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1. 发明申请

US20130244367A1 HYDROGENATED BLOCK COPOLYMER HAVING ALKOXYSILYL GROUP AND USE THEREFOR 审中-公开
标题翻译：具有烷氧基的氢化嵌段共聚物及其用途
公开(公告)号：US20130244367A1
公开(公告)日：2013-09-19
申请号：US13877119
申请日：2011-09-29
申请人： Teiji Kohara , Atsushi Ishiguro , Ryuta Kurihara
发明人： Teiji Kohara , Atsushi Ishiguro , Ryuta Kurihara
IPC分类号： H01L31/048
CPC分类号： C08F8/42 , B32B7/08 , B32B7/12 , B32B27/08 , B32B27/18 , B32B27/28 , B32B27/283 , B32B27/30 , B32B27/302 , B32B27/308 , B32B27/32 , B32B27/36 , B32B27/365 , B32B2250/02 , B32B2250/03 , B32B2250/24 , B32B2250/40 , B32B2307/412 , B32B2307/54 , B32B2307/712 , B32B2307/7246 , B32B2307/748 , B32B2307/752 , B32B2457/12 , C08F8/04 , C08F287/00 , C08F297/04 , C08F2800/20 , C08F2810/50 , H01L31/0481 , Y02E10/50 , Y10T428/31663 , C08F230/08 , C08F297/046
摘要： Provided are: an alkoysilyl group-containing hydrogenated block copolymer produced by introducing an alkoxysilyl group into a hydrogenated block copolymer that is obtained by hydrogenating 90% or more of unsaturated bonds of a block copolymer that includes at least two polymer blocks [A] and at least one polymer block [B], the polymer block [A] including a repeating unit derived from an aromatic vinyl compound as a main component, the polymer block [B] including a repeating unit derived from a linear conjugated diene compound as a main component, and a ratio (wA:wB) of a weight fraction wA of the polymer block [A] in the block copolymer to a weight fraction wB of the polymer block [B] in the block copolymer being 20:80 to 60:40; a method for producing the same; a solar cell element encapsulating material; a sheet, a laminated sheet; a multilayer sheet; and a method for encapsulating a solar cell element. The alkoxysilyl group-containing hydrogenated block copolymer exhibits low hygroscopicity, a low water vapor permeability, transparency, weatherability, and flexibility, maintains excellent adhesion to glass even when exposed to a high-temperature/high-humidity environment for a long time, and can encapsulate a solar cell element without applying a special waterproof treatment.
摘要翻译：提供：通过将烷氧基甲硅烷基引入氢化嵌段共聚物中制备的含有链烷醚基的氢化嵌段共聚物，该氢化嵌段共聚物是通过使含有至少两个聚合物嵌段[A]的嵌段共聚物的90％以上的不饱和键氢化而得到的，至少一个聚合物嵌段[B]，聚合物嵌段[A]包含衍生自芳族乙烯基化合物作为主要成分的重复单元，聚合物嵌段[B]包含以线性共轭二烯化合物为主要成分的重复单元，嵌段共聚物中聚合物嵌段[A]的重量分数wA与嵌段共聚物中聚合物嵌段[B]的重量分数wB的比（wA：wB）为20:80〜60:40; 其制造方法; 太阳能电池元件封装材料; 片材，层压片材; 多层片材以及封装太阳能电池元件的方法。含有烷氧基甲硅烷基的氢化嵌段共聚物具有低吸湿性，低透湿性，耐候性和柔软性，即使长时间暴露于高温/高湿度环境下，也能保持对玻璃的优异粘合性，并且可以封装太阳能电池元件而不进行特殊的防水处理。

