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1. 发明授权

US09252691B2 Back electromagnetic force (BEMF) sense system 有权
标题翻译：反电磁力（BEMF）感应系统
公开(公告)号：US09252691B2
公开(公告)日：2016-02-02
申请号：US13965628
申请日：2013-08-13
申请人： Texas Instruments Incorporated
发明人： Qunying Li , Joao Carlos Felicio Brito
IPC分类号： H02P6/06 , H02P6/18
CPC分类号： H02P6/182
摘要： One embodiment includes a back-electromagnetic force (BEMF) sense system. The system includes a sense amplifier configured to measure an amplitude of a selected one of a plurality of phase voltages relative to a center tap voltage associated with a servo motor for the calculation of an associated BEMF voltage. The plurality of phase voltages can be provided to the sense amplifier via a respective plurality of control nodes. The selected one of the plurality of phase voltages on a respective one of the control nodes can be selected based on coupling the other of the plurality of control nodes associated with the other of the plurality of phase voltages to a voltage source configured to provide a predetermined voltage magnitude.
摘要翻译：一个实施例包括反电磁力（BEMF）感测系统。该系统包括读出放大器，其被配置为相对于与伺服电动机相关联的中心抽头电压来测量多个相电压中所选择的一个的幅度，用于计算相关联的BEMF电压。可以经由相应的多个控制节点将多个相电压提供给读出放大器。可以基于将与多个相电压中的另一个相关联的多个控制节点中的另一个耦合到被配置为提供预定的电压源的电压源来选择控制节点上的相应一个控制节点上的所述多个相电压中的所选择的一个电压幅度。

2. 发明申请

US20200043825A1 CERAMIC PACKAGE FOR HIGH CURRENT SIGNALS 审中-公开
公开(公告)号：US20200043825A1
公开(公告)日：2020-02-06
申请号：US16267907
申请日：2019-02-05
申请人： Texas Instruments Incorporated
发明人： Joao Carlos Felicio Brito , Javier Antonio Valle Mayorga , Hector Torres
IPC分类号： H01L23/367 , H01L23/498 , H01L23/00 , H01L21/48
摘要： A hermetic ceramic package for high current signals includes a substrate made of a plurality of ceramic green sheets that form an upper body portion having an upper surface and a lower body portion having a lower surface and an intermediate surface between the upper surface and the lower surface. A first conductive plate is formed on the intermediate surface and a first plurality of conductive pad vias are formed in the lower body portion, extending from the first conductive plate to the lower surface of the lower body portion. A heat sink if coupled to the lower surface of the lower body portion and a first conductive pad also coupled to the lower surface such that the first conductive pad is electrically coupled to the first plurality of conductive pad vias.

3. 发明授权

US10547267B2 Voice coil motor pulse width modulation-to-linear smooth transition control 有权
公开(公告)号：US10547267B2
公开(公告)日：2020-01-28
申请号：US15331213
申请日：2016-10-21
申请人： Texas Instruments Incorporated
发明人： Qunying Li , Joao Carlos Felicio Brito , Wenxiao Tan
IPC分类号： H02P7/00 , H02P25/034 , H02P7/03
摘要： Methods and apparatus providing a smooth transition from a pulse width modulation mode to a linear mode to drive a voice coil motor are disclosed. An example apparatus includes an H-bridge; a pulse generator to generate a pulse when the voice coil motor driver transitions from pulse width modulation mode to linear mode; a first boost circuit to, when the pulse is generated, increase a first current being applied to a first gate of a first transistor in the H-bridge, the increase in the first current enabling the first transistor; and a second boost circuit to, when the pulse is generated, provide an additional path to ground from a node coupled to a second gate of a second transistor of the H bridge, the path to ground corresponding to a voltage drop that disables the second transistor.

4. 发明授权

US11088047B2 Ceramic package opening, heat sink, vias coupled to conductive pad 有权
公开(公告)号：US11088047B2
公开(公告)日：2021-08-10
申请号：US16267907
申请日：2019-02-05
申请人： Texas Instruments Incorporated
发明人： Joao Carlos Felicio Brito , Javier Antonio Valle Mayorga , Hector Torres
IPC分类号： H01L23/367 , H01L23/498 , H01L23/00 , H01L21/48
摘要： A hermetic ceramic package for high current signals includes a substrate made of a plurality of ceramic green sheets that form an upper body portion having an upper surface and a lower body portion having a lower surface and an intermediate surface between the upper surface and the lower surface. A first conductive plate is formed on the intermediate surface and a first plurality of conductive pad vias are formed in the lower body portion, extending from the first conductive plate to the lower surface of the lower body portion. A heat sink if coupled to the lower surface of the lower body portion and a first conductive pad also coupled to the lower surface such that the first conductive pad is electrically coupled to the first plurality of conductive pad vias.

5. 发明申请

US20180115268A1 VOICE COIL MOTOR PULSE WIDTH MODULATION-TO-LINEAR SMOOTH TRANSITION CONTROL 审中-公开
公开(公告)号：US20180115268A1
公开(公告)日：2018-04-26
申请号：US15331213
申请日：2016-10-21
申请人： Texas Instruments Incorporated
发明人： Qunying Li , Joao Carlos Felicio Brito , Wenxiao Tan
IPC分类号： H02P25/034 , H02P7/03
CPC分类号： H02P25/034 , H02P7/04
摘要： Methods and apparatus providing a smooth transition from a pulse width modulation mode to a linear mode to drive a voice coil motor are disclosed. An example apparatus includes an H-bridge; a pulse generator to generate a pulse when the voice coil motor driver transitions from pulse width modulation mode to linear mode; a first boost circuit to, when the pulse is generated, increase a first current being applied to a first gate of a first transistor in the H-bridge, the increase in the first current enabling the first transistor; and a second boost circuit to, when the pulse is generated, provide an additional path to ground from a node coupled to a second gate of a second transistor of the H bridge, the path to ground corresponding to a voltage drop that disables the second transistor.

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