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1. 发明授权

US4960897A Herbicide containing 1-(halogenomethyl)-vinyl pyridines 失效
标题翻译：除草剂含有1-（卤代甲基） - 乙烯基吡啶
公开(公告)号：US4960897A
公开(公告)日：1990-10-02
申请号：US163086
申请日：1988-03-02
申请人： Tetsuo Jikihara , Manabu Katsurada , Toyohiko Shike , Emiko Mikami , Osamu Ikeda
发明人： Tetsuo Jikihara , Manabu Katsurada , Toyohiko Shike , Emiko Mikami , Osamu Ikeda
IPC分类号： A01N43/40 , C07D213/42 , C07D213/61 , C07D213/64 , C07D213/70 , C07D405/04
CPC分类号： C07D213/64 , A01N43/40 , C07D213/42 , C07D213/61 , C07D213/70 , C07D405/04
摘要： Disclosed herein is an N-[2-(pyridyl)propyl]-N-substituted sulfonamide represented by the following general formula (I): ##STR1## wherein J represents a phenyl group which may be substituted or benzo-condensed, A represents --CH.sub.2 --, --CH.dbd.CH--, --O-- or --N(r)-- (wherein r represents an alkyl group having 1 to 4 carbon atoms), b represents 0 or 1, R represents an alkyl group, alkenyl group, alkynyl group, alkoxy group, fluoroalkyl group or formyl group, D represents a hydroxyl group, E represents a halogen atom, an alkylsulfonyloxy group or a benzenesulfonyloxy group which may be substituted, or D and E represent --O-- in combination, and V represents a pyridyl group which may be substituted, a herbicide containing said N-[2-(pyridyl)propyl]-N-substituted sulfonamide as an active ingredient and a 1-(halogenomethyl)vinylpyridine as an intermediate thereof.

2. 发明授权

US5076830A Indan-1,3-dione derivative and herbicidal composition containing the same as active ingredient 失效
标题翻译：含有它们的印尼1,3-二酮衍生物和除草剂组合物作为活性成分
公开(公告)号：US5076830A
公开(公告)日：1991-12-31
申请号：US523748
申请日：1990-05-15
申请人： Tetsuo Jikihara , Toyohiko Shike , Manabu Katsurada , Hisao Watanabe , Osamu Ikeda
发明人： Tetsuo Jikihara , Toyohiko Shike , Manabu Katsurada , Hisao Watanabe , Osamu Ikeda
IPC分类号： C07D213/50 , A01N35/06 , A01N41/04 , A01N43/20 , A01N43/40 , A01N43/42 , C07C45/64 , C07C45/68 , C07C49/683 , C07C49/697 , C07C49/747 , C07C205/45 , C07C309/65 , C07C309/66 , C07C309/73 , C07C309/75 , C07C309/77 , C07D213/61 , C07D213/64 , C07D303/32
CPC分类号： C07D303/32 , A01N35/06 , A01N41/04 , A01N43/20 , A01N43/40 , A01N43/42 , C07C205/45 , C07C309/65 , C07C309/66 , C07C309/73 , C07C309/75 , C07C309/77 , C07C45/64 , C07C45/68 , C07C49/683 , C07C49/697 , C07C49/747 , C07D213/61 , C07D213/64 , C07C2102/10
摘要： The present invention provides indan-1,3-dione derivatives, including derivatives represented by the following formula (I): ##STR1## wherein R.sup.1 represents a hydrogen atom or a lower alkyl group; R.sup.2 represents a group represented by ##STR2## wherein E represents a (substituted) phenyl group or a (substituted) pyridyl group; Y represents a hydroxyl group; and Z represents a halogen atom, a (substituted) alkylsulfonyloxy group or a (substituted) phenylsulfonyloxy group, or Y and Z are bonded to represent --O--; and A represents a (substituted) 1,3-butadienylene group or a (substituted) 1,3-azabutadienylene group, and a herbicidal composition containing the same as an active ingredient.The compound of the formula (I) shows high herbicidal activity against gramineous weeds, cyperaceous weeds, etc. but shows markedly low phytotoxicity against crops.