2. 发明申请

US20130008506A1 RESIN COMPOSITION FOR ENCAPSULATING SOLAR CELL AND SOLAR MODULE 审中-公开
标题翻译：用于封装太阳能电池和太阳能模块的树脂组合物
公开(公告)号：US20130008506A1
公开(公告)日：2013-01-10
申请号：US13520715
申请日：2011-02-01
申请人： Naoki Tanahashi , Teiji Kohara
发明人： Naoki Tanahashi , Teiji Kohara
IPC分类号： C08L79/02 , C08K5/3475 , C08K5/52 , C08K5/3435 , H01L31/0203 , C08F257/02
CPC分类号： C08L53/025 , C08K5/005 , C08K5/3475 , C08K5/3492 , C08K5/523 , C09J153/025 , H01L31/0481 , Y02E10/50
摘要： A resin composition comprising a hydrogenated block copolymer which is used for a resin composition for encapsulating a solar cell is provided. The hydrogenated block copolymer can be obtained by hydrogenating 90% or more of the total unsaturated bonds of block copolymers which comprise at least two polymer blocks [A] having an aromatic vinyl compound-origin repeating unit as the main component and at least one polymer block [B] comprising a chain-type conjugated diene compound-origin repeating unit as the main component and in which the ratio (wA:wB) of the weight fraction (wA) of the total polymer blocks [A], relative to the total block copolymer, to the weight fraction (wB) of the total polymer block [B] is 20:80 to 60:40. The resin composition has a tensile elasticity (at 23° C.) of 1.0-500 MPa and is excellent in low hygroscopicity, non-hydrolyzablity, weather resistance, transparency, adhesiveness, flexibility, and adhesive properties with glass, and can be used for encapsulating a solar cell without providing special impermeable treatment. Also provided is a solar module in which a solar cell is encapsulated with the resin composition.
摘要翻译：提供一种包含用于封装太阳能电池的树脂组合物的氢化嵌段共聚物的树脂组合物。氢化嵌段共聚物可以通过将含有至少两个具有芳香族乙烯基化合物起始重复单元的聚合物嵌段[A]作为主要成分的嵌段共聚物的总不饱和键的90％以上的氢化，以及至少一种聚合物嵌段 [B]包含链型共轭二烯化合物起始重复单元作为主要成分，其中总聚合物嵌段[A]的重量分数（wA）的比（wA：wB）相对于总嵌段共聚物与总聚合物嵌段[B]的重量分数（wB）为20:80至60:40。该树脂组合物的拉伸弹性（23℃）为1.0-500MPa，并且具有优异的低吸湿性，非水解性，耐候性，透明性，粘合性，柔韧性和与玻璃的粘合性，并且可用于封装太阳能电池而不提供特殊的不渗透处理。还提供了一种太阳能组件，其中太阳能电池被树脂组合物包封。

