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1. 发明授权

US06797585B1 Nonintrusive wafer marking 有权
标题翻译：非侵入式晶圆标记
公开(公告)号：US06797585B1
公开(公告)日：2004-09-28
申请号：US10680047
申请日：2003-10-07
申请人： Theodore O. Meyer , Nima Behkami
发明人： Theodore O. Meyer , Nima Behkami
IPC分类号： H01L2176
CPC分类号： H01L21/02027 , H01L21/02021 , H01L23/544 , H01L2223/54493 , H01L2924/0002 , H01L2924/00
摘要： A method for marking a wafer that is cut from a boule. A surface of the boule is marked with an encoded marking that extends completely along a distance of the boule that is used for cutting wafers. The encoded marking is disposed substantially parallel to a length axis of the boule. The wafer is cut from the boule from within the distance, such that the encoded marking along the surface of the boule is disposed at a peripheral edge of the wafer. The encoded marking contains information in regard to the wafer.
摘要翻译：一种用于标记从坯料切割的晶片的方法。该轴的表面标有一个编码的标记，该编码标记完全沿用于切割晶片的轴的距离延伸。编码的标记基本上平行于该轴的长度轴布置。在距离内从晶片切割晶片，使得沿着晶片表面的编码标记设置在晶片的周边边缘。编码的标记包含关于晶片的信息。

2. 发明申请

US20050229144A1 Yield profile manipulator 有权
标题翻译：产量轮廓机械手
公开(公告)号：US20050229144A1
公开(公告)日：2005-10-13
申请号：US10801310
申请日：2004-03-16
申请人： Chandra Desu , Nima Behkami , Bruce Whitefield , David Abercrombie , David Sturtevant
发明人： Chandra Desu , Nima Behkami , Bruce Whitefield , David Abercrombie , David Sturtevant
IPC分类号： G06F17/50
CPC分类号： G06F17/5068
摘要： A graphical profile map for integrated circuits on a substrate. The graphical profile map includes a depiction of die placement boundaries and shot placement boundaries for the integrated circuits on the substrate. Also included are integrated circuit property information contours, where the contours are not limited to either of the die placement boundaries or the shot placement boundaries. In this manner, three key pieces of information for the integrated circuits are presented, including integrated circuit property information, die placement, and shot placement. Because these three pieces of information are presented in a graphical form, it is much easier to interpret the information. For example, it is much easier to determine which shot and die placements have properties that are at risk, and which shot and die placements have adequate property profiles.
摘要翻译：衬底上集成电路的图形配置图。图形轮廓图包括对基片上的集成电路的管芯放置边界和镜头放置边界的描绘。还包括集成电路属性信息轮廓，其中轮廓不限于管芯放置边界或射击放置边界中的任何一个。以这种方式，提供了用于集成电路的三个关键信息，包括集成电路属性信息，管芯放置和射击放置。因为这三条信息以图形形式呈现，所以解释信息要容易得多。例如，确定哪些投篮和投篮位置具有处于风险中的属性以及哪些投篮和投篮位置具有足够的财产配置文件将变得更加容易。

3. 发明申请

US20050203862A1 Process control data collection 有权
标题翻译：过程控制数据收集
公开(公告)号：US20050203862A1
公开(公告)日：2005-09-15
申请号：US10799851
申请日：2004-03-12
申请人： Nima Behkami , Theodore Meyer , Thomas Hann
发明人： Nima Behkami , Theodore Meyer , Thomas Hann
IPC分类号： G06F7/00
CPC分类号： G06F17/30368 , G05B19/4183 , G05B2219/31282 , G05B2219/45031 , Y02P90/10 , Y10S707/99931
摘要： A data collection system. A data input form receives data, and a message queue receives the data from the data input form, and temporarily manages the data until the data collection system can process the data. A temporary data storage temporarily stores the data received by the message queue while waiting for the data collection system to process the data. A transaction manager receives the data from the message queue and processes the data. A data logger logs the processing transactions of the transaction manager. A data loader receives the data from the transaction manager and prepares the data for storage. A data storage device receives the data from the data loader.
摘要翻译：数据收集系统。数据输入表单接收数据，消息队列从数据输入表单接收数据，并临时管理数据，直到数据收集系统能够处理数据。临时数据存储器在等待数据收集系统处理数据的同时临时存储由消息队列接收的数据。事务管理器从消息队列接收数据并处理数据。数据记录器记录事务管理器的处理事务。数据加载器从事务管理器接收数据并准备数据进行存储。数据存储设备从数据加载器接收数据。

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