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1. 发明申请

US20060099892A1 Substrate holding apparatus and polishing apparatus 有权
公开(公告)号：US20060099892A1
公开(公告)日：2006-05-11
申请号：US11312571
申请日：2005-12-21
申请人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
发明人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
IPC分类号： B24B47/00 , B24B29/00
CPC分类号： B24B37/30 , B24B41/061 , B24B49/105
摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.

2. 发明授权

US07311585B2 Substrate holding apparatus and polishing apparatus 有权
标题翻译：基板保持装置和抛光装置
公开(公告)号：US07311585B2
公开(公告)日：2007-12-25
申请号：US11312571
申请日：2005-12-21
申请人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
发明人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
IPC分类号： B24B1/00
CPC分类号： B24B37/30 , B24B41/061 , B24B49/105
摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
摘要翻译：本发明涉及一种用于将基板（例如半导体晶片）保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。具有弹性膜的邻接构件附接到可垂直移动构件的下表面。邻接构件的弹性膜包括邻接部分，其具有向外突出的凸缘，与基底直接或间接接触;以及连接部分，其从邻接部分的凸缘的基部向上延伸并连接到垂直活动件。连接部由具有高于邻接部的材料的柔软性的材料制成。

3. 发明申请

US20080119121A1 Substrate holding apparatus and polishing apparatus 有权
标题翻译：基板保持装置和抛光装置
公开(公告)号：US20080119121A1
公开(公告)日：2008-05-22
申请号：US11987978
申请日：2007-12-06
申请人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
发明人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
IPC分类号： B24B7/04 , B24B29/02
CPC分类号： B24B37/30 , B24B41/061 , B24B49/105
摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
摘要翻译：本发明涉及一种用于将基板（例如半导体晶片）保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。具有弹性膜的邻接构件附接到可垂直移动构件的下表面。邻接构件的弹性膜包括邻接部分，其具有向外突出的凸缘，与基底直接或间接接触;以及连接部分，其从邻接部分的凸缘的基部向上延伸并连接到垂直活动件。连接部由具有高于邻接部的材料的柔软性的材料制成。

4. 发明授权

US07163895B2 Polishing method 有权
标题翻译：抛光方法
公开(公告)号：US07163895B2
公开(公告)日：2007-01-16
申请号：US10481019
申请日：2003-04-17
申请人： Tetsuji Togawa , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Osamu Nabeya , Teruhiko Ichimura
发明人： Tetsuji Togawa , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Osamu Nabeya , Teruhiko Ichimura
IPC分类号： H01L21/302
CPC分类号： B24B37/30 , B24B37/013 , B24B37/042 , H01L21/30625 , Y10S438/977
摘要： The present invention is relates to a polishing method for polishing a semiconductor wafer (W) by pressing the semiconductor wafer (W) against a polishing surface (10) with use of a top ring (23) for holding the semiconductor wafer (W). A pressure chamber (70) is defined in the top ring (23) by attaching an elastic membrane (60) to a lower surface of a vertically movable member (62). The semiconductor wafer (W) is polished while a pressurized fluid is supplied to the pressure chamber (70) so that the semiconductor wafer (W) is pressed against the polishing surface (10) by a fluid pressure of the fluid. The semiconductor wafer (W) which has been polished is released from the top ring (23) by ejecting the pressurized fluid from an opening (62a) defined centrally in the vertically movable member (62).
摘要翻译：本发明涉及通过使用用于保持半导体晶片（W）的顶环（23）将半导体晶片（W）压靠在研磨面（10）上来研磨半导体晶片（W）的研磨方法。通过将弹性膜（60）附接到可垂直移动的构件（62）的下表面，将压力室（70）限定在顶环（23）中。抛光半导体晶片（W），同时向压力室（70）供应加压流体，使得半导体晶片（W）通过流体的流体压力被压靠在抛光表面（10）上。已经被抛光的半导体晶片（W）通过从限定在可垂直移动部件（62）中心的开口（62a）喷射加压流体而从顶环（23）释放。

5. 发明申请

US20100056028A1 SUBSTRATE HOLDING APPARATUS AND POLISHING APPARATUS 审中-公开
标题翻译：基板控制装置和抛光装置
公开(公告)号：US20100056028A1
公开(公告)日：2010-03-04
申请号：US12613016
申请日：2009-11-05
申请人： Tetsuji TOGAWA , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
发明人： Tetsuji TOGAWA , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
IPC分类号： B24B41/06
CPC分类号： B24B37/30 , B24B41/061 , B24B49/105
摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
摘要翻译：本发明涉及一种用于将基板（例如半导体晶片）保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。具有弹性膜的邻接构件附接到可垂直移动构件的下表面。邻接构件的弹性膜包括邻接部分，其具有向外突出的凸缘，与基底直接或间接接触;以及连接部分，其从邻接部分的凸缘的基部向上延伸并连接到垂直活动件。连接部由具有高于邻接部的材料的柔软性的材料制成。

6. 发明授权

US07632173B2 Substrate holding apparatus and polishing apparatus 有权
标题翻译：基板保持装置和抛光装置
公开(公告)号：US07632173B2
公开(公告)日：2009-12-15
申请号：US11987978
申请日：2007-12-06
申请人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
发明人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
IPC分类号： B24B1/00
CPC分类号： B24B37/30 , B24B41/061 , B24B49/105
摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
摘要翻译：本发明涉及一种用于将基板（例如半导体晶片）保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。具有弹性膜的邻接构件附接到可垂直移动构件的下表面。邻接构件的弹性膜包括邻接部分，其具有向外突出的凸缘，与基底直接或间接接触;以及连接部分，其从邻接部分的凸缘的基部向上延伸并连接到垂直活动件。连接部由具有高于邻接部的材料的柔软性的材料制成。