3. 发明申请

US20100076396A1 HYDROGENATED NORBORNENE-BASED RING-OPENING POLYMERIZATION POLYMER, RESIN COMPOSITION, AND MOLDED OBJECT 审中-公开
标题翻译：基于NORBORNENE的开环聚合聚合物，树脂组合物和模塑对象
公开(公告)号：US20100076396A1
公开(公告)日：2010-03-25
申请号：US12439360
申请日：2007-08-31
申请人： Haruhiko Takahashi , Teiji Kohara , Nobuhiro Kudo , Koichi Ikeda , Tokudai Ogawa , Takeshi Hirata
发明人： Haruhiko Takahashi , Teiji Kohara , Nobuhiro Kudo , Koichi Ikeda , Tokudai Ogawa , Takeshi Hirata
IPC分类号： A61J1/10 , C08F132/08 , C08L55/00 , B32B27/08 , B32B1/00
CPC分类号： C08G61/08 , B32B15/08 , B32B15/20 , B32B27/08 , B32B27/18 , B32B27/28 , B32B27/286 , B32B27/30 , B32B27/302 , B32B27/304 , B32B27/306 , B32B27/32 , B32B27/325 , B32B27/34 , B32B27/36 , B32B27/365 , B32B2307/306 , B32B2307/412 , B32B2307/50 , B32B2307/558 , B32B2307/714 , B32B2307/7242 , B32B2439/70 , B32B2439/80 , C08G2261/3324 , C08G2261/724 , Y10T428/1345 , Y10T428/1352 , Y10T428/3175 , Y10T428/31757 , Y10T428/31797 , Y10T428/31855 , Y10T428/31909 , Y10T428/31913 , Y10T428/31938
摘要： A hydrogenated norbornene ring-open polymer obtained by hydrogenating 80% or more of main-chain carbon-carbon double bonds of a ring-open polymer which is obtained by ring-opening polymerization of 2-norbornene is disclosed. The hydrogenated norbornene ring-open polymer has a weight average molecular weight (Mw) determined by gel permeation chromatography (GPC) of 50,000 to 200,000, a molecular weight distribution (Mw/Mn) of 1.5 to 10.0, and a melting point of 110 to 145° C. Also disclosed is a hydrogenated norbornene ring-open polymer (hydrogenated polymer) obtained by hydrogenating 80% or more of carbon-carbon double bonds of a ring-open polymer which is obtained by ring-opening copolymerization of 2-norbornene and a substituent-containing norbornene monomer, wherein the proportion of a repeating unit (A) derived from the 2-norbornene with respect to all repeating units is 90 to 99 wt % and the proportion of a repeating unit (B) derived from the substituent-containing norbornene monomer with respect to all repeating units is 1 to 10 wt %. The hydrogenated ring-open polymer has a melting point of 110 to 145° C. A resin composition and a molding material containing these hydrogenated polymers, a molded article, a resin film, a resin sheet, a multilayer laminate, a packing material, a molded article for medical supplies, a blister molding sheet, a blister molded article, and a multilayer blow-molded container made of these hydrogenated polymers are also disclosed.
摘要翻译：公开了通过2-取代降冰片烯的开环聚合获得的开环聚合物的80％以上的主链碳 - 碳双键氢化得到的氢化降冰片烯开环聚合物。氢化降冰片烯开环聚合物通过凝胶渗透色谱法（GPC）测定的重均分子量（Mw）为50,000〜200,000，分子量分布（Mw / Mn）为1.5〜10.0，熔点为110〜 145℃。还公开了通过将通过2-降冰片烯的开环共聚获得的开环聚合物的80％以上的碳 - 碳双键氢化得到的氢化降冰片烯开环聚合物（氢化聚合物）和含有取代基的降冰片烯单体，其中，来自2-降冰片烯的重复单元（A）相对于所有重复单元的比例为90〜99重量％，衍生自取代基的降冰片烯的重复单元（B）含有降冰片烯单体相对于所有重复单元为1〜10重量％。氢化开环聚合物的熔点为110〜145℃。树脂组合物和含有这些氢化聚合物的成型材料，模塑制品，树脂膜，树脂片，多层压板，包装材料，还公开了用于医疗用品的模制品，泡罩成型片，泡罩模制品和由这些氢化聚合物制成的多层吹塑容器。

4. 发明授权

US06630234B1 Polymeric film and film capacitor 有权
标题翻译：聚合物膜和薄膜电容器
公开(公告)号：US06630234B1
公开(公告)日：2003-10-07
申请号：US09446309
申请日：1999-12-20
申请人： Hajime Tanisho , Yuichiro Konishi , Teiji Kohara
发明人： Hajime Tanisho , Yuichiro Konishi , Teiji Kohara
IPC分类号： B32B516
CPC分类号： C08J5/18 , C08J2345/00 , C08J2365/00 , H01G4/18 , H01G4/206 , Y10T428/25 , Y10T428/252 , Y10T428/258 , Y10T428/26 , Y10T428/31 , Y10T428/31678 , Y10T428/31692 , Y10T428/31696 , Y10T428/31855 , Y10T428/31931
摘要： By using a polymeric film having a dielectric loss tangent of 0.002 or less measured at a frequency in the range of 1 kHz to 1 GHz at a temperature of 25 ° C., heat generation of dielectric loss of capacitors can be reduced and rising of temperature can be inhibited, and, can highly stand the rise of temperature, whereby further miniaturization and increase in capacity of capacitors become possible. Furthermore, the problems in handling that the films are apt to cut or become entangled at the rewinding step can be greatly improved by using polymeric films which are 1 or less in friction coefficient between the films of the same material. Accordingly, the polymeric films are excellent in performance of insulator film, namely, small in dielectric loss tangent, and, moreover, are free from the problems in handling that the films are apt to cut or become entangled at the rewinding step. Furthermore, the polymeric films are suitable for film capacitors.
摘要翻译：通过使用在25℃的温度下以1kHz〜1GHz的频率测定的介电损耗角正切为0.002以下的聚合物膜，可以降低电容器的介电损耗的发热和温度的升高可以被抑制，并且可以高度地承受温度的上升，从而可以进一步小型化和增加电容器的容量。此外，通过使用相同材料的膜之间的摩擦系数为1以下的聚合物膜，可以大大提高处理在回绕步骤中易于切割或变得缠结的问题。因此，聚合物膜的绝缘膜的性能优异，即介电损耗角正切较小，而且在回卷工序中，薄膜易于切割或缠绕的问题也不存在。此外，聚合物膜适用于薄膜电容器。

