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    • 3. 发明授权
    • Information recording method and apparatus
    • 信息记录方法和装置
    • US06728175B2
    • 2004-04-27
    • US10005419
    • 2001-12-03
    • Tetsu KimuraAkio Ishikawa
    • Tetsu KimuraAkio Ishikawa
    • G11B509
    • G11C29/70G11B20/1883G11B2220/20
    • An information recording apparatus for recording data into a recording medium taking as recording unit a sector corresponding to a predetermined amount of information signal, comprises a file management unit (5) to classify an information signal for recording into the recording medium (101) into a number, two or more, of groups depending upon the importance of the information signal, and a write/read unit (6) to record the information signal into the recording medium (101) while dealing with a defective sector, if any, in the recording medium (101) in a manner designated for the group to which the information signal has been classified to belong at the above classifying step, and record a highly important information signal, when a defective sector is found by checking up the information signal recorded in the recording medium (101), into another sector.
    • 一种信息记录装置,用于将记录数据记录到作为记录单元的与预定量的信息信号相对应的扇区的记录介质中,包括文件管理单元(5),用于将用于记录的信息信号分类为记录介质(101) 数量,两个或更多个组,以及写入/读取单元(6),用于在将信息信号记录在记录介质(101)中的缺陷扇区(如果有的话)中记录 记录介质(101),其中信息信号已被分类的组被指定为属于上述分类步骤,并记录高度重要的信息信号,当通过检查记录在 记录介质(101)进入另一扇区。
    • 5. 发明申请
    • Process for the Production of a Layered Body and Layered Bodies Obtainable Therefrom
    • 生产分层体和分层体的方法
    • US20140313433A1
    • 2014-10-23
    • US14131614
    • 2012-07-06
    • Udo GuntermannDetlef GaiserMyriam GrasseAkio Ishikawa
    • Udo GuntermannDetlef GaiserMyriam GrasseAkio Ishikawa
    • G06F3/041
    • Described is a process for the production of a layered body S2 comprising: i. provision of a layered body S1 comprising a substrate and an electrically conductive layer which is applied to the substrate and comprises an electrically conductive polymer P1; ii. partial covering of a part of the electrically conductive layer with a covering layer D, comprising a polymer P2 contained therein, from a covering phase to obtain at least one covered region Dd and at least one non-covered region Du of the electrically conductive layer; iii. reduction of the electrical conductivity of the electrically conductive layer in at least a part of the at least one non-covered region Du compared with the electrical conductivity of the electrically conductive layer in the at least one covered region Dd; iv. at least partial removal of the covering layer D by an alkaline aqueous treatment.
    • 描述了生产层状体S2的方法,包括:i。 提供层叠体S1,其包括衬底和施加到衬底并且包括导电聚合物P1的导电层; ii。 部分覆盖导电层的一部分覆盖层D,其中包含聚合物P2包含在其中的覆盖层,以获得导电层的至少一个覆盖区域Dd和至少一个非覆盖区域Du; iii。 在所述至少一个非覆盖区域Du的至少一部分中导电层的导电率降低至与所述至少一个覆盖区域Dd中的所述导电层的导电率相比较; iv。 通过碱性水性处理至少部分去除覆盖层D.
    • 7. 发明授权
    • Defect and critical dimension analysis systems and methods for a semiconductor lithographic process
    • 半导体光刻工艺的缺陷和关键尺寸分析系统和方法
    • US08422761B2
    • 2013-04-16
    • US12637331
    • 2009-12-14
    • Tadashi KitamuraAkio Ishikawa
    • Tadashi KitamuraAkio Ishikawa
    • G06K9/00
    • G06T7/0006G06T7/13G06T2207/30148
    • Apparatus and method evaluate a wafer fabrication process for forming patterns on a wafer based upon design data. Within a recipe database, two or more inspection regions are defined on the wafer for analysis. Patterns within each of the inspection regions are automatically selected based upon tendency for measurement variation resulting from variation in the fabrication process. For each inspection region, at least one image of patterns within the inspection region is captured, a reference pattern, represented by one or both of (a) one or more line segments and (b) one or more curves, is automatically generated from the design data. An inspection unit detects edges within each of the images and registers the image with the reference pattern. One or more measurements are determined from the edges for each of the selected patterns and are processed within a statistical analyzer to form statistical information associated with the fabrication process.
