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1. 发明申请

US20090280311A1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE 审中-公开
标题翻译：聚酰胺树脂组合物和成型品
公开(公告)号：US20090280311A1
公开(公告)日：2009-11-12
申请号：US12302095
申请日：2007-05-25
申请人： Teruhisa Kumazawa , Kei Morimoto
发明人： Teruhisa Kumazawa , Kei Morimoto
IPC分类号： C08K3/40 , C08L77/00 , C08K3/34
CPC分类号： C08L77/00 , C08K7/00 , C08K7/02 , C08L77/06 , C08L2205/02 , C08L2205/14 , C08L2205/16 , C08L2666/20
摘要： In the present invention, there is provided a polyamide resin composition for portable electronic devices, which is excellent in mechanical strength, thin-wall moldability, crystallinity and warping property.A polyamide resin composition comprising 30 to 80% by weight of a polyamide MP (A), 20 to 70% by weight of a polyamide resin (B) having a melting point not less than 245° C. (with the total amount of both being 100% by weight). The composition additionally comprises a filler (C) comprising a fibrous filler (C1) as an optional component and a plate-like filler (C2) as an essential component, wherein a content ratio (C1):(C2) is 0:10 to 9:1. The filler (C) is present in an amount of 30 to 250 parts by weight per 100 parts by weight of the sum of the polyamide MP (A) and the polyamide resin (B). The polyamide MP (A) is a polyamide resin obtained by polycondensation of a mixed diamine, which comprises 90 to 50% by mole of metaxylylenediamine and 10 to 50% by mole of paraxylylenediamine, with an α,ω-linear aliphatic dibasic acid and/or an aromatic dibasic acid.
摘要翻译：在本发明中，提供了机械强度，薄壁成型性，结晶性和翘曲性优异的便携式电子器件用聚酰胺树脂组合物。一种聚酰胺树脂组合物，其包含30〜80重量％的聚酰胺MP（A），20〜70重量％的熔点不低于245℃的聚酰胺树脂（B）（两者的总量为100重量％）。所述组合物还含有包含作为任选成分的纤维状填料（C1）和作为必需成分的板状填料（C2））的填料（C），其中，含量比（C1）：（C2）为0:10〜 9：1。填料（C）的存在量为每100重量份聚酰胺MP（A）和聚酰胺树脂（B）之和为30至250重量份。聚酰胺MP（A）是通过将包含90〜50摩尔％的间苯二甲胺和10〜50摩尔％的对二甲苯二胺的混合二胺与α，ω-直链脂肪族二元酸和/ 或芳族二元酸。

2. 发明申请

US20100227122A1 Polyamide Resin Composition for Portable Electronic Device and Molded Article for Portable Electronic Device 审中-公开
标题翻译：便携式电子装置用聚酰胺树脂组合物及便携式电子装置的成型品
公开(公告)号：US20100227122A1
公开(公告)日：2010-09-09
申请号：US12087482
申请日：2006-12-19
申请人： Teruhisa Kumazawa , Takahiro Takano , Kei Morimoto
发明人： Teruhisa Kumazawa , Takahiro Takano , Kei Morimoto
IPC分类号： C08K3/40 , C08K3/34 , B32B3/30
CPC分类号： C08L77/00 , B29C45/0001 , B29C45/0005 , B29K2077/00 , B29L2031/445 , C08J5/047 , C08J5/08 , C08J2377/00 , C08J2377/02 , C08J2377/06 , C08K7/14 , C08K2201/016 , C08L53/02 , C08L53/025 , C08L77/02 , C08L77/06 , C08L2205/02 , C08L2666/20 , C08L2666/24
摘要： Provided is a polyamide resin composition having particularly excellent strength and low warpage by virtue of being compounded with a glass fiber and suited as a material for portable electronic devices that are becoming thinner and lighter in weight in recent years.A polyamide resin composition for a portable electronic device, including (A) a polyamide resin, (B) a glass fiber having an elongated cross-section with an aspect ratio, defined by the formula shown below, of 2.5 or more, and optionally (C) a glass fiber having a circular cross-section with a diameter of 3 to 30 μm, wherein the ratio (by weight) of the component (B) to the component (c) is 3:7 to 10:0, wherein the proportion of the component (A) is 60 to 34% by weight, and the proportion of the component (B) or the proportion of the sum of the components (B) and (C) is 40 to 66% by weight with the proviso that the total sum of the above components is 100% by weight, and wherein the polyamide composition shows a tensile strength of 200 MPa or higher as measured for an ISO test piece thereof, Aspect ratio=(Major axis length D2 of the cross-section of the glass fiber)/(Minor axis length D1 of the cross-section of the glass fiber).
摘要翻译：本发明提供一种具有特别优异的强度和低翘曲的聚酰胺树脂组合物，其与玻璃纤维复合，并且适合作为近年来变得越来越薄且重量更轻的便携式电子设备的材料。一种用于便携式电子设备的聚酰胺树脂组合物，其包含（A）聚酰胺树脂，（B）具有由下式表示的纵横比的细长横截面为2.5或更大的玻璃纤维，以及任选（ C）具有直径为3至30μm的圆形横截面的玻璃纤维，其中组分（B）与组分（c）的重量比（重量）为3:7至10:0，其中成分（A）的比例为60〜34重量％，成分（B）的比例或成分（B）和（C）之和的比例为40〜66重量％，条件是上述成分的总量为100重量％，其中聚酰胺组合物的ISO试验片的拉伸强度为200MPa以上，纵横比=（截面的主轴长度D2 的玻璃纤维）/（玻璃纤维的横截面的小轴长度D1）。

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