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1. 发明授权

US06413154B1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06413154B1
公开(公告)日：2002-07-02
申请号：US09582845
申请日：2000-09-11
申请人： Tetsuji Togawa , Takeshi Sakurai , Nobuyuki Takada , Shoichi Kodama , Hiromi Yajima
发明人： Tetsuji Togawa , Takeshi Sakurai , Nobuyuki Takada , Shoichi Kodama , Hiromi Yajima
IPC分类号： B24B2900
CPC分类号： B24B57/02 , B24B37/04 , B24B55/03
摘要： A polishing apparatus can produce a uniform quality of polished products by supplying a polishing solution consistently without being affected by any disturbances in the solution supply source. The polishing apparatus comprises: a polishing section for polishing a workpiece by pressing the same against a polishing tool; a solution piping assembly to be connected to an external solution supply device for transferring a polishing solution therefrom to the polishing section; and a solution suction device provided in the solution piping assembly for introducing the polishing solution from the solution supply device to the polishing section at a desired flow rate.
摘要翻译：抛光装置可以通过一致地提供抛光溶液而不受溶液供应源中的任何干扰的影响而产生均匀的抛光产品质量。抛光装置包括：抛光部分，用于通过将工件压在抛光工具上来抛光工件; 要连接到外部溶液供应装置的溶液管道组件，用于将抛光溶液从其上转移到抛光部分; 以及设置在所述溶液管道组件中的溶液抽吸装置，用于以期望的流速将所述抛光溶液从所述溶液供应装置引入所述抛光部分。

2. 发明授权

US06500051B1 Polishing apparatus and method 失效
标题翻译：抛光设备和方法
公开(公告)号：US06500051B1
公开(公告)日：2002-12-31
申请号：US08884410
申请日：1997-06-27
申请人： Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
发明人： Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
IPC分类号： B24B100
CPC分类号： B24B37/345 , B08B1/04 , B08B15/02 , B24B27/0023 , B24B51/00 , B24B55/12 , F24F3/161 , H01L21/67017 , H01L21/67028 , H01L21/67057 , H01L21/67219
摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.
摘要翻译：用于抛光工件表面的抛光装置包括壳体单元，将壳体单元的内部分隔成第一室和第二室的分隔壁，设置在第一室中的抛光部分，并且具有带有研磨布的转台安装在其上表面和位于转台上方的顶环，用于支撑待抛光的工件并将工件压靠在研磨布上，以及设置在第二室中并清洁已经被抛光的工件的清洁部。抛光装置还包括转印装置，用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。

3. 发明授权

US07198552B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US07198552B2
公开(公告)日：2007-04-03
申请号：US11294365
申请日：2005-12-06
申请人： Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
发明人： Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
IPC分类号： B24B1/00
CPC分类号： B24B37/345 , B08B1/04 , B08B15/02 , B24B27/0023 , B24B51/00 , B24B55/12 , F24F3/161 , H01L21/67017 , H01L21/67028 , H01L21/67057 , H01L21/67219
摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.
摘要翻译：用于抛光工件表面的抛光装置包括壳体单元，将壳体单元的内部分隔成第一室和第二室的分隔壁，设置在第一室中的抛光部分，并且具有带有研磨布的转台安装在其上表面和位于转台上方的顶环，用于支撑待抛光的工件并将工件压靠在研磨布上，以及设置在第二室中并清洁已经被抛光的工件的清洁部。抛光装置还包括转印装置，用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。

4. 发明授权

US07708618B2 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device 失效
标题翻译：用于干燥，干燥抛光和洗涤半导体器件的方法和设备
公开(公告)号：US07708618B2
公开(公告)日：2010-05-04
申请号：US11980667
申请日：2007-10-31
申请人： Hiromi Yajima , Yukio Imoto , Shoichi Kodama , Riichiro Aoki , Takashi Omichi , Toyomi Nishi , Tetsuji Togawa
发明人： Hiromi Yajima , Yukio Imoto , Shoichi Kodama , Riichiro Aoki , Takashi Omichi , Toyomi Nishi , Tetsuji Togawa
IPC分类号： B24B51/00
CPC分类号： H01L21/67161 , B08B1/04 , B24B27/0023 , B24B37/04 , B24B37/345 , B24B51/00 , B24B55/12 , F24F3/161 , H01L21/67028 , H01L21/67046 , H01L21/67057 , H01L21/67167 , H01L21/67219 , H01L21/67745 , H01L21/67778 , H03M13/39 , H04N5/4401 , H04N5/455
摘要： A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
摘要翻译：抛光装置包括用于处理各种操作的多个单元的布置以及具有至少一个臂的机器人。所述多个单元设置在所述机器人周围，并且包括用于在其上接收的加载单元。干燥的待抛光工件，包括至少一个用于抛光工件的抛光单元的抛光系统，至少包括一个用于洗涤和干燥抛光的工件的洗涤单元的洗涤系统和干燥系统，以及用于在其上接收的卸载单元得到清洁和干燥的抛光工件。

