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1. 发明授权

US09282640B2 Interconnection element with posts formed by plating 有权
公开(公告)号：US09282640B2
公开(公告)日：2016-03-08
申请号：US13929291
申请日：2013-06-27
申请人： Tessera, Inc.
发明人： Jinsu Kwon , Kimitaka Endo , Sean P. Moran
IPC分类号： H05K1/11 , H01R9/00 , H01L21/48 , H01L21/683 , H01L23/498 , H05K3/40 , H01L23/00 , H05K3/20 , H05K3/46
CPC分类号： H05K1/11 , H01L21/4853 , H01L21/6835 , H01L23/498 , H01L23/49811 , H01L23/49822 , H01L24/05 , H01L24/16 , H01L2221/68345 , H01L2224/0401 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H05K3/205 , H05K3/4007 , H05K3/4644 , H05K2201/0367 , H05K2203/0384 , Y10T29/49124 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T29/49204 , H01L2924/00
摘要： An interconnection element is provided for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element having a major surface. A plated metal layer including a plurality of exposed metal posts can project outwardly beyond the major surface of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element. The interconnection element typically includes a plurality of terminals in conductive communication with the metal posts. The terminals can be connected through the dielectric element to the metal posts. The posts may be defined by plating a metal onto exposed co-planar surfaces of a mandrel and interior surfaces of openings in a mandrel, after which the mandrel can be removed.

2. 发明申请

US20150054153A1 FLIP CHIP INTERCONNECTION WITH DOUBLE POST 审中-公开
标题翻译： FLIP芯片互连与双页POST
公开(公告)号：US20150054153A1
公开(公告)日：2015-02-26
申请号：US14532396
申请日：2014-11-04
申请人： Tessera, Inc.
发明人： Jinsu Kwon
IPC分类号： H01L23/00 , H01L23/31
摘要： A method of assembling a packaged microelectronic element is disclosed that includes the steps of providing a microelectronic element having a plurality of conductive posts extending away from a first surface of a microelectronic element, the posts having top surfaces and edge surfaces extending abruptly away from the top surfaces, and a fusible metal cap attached to an end of each of the plurality of posts; at least substantially aligning the posts of the microelectronic element with a plurality of conductive posts extending from a first surface of a substrate, the posts of the substrate having top surfaces and edge surfaces extending abruptly away from the top surfaces; and joining the posts of the microelectronic element with the posts of the substrate.
摘要翻译：公开了一种组装封装的微电子元件的方法，其包括提供具有远离微电子元件的第一表面延伸的多个导电柱的微电子元件的步骤，所述柱具有从顶部突出延伸的顶表面和边缘表面表面和附接到多个柱中的每一个的端部的可熔金属盖; 至少使所述微电子元件的所述柱与从基板的第一表面延伸的多个导电柱对准，所述基板的所述柱具有从所述顶表面突然远离的顶表面和边缘表面; 并且将微电子元件的柱与基板的柱接合。

3. 发明申请

US20130286619A1 INTERCONNECTION ELEMENT WITH POSTS FORMED BY PLATING 有权
标题翻译：具有由镀层形成的位置的互连元件
公开(公告)号：US20130286619A1
公开(公告)日：2013-10-31
申请号：US13929291
申请日：2013-06-27
申请人： Tessera, Inc.
发明人： Jinsu Kwon , Kimitaka Endo , Sean P. Moran
IPC分类号： H05K1/11
CPC分类号： H05K1/11 , H01L21/4853 , H01L21/6835 , H01L23/498 , H01L23/49811 , H01L23/49822 , H01L24/05 , H01L24/16 , H01L2221/68345 , H01L2224/0401 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H05K3/205 , H05K3/4007 , H05K3/4644 , H05K2201/0367 , H05K2203/0384 , Y10T29/49124 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T29/49204 , H01L2924/00
摘要： An interconnection element is provided for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element having a major surface. A plated metal layer including a plurality of exposed metal posts can project outwardly beyond the major surface of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element. The interconnection element typically includes a plurality of terminals in conductive communication with the metal posts. The terminals can be connected through the dielectric element to the metal posts. The posts may be defined by plating a metal onto exposed co-planar surfaces of a mandrel and interior surfaces of openings in a mandrel, after which the mandrel can be removed.
摘要翻译：提供互连元件用于与具有微电子器件或其上的布线中的至少一个的另一元件的导电互连。互连元件包括具有主表面的电介质元件。包括多个暴露的金属柱的电镀金属层可以向外突出超过介电元件的主表面。一些金属柱可以通过电介质元件彼此电绝缘。互连元件通常包括与金属柱导电连通的多个端子。端子可以通过电介质元件连接到金属柱。可以通过将金属镀在芯棒的暴露的共平面表面和心轴中的开口的内表面上来定义柱，然后可以去除心轴。

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