加到载体上的第一半导体芯片，并具有可移动元件和应用于第一半导体芯片的第二半导体芯片，其中第一半导体芯片的有源第一主表面面向载体，在两个半导体芯片之间形成第一空腔。

7. 发明申请

US20120162948A1 SENSOR MODULE 有权
标题翻译：传感器模块
公开(公告)号：US20120162948A1
公开(公告)日：2012-06-28
申请号：US13413013
申请日：2012-03-06
申请人： Horst Theuss , Bernd Stadler
发明人： Horst Theuss , Bernd Stadler
IPC分类号： H05K7/00 , H05K3/34 , H05K3/32
CPC分类号： H01L23/04 , B81B7/0064 , B81B2201/0257 , B81C1/0023 , H01L23/055 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/01079 , H01L2924/10253 , H01L2924/1433 , H01L2924/1461 , H01L2924/15192 , H01L2924/16251 , H04R19/016 , Y10T29/413 , Y10T29/53178 , H01L2924/00 , H01L2224/05599
摘要： A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane.
摘要翻译：传感器模块一个实施例提供了一个帽，其外围限定了一个边缘。第一半导体芯片附接到盖。第一半导体芯片包括第一连接元件。边缘和第一连接元件限定公共平面。

8. 发明申请

US20090313817A1 SENSOR MODULE 有权
标题翻译：传感器模块
公开(公告)号：US20090313817A1
公开(公告)日：2009-12-24
申请号：US12142380
申请日：2008-06-19
申请人： Horst Theuss , Bernd Stadler
发明人： Horst Theuss , Bernd Stadler
IPC分类号： B23P19/00
CPC分类号： H01L23/04 , B81B7/0064 , B81B2201/0257 , B81C1/0023 , H01L23/055 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/01079 , H01L2924/10253 , H01L2924/1433 , H01L2924/1461 , H01L2924/15192 , H01L2924/16251 , H04R19/016 , Y10T29/413 , Y10T29/53178 , H01L2924/00 , H01L2224/05599
摘要： A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane.
摘要翻译：传感器模块一个实施例提供了一个帽，其外围限定了一个边缘。第一半导体芯片附接到盖。第一半导体芯片包括第一连接元件。边缘和第一连接元件限定公共平面。

9. 发明授权

US07056764B2 Electronic sensor device and method for producing the electronic sensor device 有权
公开(公告)号：US07056764B2
公开(公告)日：2006-06-06
申请号：US10238820
申请日：2002-09-10
申请人： Albert Auburger , Bernd Stadler , Stefan Paulus , Horst Theuss
发明人： Albert Auburger , Bernd Stadler , Stefan Paulus , Horst Theuss
IPC分类号： H01L21/44 , G01R31/308
CPC分类号： G01L19/0069 , G01H1/00 , G01L19/147 , H01L2224/48091 , H01L2224/48247 , H01L2924/01046 , H01L2924/01079 , H01L2924/00014
摘要： An electronic sensor device has at least one sensor component, which bears on a bearing base of a rewiring structure. Contact areas of the sensor component are electrically conductively connected to contact pads of the rewiring structure. External contact areas of the rewiring structure are led outward from a housing for the electrical contact-connection of the electronic sensor device. A method is also described for producing the electronic sensor device.

10. 发明授权

US09177879B2 Sensor module 有权
标题翻译：传感器模块
公开(公告)号：US09177879B2
公开(公告)日：2015-11-03
申请号：US13413013
申请日：2012-03-06
申请人： Horst Theuss , Bernd Stadler
发明人： Horst Theuss , Bernd Stadler
IPC分类号： H05K7/00 , H01L23/04 , B81B7/00 , B81C1/00 , H01L23/055 , H04R19/01
CPC分类号： H01L23/04 , B81B7/0064 , B81B2201/0257 , B81C1/0023 , H01L23/055 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/01079 , H01L2924/10253 , H01L2924/1433 , H01L2924/1461 , H01L2924/15192 , H01L2924/16251 , H04R19/016 , Y10T29/413 , Y10T29/53178 , H01L2924/00 , H01L2224/05599
摘要： A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane.
摘要翻译：传感器模块一个实施例提供了一个帽，其外围限定了一个边缘。第一半导体芯片附接到盖。第一半导体芯片包括第一连接元件。边缘和第一连接元件限定公共平面。

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