5. 发明申请

US20060084369A1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US20060084369A1
公开(公告)日：2006-04-20
申请号：US11294365
申请日：2005-12-06
申请人： Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
发明人： Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
IPC分类号： B24B1/00
CPC分类号： B24B37/345 , B08B1/04 , B08B15/02 , B24B27/0023 , B24B51/00 , B24B55/12 , F24F3/161 , H01L21/67017 , H01L21/67028 , H01L21/67057 , H01L21/67219
摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.
摘要翻译：用于抛光工件表面的抛光装置包括壳体单元，将壳体单元的内部分隔成第一室和第二室的分隔壁，设置在第一室中的抛光部分，并且具有带有研磨布的转台安装在其上表面和位于转台上方的顶环，用于支撑待抛光的工件并将工件压靠在研磨布上，以及设置在第二室中并清洁已经被抛光的工件的清洁部。抛光装置还包括转印装置，用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。

6. 发明申请

US20080166949A1 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device 失效
标题翻译：用于干燥，干燥抛光和洗涤半导体器件的方法和设备
公开(公告)号：US20080166949A1
公开(公告)日：2008-07-10
申请号：US11980667
申请日：2007-10-31
申请人： Hiromi Yajima , Yukio Imoto , Shoichi Kodama , Riichiro Aoki , Takashi Omichi , Toyomi Nishi , Tetsuji Togawa
发明人： Hiromi Yajima , Yukio Imoto , Shoichi Kodama , Riichiro Aoki , Takashi Omichi , Toyomi Nishi , Tetsuji Togawa
IPC分类号： B24B1/00 , B24B27/00
CPC分类号： H01L21/67161 , B08B1/04 , B24B27/0023 , B24B37/04 , B24B37/345 , B24B51/00 , B24B55/12 , F24F3/161 , H01L21/67028 , H01L21/67046 , H01L21/67057 , H01L21/67167 , H01L21/67219 , H01L21/67745 , H01L21/67778 , H03M13/39 , H04N5/4401 , H04N5/455
摘要： A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
摘要翻译：抛光装置包括用于处理各种操作的多个单元的布置以及具有至少一个臂的机器人。所述多个单元设置在所述机器人周围，并且包括用于在其上接收的加载单元。干燥的待抛光工件，包括至少一个用于抛光工件的抛光单元的抛光系统，至少包括一个用于洗涤和干燥抛光的工件的洗涤单元的洗涤系统和干燥系统，以及用于在其上接收的卸载单元得到清洁和干燥的抛光工件。

7. 发明授权

US06997782B2 Polishing apparatus and a method of polishing and cleaning and drying a wafer 失效
公开(公告)号：US06997782B2
公开(公告)日：2006-02-14
申请号：US10255793
申请日：2002-09-27
申请人： Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
发明人： Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
IPC分类号： B24B1/00
CPC分类号： B24B37/345 , B08B1/04 , B08B15/02 , B24B27/0023 , B24B51/00 , B24B55/12 , F24F3/161 , H01L21/67017 , H01L21/67028 , H01L21/67057 , H01L21/67219
摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