    • 基于设计数据,装置和方法评估在晶片上形成图案的晶片制造工艺。 在配方数据库中,在晶片上定义两个或更多个检查区域用于分析。 基于制造过程的变化导致的测量变化的趋势,自动地选择每个检查区域内的图案。 对于每个检查区域,捕获检查区域内的图案的至少一个图像,由(a)一个或多个线段和(b)一个或多个曲线中的一个或两个表示的参考图案从 设计数据。 检查单元检测每个图像内的边缘,并用参考图案注册图像。 从针对每个所选择的图案的边缘确定一个或多个测量值,并在统计分析器内处理以形成与制造过程相关联的统计信息。
    • 8. 发明授权
    • Calibration apparatus and method for imaging devices and computer program
    • 用于成像装置和计算机程序的校准装置和方法
    • US08164633B2
    • 2012-04-24
    • US12350621
    • 2009-01-08
    • Mehrdad Panahpour TehraniAkio IshikawaShigeyuki Sakazawa
    • Mehrdad Panahpour TehraniAkio IshikawaShigeyuki Sakazawa
    • H04N17/00H04N17/02
    • G06T7/80
    • The present invention relates to calibration of camera parameters for converting a world coordinate system, which indicates a position in the real space, to a coordinate used in an image and vice versa. The apparatus according to the invention has a detection unit, which determines corresponding pixel pairs from the captured image and the model image and outputs corresponding data indicating determined pixel pairs, and a selection unit, which selects pixel pairs to be left in the corresponding data and removes data related to an unselected pixel pair from the corresponding data for generating selected corresponding data. The apparatus further has a calculation unit, which calculates camera parameters based on the selected corresponding data.
    • 本发明涉及用于将指示真实空间中的位置的世界坐标系转换为图像中使用的坐标的相机参数的校准,反之亦然。 根据本发明的装置具有检测单元,该检测单元从捕获的图像和模型图像确定相应的像素对,并输出指示确定的像素对的对应数据,以及选择单元,其选择要留在相应数据中的像素对,以及 从相应的数据移除与未选择的像素对有关的数据,以产生所选择的相应数据。 该装置还具有计算单元,其基于所选择的相应数据来计算摄像机参数。
    • 9. 发明申请
    • System And Method For A Semiconductor Lithographic Process Control Using Statistical Information In Defect Identification
    • 使用统计信息进行缺陷识别的半导体平版印刷过程控制的系统和方法
    • US20100215247A1
    • 2010-08-26
    • US12725141
    • 2010-03-16
    • Tadashi KitamuraAkio Ishikawa
    • Tadashi KitamuraAkio Ishikawa
    • G06K9/00
    • G06T7/001G06T2207/10004G06T2207/30148
    • A system and method is described for evaluating a wafer fabrication process for forming patterns on a wafer based upon data. Multiple inspection regions are defined on the wafer for analysis. For each inspection region, images of patterns within the inspection region are captured, edges are detected, and lines are registered to lines of a reference pattern automatically generated from the design data. Line widths are determined from the edges. Measured line widths are analyzed to provide statistics and feedback information regarding the fabrication process. In particular embodiments defects are identified as where measured line widths lie outside boundaries determined from the statistics. In particular embodiments, lines of different drawn width and/or orientation are grouped and analyzed separately. Measured line widths may also be grouped for analysis according to geometry such as shape or proximity to other shapes in the inspection region to provide feedback for optical proximity correction rules.
    • 描述了一种基于数据来评估在晶片上形成图案的晶片制造工艺的系统和方法。 在晶片上定义多个检查区域用于分析。 对于每个检查区域,捕获检查区域内的图案的图像,检测边缘,并且将线注册到从设计数据自动生成的参考图案的线上。 线宽从边缘确定。 分析测量线宽以提供关于制造过程的统计和反馈信息。 在特定实施例中,将缺陷识别为测量的线宽在从统计确定的边界之外的位置。 在特定实施例中,将不同拉伸宽度和/或取向的线分开并分开分析。 测量的线宽也可以根据诸如形状或检查区域中其他形状的接近度的几何形状进行分组,以提供用于光学邻近校正规则的反馈。
    • 10. 发明授权
    • Image defect inspection method, image defect inspection apparatus, and appearance inspection apparatus
    • 图像缺陷检查方法,图像缺陷检查装置和外观检查装置
    • US07492942B2
    • 2009-02-17
    • US11206706
    • 2005-08-17
    • Akio IshikawaShinji Ueyama
    • Akio IshikawaShinji Ueyama
    • G06K9/00
    • G01N21/95607
    • In an image defect inspection method and apparatus, which detects a gray level difference between the corresponding portions of two images, automatically sets a threshold value based on the distribution of the detected gray level difference, compares the detected gray level difference with the threshold value, and judges one or the other of the portions to be defective if the gray level difference is larger than the threshold value, provisions are made to reduce the occurrence of false defects when there is a brightness difference between the two images undergoing the comparison. In the image defect inspection method, the brightness difference between the two images is computed (S106), and the threshold value is determined in such a manner that the threshold value increases with the computed brightness difference (S107).
    • 在检测两个图像的对应部分之间的灰度差的图像缺陷检查方法和装置中,基于检测到的灰度级差的分布自动设置阈值,将检测到的灰度级差与阈值进行比较, 并且如果灰度级差大于阈值,则判断出有缺陷的部分中的一个或另一个部分,当进行比较的两个图像之间存在亮度差时,进行减少假缺陷的发生。 在图像缺陷检查方法中,计算两个图像之间的亮度差(S106),并且以阈值随计算的亮度差增大的方式确定阈值(S107)。