3. 发明授权

US5110342A Indan-1,3-dione derivative and herbicidal composition containing the same as active ingredient 失效
标题翻译：含有它们的印尼1,3-二酮衍生物和除草剂组合物作为活性成分
公开(公告)号：US5110342A
公开(公告)日：1992-05-05
申请号：US755826
申请日：1991-09-06
申请人： Tetsuo Jikihara , Toyohiko Shike , Manabu Katsurada , Hisao Watanabe , Osamu Ikeda
发明人： Tetsuo Jikihara , Toyohiko Shike , Manabu Katsurada , Hisao Watanabe , Osamu Ikeda
IPC分类号： C07D213/50 , A01N35/06 , A01N41/04 , A01N43/20 , A01N43/40 , A01N43/42 , C07C45/64 , C07C45/68 , C07C49/683 , C07C49/697 , C07C49/747 , C07C205/45 , C07C309/65 , C07C309/66 , C07C309/73 , C07C309/75 , C07C309/77 , C07D213/61 , C07D213/64 , C07D303/32
CPC分类号： C07D303/32 , A01N35/06 , A01N41/04 , A01N43/20 , A01N43/40 , A01N43/42 , C07C205/45 , C07C309/65 , C07C309/66 , C07C309/73 , C07C309/75 , C07C309/77 , C07C45/64 , C07C45/68 , C07C49/683 , C07C49/697 , C07C49/747 , C07D213/61 , C07D213/64 , C07C2102/10
摘要： The present invention provides an indan-1,3-dione derivative represented by the following formula (I): ##STR1## wherein R.sup.1 represents a hydrogen atom or a lower alkyl group; R.sup.2 represents a group represented by ##STR2## wherein E represents a (substituted) phenyl group or a (substituted) pyridyl group; Y represents a hydroxyl group; and Z represents a halogen atom, a (substituted) alkylsulfonyloxy group or a (substituted) phenylsulfonyloxy group, or Y and Z are bonded to represent --O--; and A represents a (substituted) 1,3-butadienylene group or a (substituted) 1,3-azabutadienylene group, and a herbicidal composition containing the same as an active ingredient.

4. 发明授权

US4971620A Sulfonamide and herbicide containing the same as active ingredient 失效
标题翻译：含有与活性成分相同的磺酰胺和除草剂
公开(公告)号：US4971620A
公开(公告)日：1990-11-20
申请号：US302253
申请日：1989-01-27
申请人： Tetsuo Jikihara , Manabu Katsurada , Toyohiko Shike , Osamu Ikeda , Hisao Watanabe , Tetsuo Takematsu , Koichi Yoneyama
发明人： Tetsuo Jikihara , Manabu Katsurada , Toyohiko Shike , Osamu Ikeda , Hisao Watanabe , Tetsuo Takematsu , Koichi Yoneyama
IPC分类号： C07D307/79 , A01N41/06 , A01N43/12 , A01N51/00 , C07C311/15 , C07C311/16 , C07C311/17 , C07C311/29 , C07C311/48 , C07D303/36
CPC分类号： A01N43/12 , A01N41/06 , A01N51/00 , C07C311/16 , C07C311/17
摘要： Disclosed herein is a sulfonamide compound represented by the formula (I): ##STR1## wherein A represents a phenyl group which may be substituted, B represents a phenyl group which may be substituted, R represents a lower alkyl group, a lower alkoxy group or a lower haloalkyl group, W represents a hydroxyl group or a halogen atom, and z represents a halogen atom, a lower alkysulfonyloxy group which may be substituted, or a phenylsulfonyloxy group which may be substituted, and a herbicidal composition containing the sulfonamide compound as an effective ingredient.

5. 发明授权

US08525330B2 Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer 有权
标题翻译：用于连接半导体元件和框架的连接构件，由Al基层和设置在Al基层的表面上的第一和第二Zn基层形成
公开(公告)号：US08525330B2
公开(公告)日：2013-09-03
申请号：US13382633
申请日：2010-08-30
申请人： Masahide Okamoto , Osamu Ikeda , Yuki Murasato
发明人： Masahide Okamoto , Osamu Ikeda , Yuki Murasato
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： C22C18/04 , B22F2998/00 , B23K1/0016 , B23K2101/42 , B32B15/017 , C22C21/00 , C22C21/06 , H01L23/04 , H01L23/3107 , H01L23/49582 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/29109 , H01L2224/29111 , H01L2224/29118 , H01L2224/29147 , H01L2224/29211 , H01L2224/2929 , H01L2224/29299 , H01L2224/29347 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2924/00013 , H01L2924/00014 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/10253 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/351 , Y10T29/49826 , Y10T428/12736 , B22F7/062 , H01L2924/0105 , H01L2924/00012 , H01L2924/01013 , H01L2924/0103 , H01L2924/01032 , H01L2924/01014 , H01L2924/01083 , H01L2924/01031 , H01L2924/01082 , H01L2924/01049 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/05599
摘要： Provided is a connecting part for a semiconductor device including a semiconductor element, a frame, and a connecting part which connects the semiconductor element and the frame to each other, in which an interface between the connecting part and the semiconductor element and an interface between the connecting part and the frame respectively have the area of Al oxide film which is more than 0% and less than 5% of entire area of the respective interfaces. The connecting part has an Al-based layer and first and second Zn-based layers on main surfaces of the Al-based layer, a thickness ratio of the Al-based layer relative to the Zn-based layers being less than 0.59.
摘要翻译：提供了一种半导体器件的连接部件，其包括半导体元件，框架和将半导体元件和框架彼此连接的连接部分，其中连接部分和半导体元件之间的界面和连接部和框架分别具有比各界面的整个面积大于0％且小于5％的Al氧化物膜的面积。连接部分在Al基层的主表面上具有Al基层和第一和第二Zn基层，Al基层相对于Zn基层的厚度比小于0.59。

