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    • 1. 发明申请
    • BOARD-WARPING MEASURING APPARATUS AND BOARD-WARPING MEASURING METHOD THEREOF
    • 板式加温测量装置及板式加热测量方法
    • US20160209206A1
    • 2016-07-21
    • US14694421
    • 2015-04-23
    • Test Research, Inc.
    • Liang-Pin YUYing-Lin PANChi-Yang LIN
    • G01B11/16G01B11/25
    • G01B11/167G01B11/2504G01B11/2513G01B11/306
    • A board-warping measuring method is configured to measure a device under test. The device under test is disposed on a measuring carrier. The board-warping measuring method includes: projecting a pattern onto the device under test, wherein the pattern includes plural reference points; capturing a measurement image by an image-capturing module when the pattern is projected onto the device under test, wherein the measurement image includes plural measurement points respectively corresponding to the reference points; calculating a position of each of the measurement points in the measurement image by utilizing a transfer function corresponding to each of the reference points to obtain position heights of the device under test corresponding to the measurement points; and compensating for board warping of the device under test based on the position heights of the device under test corresponding to the measurement points.
    • 板翘曲测量方法被配置为测量被测设备。 被测设备设置在测量载体上。 板翘曲测量方法包括:将图案投影到被测设备上,其中图案包括多个参考点; 当图案被投影到被测设备上时,通过图像捕获模块捕获测量图像,其中测量图像包括分别对应于参考点的多个测量点; 通过利用与每个参考点相对应的传递函数来计算测量图像中的每个测量点的位置,以获得对应于测量点的被测设备的位置高度; 并基于被测设备的位置高度对应于测量点来补偿被测设备的板翘曲。