7. 发明申请

US20050107015A1 Substrate holding device and polishing device 有权
标题翻译：基板保持装置和抛光装置
公开(公告)号：US20050107015A1
公开(公告)日：2005-05-19
申请号：US10497151
申请日：2002-12-06
申请人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
发明人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
IPC分类号： B24B41/06 , B24B5/00
CPC分类号： B24B37/30 , B24B41/061 , B24B49/105
摘要： The present invention relates to a substrate holding apparatus for holding a substrate (W) such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. A substrate holding apparatus according to the present invention comprises a top ring body (2) having a receiving space therein, and a vertically movable member (206) which is vertically movable within the receiving space in the top ring body. An abutment member (209) having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane (291) of the abutment member comprises an abutment portion (291b), having a flange (291a) projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion (291c) extending upwardly from a base portion (291d) of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than the abutment portion.
摘要翻译：本发明涉及一种用于将基板（W）例如半导体晶片保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。根据本发明的基板保持装置包括其中具有容纳空间的顶环主体（2）和可在顶环体中的容纳空间内垂直移动的可垂直移动构件（206）。具有弹性膜的抵接构件（209）附接到可升降构件的下表面。邻接构件的弹性膜（291）包括邻接部分（291b），其具有向外突出的与基底直接或间接接触的凸缘（291a），以及从基底向上延伸的连接部分（291c）邻接部分的凸缘的基部（291d）并且连接到可垂直移动的构件。连接部分由具有高于邻接部分的柔性的材料制成。

8. 发明授权

US07033260B2 Substrate holding device and polishing device 有权
标题翻译：基板保持装置和抛光装置
公开(公告)号：US07033260B2
公开(公告)日：2006-04-25
申请号：US10497151
申请日：2002-12-06
申请人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
发明人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
IPC分类号： B24B1/00
CPC分类号： B24B37/30 , B24B41/061 , B24B49/105
摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
摘要翻译：本发明涉及一种用于将基板（例如半导体晶片）保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。具有弹性膜的邻接构件附接到可垂直移动构件的下表面。邻接构件的弹性膜包括邻接部分，其具有向外突出的凸缘，与基底直接或间接接触;以及连接部分，其从邻接部分的凸缘的基部向上延伸并连接到垂直活动件。连接部由具有高于邻接部的材料的柔软性的材料制成。

9. 发明申请

US20060079092A1 Polishing method 审中-公开
标题翻译：抛光方法
公开(公告)号：US20060079092A1
公开(公告)日：2006-04-13
申请号：US11272825
申请日：2005-11-15
申请人： Tetsuji Togawa , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Osamu Nabeya , Teruhiko Ichimura
发明人： Tetsuji Togawa , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Osamu Nabeya , Teruhiko Ichimura
IPC分类号： H01L21/461
CPC分类号： B24B37/30 , B24B37/013 , B24B37/042 , H01L21/30625 , Y10S438/977
摘要： The present invention is relates to a polishing method for polishing a semiconductor wafer (W) by pressing the semiconductor wafer (W) against a polishing surface (10) with use of a top ring (23) for holding the semiconductor wafer (W). A pressure chamber (70) is defined in the top ring (23) by attaching an elastic membrane (60) to a lower surface of a vertically movable member (62). The semiconductor wafer (W) is polished while a pressurized fluid is supplied to the pressure chamber (70) so that the semiconductor wafer (W) is pressed against the polishing surface (10) by a fluid pressure of the fluid. The semiconductor wafer (W) which has been polished is released from the top ring (23) by ejecting the pressurized fluid from an opening (62a) defined centrally in the vertically movable member (62).
摘要翻译：本发明涉及通过使用用于保持半导体晶片（W）的顶环（23）将半导体晶片（W）压靠在研磨面（10）上来研磨半导体晶片（W）的研磨方法。通过将弹性膜（60）附接到可垂直移动的构件（62）的下表面，将压力室（70）限定在顶环（23）中。抛光半导体晶片（W），同时向压力室（70）供应加压流体，使得半导体晶片（W）通过流体的流体压力被压靠在抛光表面（10）上。已经被抛光的半导体晶片（W）通过从限定在可垂直移动部件（62）中心的开口（62a）喷射加压流体而从顶环（23）释放。

10. 发明授权

US5496752A Method of manufacturing thin film transistors in a liquid crystal display apparatus 失效
公开(公告)号：US5496752A
公开(公告)日：1996-03-05
申请号：US457264
申请日：1995-06-01
申请人： Yasuhiro Nasu , Teruhiko Ichimura , Tomotaka Matsumoto
发明人： Yasuhiro Nasu , Teruhiko Ichimura , Tomotaka Matsumoto
IPC分类号： G02F1/1343 , G02F1/136 , G02F1/1368 , H01L21/22 , H01L21/223 , H01L21/336 , H01L21/77 , H01L21/84 , H01L29/78 , H01L29/786 , H01L21/786
CPC分类号： H01L29/78696 , H01L21/2236 , H01L27/1214 , H01L29/66757 , G02F1/1368 , Y10S148/15
摘要： A first sheet of photomask is used when a gate electrode and a gate bus line are formed, a second sheet of photomask is used when patterning is applied to a semiconductor film which becomes an active layer of a transistor on the gate electrode, a third sheet of photomask is used when a pixel electrode, a source electrode, a drain electrode, a drain bus line and a drain bus terminal portion are formed, and a fourth sheet of photomask is used when a film on the drain bus terminal portion, the gate bus terminal portion and pixel portion is removed, thereby to form thin film transistors arranged in a matrix form.

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