6. 发明申请

US20110037694A1 IMAGE PROCESSING APPARATUS AND METHOD 审中-公开
标题翻译：图像处理装置和方法
公开(公告)号：US20110037694A1
公开(公告)日：2011-02-17
申请号：US12898570
申请日：2010-10-05
申请人： Masahiro Juen , Kenji Toyoda , Osamu Ikeda , Hisato Ide
发明人： Masahiro Juen , Kenji Toyoda , Osamu Ikeda , Hisato Ide
IPC分类号： G06F3/033
CPC分类号： G06F3/033 , G06F3/04845 , G06T1/00 , H04N1/00352 , H04N1/00397 , H04N1/00411 , H04N2101/00
摘要： An image processing apparatus provided with a display unit for displaying an operation picture, showing control indicia (e.g., icons) corresponding to multiple image processing functions, is operated to display the operation picture on an external display device. The operator selects one of the indicia shown on the external display device by operating an input device, such as touch screen of the apparatus or a remote control, to indicate the position of the desired one of the indicia. The operator can thereby quickly and reliably select an image processing function to be executed, without any need to view an operation picture on the display unit when making the selection.
摘要翻译：操作具有用于显示操作画面的显示单元的图像处理设备，显示与多个图像处理功能对应的控制标记（例如，图标），以在外部显示设备上显示操作画面。操作者通过操作诸如设备的触摸屏或遥控器的输入设备来指示所需的一个标记的位置来选择外部显示设备上所示的一个标记。因此，操作者能够快速，可靠地选择要执行的图像处理功能，而不需要在进行选择时在显示单元上观看操作画面。

7. 发明授权

US07719106B2 Semiconductor device, electronic card and pad rearrangement substrate 失效
标题翻译：半导体器件，电子卡和衬垫重排衬底
公开(公告)号：US07719106B2
公开(公告)日：2010-05-18
申请号：US11780375
申请日：2007-07-19
申请人： Minori Kajimoto , Osamu Ikeda , Masaki Momodomi
发明人： Minori Kajimoto , Osamu Ikeda , Masaki Momodomi
IPC分类号： H01L23/12
CPC分类号： H01L23/49855 , G06K19/077 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05599 , H01L2224/16227 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01075 , H01L2924/01078 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device comprises a substrate, an external terminal provided on the substrate, an internal wiring pattern electrically connected to the external terminal, a semiconductor chip mounted on the substrate and electrically connected to the internal wiring pattern, and an antenna pattern. The antenna pattern provided at each of adjacent two corner portions of the substrate and is grounded.
摘要翻译：半导体器件包括衬底，设置在衬底上的外部端子，与外部端子电连接的内部布线图案，安装在衬底上并电连接到内部布线图案的半导体芯片和天线图案。天线图案设置在基板的相邻两个角部的每一个处并接地。