5. 发明授权

US5681900A Hydrogenated norbornene ring-opening polymerization product, a process for production thereof and uses thereof 失效
标题翻译：氢化降冰片烯开环聚合产物，其制备方法和用途
公开(公告)号：US5681900A
公开(公告)日：1997-10-28
申请号：US537866
申请日：1996-01-22
申请人： Toshihide Murakami , Teiji Kohara , Tadao Natsuume
发明人： Toshihide Murakami , Teiji Kohara , Tadao Natsuume
IPC分类号： C08G61/06 , C08G61/08 , G02B1/04 , H01B3/30 , C08F32/08
CPC分类号： C08G61/08
摘要： A resin obtained by subjecting a norbornene type monomer having an aromatic ring structure (e.g. 5-phenyl-2-norbornene) to ring-opening polymerization and hydrogenating 95% or more of the unsaturated bonds in the backbone structure of the resulting polymer by the use of a catalyst composed of a combination of a transition metal compound and an alkyl metal compound, while leaving 80% or more of the aromatic ring structures, which resin has not only a high refractive index but also characteristics of a hydrogenated norbornene ring-opening polymerization product, i.e., excellent heat resistance, transparency, low birefringent properties, weather resistance, light resistance, low water absorption properties, moisture resistance, small dielectric constant, small dielectric loss, chemical resistance, etc., said resin being usable in optical materials, medical tools and materials, tools and materials for treating electronic parts, etc.
摘要翻译： PCT No.PCT / JP94 / 01244 Sec。 371日期1996年1月22日 102（e）日期1996年1月22日PCT提交1994年7月28日PCT公布。出版物WO95 / 04096 日期1995年2月9日通过使具有芳环结构的降冰片烯型单体（例如5-苯基-2-降冰片烯）进行开环聚合，并在其主链结构中氢化95％以上的不饱和键而得到的树脂通过使用由过渡金属化合物和烷基金属化合物的组合组成的催化剂，同时留下80％或更多的芳族环结构，该树脂不仅具有高折射率，而且具有氢化特性降冰片烯开环聚合产物，即优异的耐热性，透明性，低双折射性，耐候性，耐光性，低吸水性，耐湿性，介电常数小，介电损耗小，耐化学腐蚀等特性。可用于光学材料，医疗工具和材料，用于处理电子部件的工具和材料等。