8. 发明授权

US5827110A Polishing facility 失效
标题翻译：抛光设备
公开(公告)号：US5827110A
公开(公告)日：1998-10-27
申请号：US580312
申请日：1995-12-28
申请人： Hiromi Yajima , Yukio Imoto , Shoichi Kodama , Riichiro Aoki , Takashi Omichi , Toyomi Nishi , Tetsuji Togawa
发明人： Hiromi Yajima , Yukio Imoto , Shoichi Kodama , Riichiro Aoki , Takashi Omichi , Toyomi Nishi , Tetsuji Togawa
IPC分类号： B08B1/04 , B24B27/00 , B24B37/04 , B24B51/00 , B24B55/12 , H01L21/00 , B24B7/22
CPC分类号： B24B37/345 , B08B1/04 , B24B27/0023 , B24B37/04 , B24B51/00 , B24B55/12 , H01L21/67028 , H01L21/67057
摘要： A polishing facility integrates separate components of polishing such as wafer transport, polishing, cleaning and drying in one standardized facility to provide efficient polishing operation at low cost. The facility is designed to deal with a variety of different types of wafers, including different types of surface film, and is designed also to enables quick and low cost upgrading of the facility to meet advancing requirements of customers. The polishing facility can be placed within a cleanroom to provide efficient handling of polished wafers for further processing and fabrication tasks. Individual work component of polishing is arranged in one block having its own power supply and signal lines, and is controlled by a central controller having a dedicated software program for each work component. Therefore, if upgrading of the facility is required on any work component, only that work component requiring attention needs to be repaired/replaced, thus eliminating the need to shut down the entire facility as in conventional polishing setups. Each work component is modularized for easy replacement and inventory purposes. The overall effect of the integrated polishing facility is that the efficiency of the polishing operation is significantly improved at minimal cost of labor and capital investments.
摘要翻译：抛光设备将单独的抛光部件如晶片输送，抛光，清洁和干燥在一个标准化设备中进行集成，以低成本提供有效的抛光操作。该设施旨在处理各种不同类型的晶片，包括不同类型的表面膜，并且还被设计成能够实现设备的快速和低成本升级以满足客户的前进要求。抛光设备可以放置在洁净室内，以提供抛光晶片的有效处理以进一步处理和制造任务。抛光的单个工作部件布置在具有其自己的电源和信号线的一个块中，并且由具有用于每个工作部件的专用软件程序的中央控制器控制。因此，如果需要在任何工作部件上升级设备，只需要修理/更换需要注意的工作部件，从而无需像传统的抛光设备那样关闭整个设备。每个工作组件都是模块化的，以便于更换和库存目的。综合抛光设备的整体效果是以最低的劳动成本和资金投入，大大提高了抛光操作的效率。

9. 发明授权

US5679059A Polishing aparatus and method 失效
标题翻译：抛光装置和方法
公开(公告)号：US5679059A
公开(公告)日：1997-10-21
申请号：US563295
申请日：1995-11-28
申请人： Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
发明人： Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
IPC分类号： H01L21/304 , B08B1/04 , B24B27/00 , B24B37/34 , B24B51/00 , B24B55/12 , F24F3/16 , H01L21/00 , B24B1/00
CPC分类号： B24B37/345 , B08B1/04 , B08B15/02 , B24B27/0023 , B24B51/00 , B24B55/12 , F24F3/161 , H01L21/67017 , H01L21/67028 , H01L21/67057 , H01L21/67219
摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.
摘要翻译：用于抛光工件表面的抛光装置包括壳体单元，将壳体单元的内部分隔成第一室和第二室的分隔壁，设置在第一室中的抛光部分，并且具有带有研磨布的转台安装在其上表面和位于转台上方的顶环，用于支撑待抛光的工件并将工件压靠在研磨布上，以及设置在第二室中并清洁已经被抛光的工件的清洁部。抛光装置还包括转印装置，用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。

10. 发明授权

US06227954B1 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06227954B1
公开(公告)日：2001-05-08
申请号：US08845423
申请日：1997-04-25
申请人： Tetsuji Togawa , Kuniaki Yamaguchi , Kunihiko Sakurai , Hiromi Yajima
发明人： Tetsuji Togawa , Kuniaki Yamaguchi , Kunihiko Sakurai , Hiromi Yajima
IPC分类号： B24B700
CPC分类号： B24B53/017
摘要： A polishing apparatus includes a top ring for holding a workpiece to be polished on a lower surface thereof, a turntable having a polishing surface for polishing a surface of the workpiece held by the top ring, and a dressing tool for dressing the polishing surface of the turntable. The top ring is movable to a first maintenance position therefor, and the dressing tool is movable to a second maintenance position therefor. The top ring, the turntable, and the dressing tool are housed in a single chamber having a plurality of side faces. The polishing surface, the first maintenance position, and the second maintenance position are positioned closely to one of the side faces of the chamber. Such one side face serves as a maintenance face for approaching the polishing surface, the first maintenance position, and the second maintenance position for maintenance of the polishing surface, the top ring and the dressing tool.
摘要翻译：抛光装置包括：用于在其下表面上保持要抛光的工件的顶环，具有用于抛光由顶环保持的工件的表面的抛光表面的转台和用于修整由所述顶环的抛光表面修整的修整工具转盘顶环可移动到其第一维护位置，并且修整工具可移动到第二维护位置。顶环，转盘和修整工具容纳在具有多个侧面的单个室中。抛光表面，第一维护位置和第二维护位置紧密地定位在腔室的一个侧面上。这样的一个侧面用作接近抛光表面，第一维护位置和第二维护位置的维护面，用于维护抛光表面，顶环和修整工具。

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