8. 发明授权

US07338273B2 Cutter machine 有权
标题翻译：切割机
公开(公告)号：US07338273B2
公开(公告)日：2008-03-04
申请号：US10437063
申请日：2003-05-14
申请人： Masashi Konno , Nobuki Nagami , Yasuo Yoshii , Osamu Ikeda , Yoshiaki Nakata , Kazuo Iritani
发明人： Masashi Konno , Nobuki Nagami , Yasuo Yoshii , Osamu Ikeda , Yoshiaki Nakata , Kazuo Iritani
IPC分类号： B29B9/00 , B29C47/08 , F16D3/26 , B26D7/26
CPC分类号： B29B9/065 , B26D1/28 , B26D7/2628 , B29B9/06 , Y10S83/913 , Y10T83/9319 , Y10T83/9379 , Y10T83/9464
摘要： A cutter machine has a knife holder 13 mounted onto a cutter shaft 6 at the center portion, wherein a material to be cut is cut with knives 15 mounted onto the outer circumference of the knife holder 13 by rotating the knife holder 13 around the cutter shaft 6. The knife holder 13 is separated into a fixing member 17 mounted onto the cutter shaft 6 and a mounting member 18 onto which the knives 15 are mounted. The mounting member 18 is pivotally supported around two axes with respect to the fixing member 17. In the cutter machine, the knives and a die plate come into contact with each other by a small press force of the knives, thereby enabling a satisfactory cutting to be obtained.
摘要翻译：切割机具有在中心部分安装到切割器轴6上的刀架13，其中通过将刀架13围绕切割轴旋转而切割安装在刀架13的外周上的刀15切割的材料 6。刀架13被分离成安装在刀轴6上的固定件17和安装件18，刀架15安装在该安装件18上。安装构件18相对于固定构件17围绕两个轴线枢转地支撑。在切割机中，通过刀的小的压力使刀和模板彼此接触，从而能够获得令人满意的切割。

9. 发明申请

US20080025701A1 Image signal recording/reproduction apparatus, method employed therein, and image signal recording apparatus 审中-公开
标题翻译：图像信号记录/再现装置，其中采用的方法和图像信号记录装置
公开(公告)号：US20080025701A1
公开(公告)日：2008-01-31
申请号：US11898455
申请日：2007-09-12
申请人： Osamu Ikeda
发明人： Osamu Ikeda
IPC分类号： H04N5/76 , H04N5/225
CPC分类号： H04N5/232 , H04N5/23245 , H04N5/772 , H04N5/85 , H04N9/7921 , H04N9/8063 , H04N9/8227
摘要： A dynamic image recording button and a still image recording button are provided at the main unit of a movie camera. A magneto-optical recording medium is loaded in a slot. If the dynamic image recording button or the still image recording button is operated during a reproduction operation, the reproduction operation is interrupted in a state in which the mechanical drive (rotation) of the magneto-optical recording medium is sustained. At this point, a dynamic image signal or a still image signal obtained through a photographing operation performed at the camera unit is temporarily recorded in a buffer memory, and is written in the magneto-optical recording medium when a write in the magneto-optical recording medium becomes enabled. Instructions to record dynamic images and to record still images can be issued to the movie camera through a touch-panel provided on the screen of a liquid crystal display unit. Even when operation cannot be performed through the touch-panel, the instructions can be issued through the dynamic image recording button or the still image recording button.
摘要翻译：动画图像记录按钮和静止图像记录按钮设置在电影摄像机的主单元处。磁光记录介质装载在槽中。如果动态图像记录按钮或静止图像记录按钮在再现操作期间被操作，则在保持磁光记录介质的机械驱动（旋转）的状态下中断再现操作。此时，通过在相机单元执行的拍摄操作获得的动态图像信号或静止图像信号被临时记录在缓冲存储器中，并且当写入磁光记录时被写入磁光记录介质媒体启用通过设置在液晶显示单元的屏幕上的触摸面板，可以向摄像机发出用于记录动态图像和记录静止图像的指令。即使不能通过触摸面板执行操作，也可以通过动态图像记录按钮或静止图像记录按钮来发出指令。

10. 发明授权

US07253509B2 Semiconductor device, electronic card and pad rearrangement substrate 失效
公开(公告)号：US07253509B2
公开(公告)日：2007-08-07
申请号：US11005438
申请日：2004-12-06
申请人： Minori Kajimoto , Osamu Ikeda , Masaki Momodomi
发明人： Minori Kajimoto , Osamu Ikeda , Masaki Momodomi
IPC分类号： H01L23/02
CPC分类号： H01L23/49855 , G06K19/077 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05599 , H01L2224/16227 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01075 , H01L2924/01078 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device comprises a substrate, an external terminal provided on the substrate, an internal wiring pattern electrically connected to the external terminal, a semiconductor chip mounted on the substrate and electrically connected to the internal wiring pattern, and an antenna pattern. The antenna pattern provided at each of adjacent two corner portions of the substrate and is grounded.

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