6. 发明授权

US5580934A Ring-opening hydrogenated copolymer and process for producing the same 失效
标题翻译：开环氢化共聚物及其制备方法
公开(公告)号：US5580934A
公开(公告)日：1996-12-03
申请号：US476489
申请日：1990-06-07
申请人： Yoshikatsu Nishi , Masayoshi Oshima , Teiji Kohara , Tadao Natsuume
发明人： Yoshikatsu Nishi , Masayoshi Oshima , Teiji Kohara , Tadao Natsuume
IPC分类号： C08G61/08 , C08F232/08 , C08F8/04
CPC分类号： C08G61/08
摘要： There are disclosed a polycyclic norbornene or its derivative hydrogenated copolymer which containsa repeating unit represented by the following formula [I] or the alkyl-substituted derivative thereof (A),a repeating unit represented by the following formula [II] or the alkyl-substituted derivative thereof (B) and, as desired,5-85% by mole of at least one repeating unit (C) selected from a repeating unit represented by the following formula [III], the alkyl-substituted derivative thereof, a repeating unit represented by the following formula [IV], the alkyl-substituted derivative and the alkylidene-substituted derivative thereof, and a process for producing the polycyclic norbornene or its derivative ring-opening hydrogenated copolymer ##STR1## wherein ------ represents either a single bond or a double bond.
摘要翻译： PCT No.PCT / JP88 / 01331 Sec。 371日期1990年6月7日 102（e）日期1990年6月7日PCT提交1988年12月26日PCT公布。出版物WO89 / 06254 日期：1989年7月13日公开了含有下述式[I]表示的重复单元或其烷基取代衍生物（A）的多环降冰片烯或其衍生物氢化共聚物，由下式[II ]或其烷基取代的衍生物（B），根据需要，5-85摩尔％至少一种选自下式[III]表示的重复单元的重复单元（C），烷基取代的衍生物由下式[Ⅳ]表示的重复单元，烷基取代的衍生物和亚烷基取代的衍生物，以及制备多环降冰片烯或其衍生物开环氢化共聚物的方法， [II] [III] [IV]其中+ E，uns --- + EE表示单键或双键。

7. 发明授权

US06633722B1 Light guide plate with alicyclic resin 有权
标题翻译：带脂环树脂的导光板
公开(公告)号：US06633722B1
公开(公告)日：2003-10-14
申请号：US09674156
申请日：2000-10-27
申请人： Teiji Kohara , Yuichiro Konishi , Junko Maruyama , Koji Minami , Issei Ishimaru
发明人： Teiji Kohara , Yuichiro Konishi , Junko Maruyama , Koji Minami , Issei Ishimaru
IPC分类号： G02B610
CPC分类号： G02B6/0061 , G02B6/0001 , G02B6/0038 , G02B6/0046 , G02F1/133615
摘要： A light guide plate which is made of a polymeric resin having an alicyclic structure and has recesses for reflection formed on a light reflecting surface, the recesses being so arranged that the density of the recesses increases with the distance from a light source. Each recess is preferably a V-shaped groove each having an angle of 70° to 150° and a depth of 1 &mgr;m to 1000 &mgr;m or a groove which is long and approximately perpendicular to the direction in which light is incident at any position on the light reflection surface.
摘要翻译：一种导光板，其由具有脂环结构的聚合物树脂制成并具有形成在光反射表面上的反射凹槽，所述凹部被布置成使得凹部的密度随着距离光源的距离而增加。每个凹部优选为V形槽，每个凹槽各自具有70°至150°的角度和1μm至1000μm的深度，或者凹槽，其长度大致垂直于光入射到该位置上的任何位置的方向光反射面。

8. 发明授权

US6066380A Disc medium substrate and disc device 有权
标题翻译：盘式介质基板和光盘装置
公开(公告)号：US6066380A
公开(公告)日：2000-05-23
申请号：US51938
申请日：1998-10-13
申请人： Eiki Oyanagi , Takeshi Sasa , Yasuyuki Imai , Hiroshi Takino , Teiji Kohara , Masayoshi Oshima
发明人： Eiki Oyanagi , Takeshi Sasa , Yasuyuki Imai , Hiroshi Takino , Teiji Kohara , Masayoshi Oshima
IPC分类号： B29C70/64 , C08F32/04 , G11B5/596 , G11B5/60 , G11B5/73 , G11B5/82 , G11B5/84 , G11B21/21 , G11B23/00 , B32B3/00
CPC分类号： G11B23/0021 , B29C70/64 , C08F32/04 , G11B5/7315 , G11B5/82 , G11B5/8404 , G11B21/21 , G11B5/59633 , G11B5/6011 , Y10S428/913 , Y10T428/21
摘要： A molded thermoplastic resin disc substrate specially adapted for use with floating head type recording/reproduction apparatus is provided. The molded disc substrate has surface smoothness characteristics which are the same or better than are provided with mirror polished aluminum discs. The molded disc substrates include a floating head scanning surface wherein the maximum projection height or maximum surface irregularity is less than about 50 nm to reduce or eliminate damage to either the disc or floating head caused by unwanted collisions between them. In a preferred embodiment, the molded disc substrates are molded from a thermoplastic resin composition containing 10000 particles/gram or less of particles having a particle diameter of 0.5 .mu.m or more. In a preferred embodiment, control of particle size and content is achieved by subjecting the resin molding composition to a sequence of filtering steps using filters of decreasing mesh size.
摘要翻译： PCT No.PCT / JP97 / 02927 Sec。 371日期：1998年10月13日 102（e）日期1998年10月13日PCT 1997年8月22日PCT公布。第WO98 / 08217号公报日期1998年2月26日提供特别适用于浮头型记录/再现装置的模制热塑性树脂盘基片。模制的盘基片具有与设置有镜面抛光的铝盘相同或更好的表面平滑度特性。模制的盘基底包括浮动头扫描表面，其中最大突出高度或最大表面不规则小于约50nm，以减少或消除由它们之间的不必要的碰撞引起的盘或浮动头的损坏。在优选的实施方式中，由含有10000粒子/克以上的粒径为0.5μm以上的粒子的热塑性树脂组合物成型成型的盘基片。在优选的实施方案中，通过使用减小网眼尺寸的滤膜对树脂模塑组合物进行一系列过滤步骤来实现颗粒尺寸和含量的控制。

9. 发明授权

US5885505A Method for producing electronic part sealed body 失效
标题翻译：电子部件密封体的制造方法
公开(公告)号：US5885505A
公开(公告)日：1999-03-23
申请号：US916781
申请日：1997-08-25
申请人： Yuji Koushima , Teiji Kohara , Tadao Natsuume
发明人： Yuji Koushima , Teiji Kohara , Tadao Natsuume
IPC分类号： B29C33/40 , B29C35/02 , B29C41/20 , B29C45/02 , B29C45/14 , B29C45/26 , B29C70/70 , B29L31/34 , C08G61/00 , H01C17/02 , H01G13/00 , H01L21/56
CPC分类号： H01L21/565 , B29C33/40 , H01C17/02 , H01G13/003 , H01L2924/0002
摘要： A molding frame made by molding a thermoplastic norbornene resin which hardly deforms even after repeated use is used for production of electronic part sealed bodies by sealing the electronic devices of integrated circuits such as light emitting diodes, diodes, transistors, LSI devices, IC devices and CCD devices and capacitors, resistors, coils, microswitches and dipswitches with thermosetting resins such as epoxy resins as sealants.
摘要翻译：通过模制热塑性降冰片烯树脂制成的模制框架，即使在重复使用后几乎不变形的情况下也被用于通过密封诸如发光二极管，二极管，晶体管，LSI器件，IC器件等集成电路的电子器件的电子部件密封体的制造 CCD器件和电容器，电阻器，线圈，微动开关和具有热固性树脂的开关，例如作为密封剂的环氧树脂。

10. 发明授权

US5686156A Press-through package 失效
标题翻译：直通包装
公开(公告)号：US5686156A
公开(公告)日：1997-11-11
申请号：US464630
申请日：1995-06-26
申请人： Toshiyasu Matsui , Tsutomu Hani , Teiji Kohara , Tadao Natsuume
发明人： Toshiyasu Matsui , Tsutomu Hani , Teiji Kohara , Tadao Natsuume
IPC分类号： B32B15/08 , B65B9/04 , B65D75/32 , B65D75/34 , B65D83/04
CPC分类号： B65D75/32 , B65D75/326 , B65D75/327 , Y10T428/1352 , Y10T428/1379
摘要： A press-through package obtained by placing objects to be packed, in the accommodating pockets formed by vacuum forming or the like of a sheet made of a thermoplastic norbornene type resin, particularly preferably a hydrogenated product of ring-opening polymerization product of a dicyclopentadiene type monomer, and then closing the openings of pockets of the sheet with another sheet such as metal foil to pack the objects to be packed, which package makes the packed objects clearly visible in the pocket portions, prevents the deterioration of the packed objects by moisture bacause of its excellent water vapor barrier properties, and is good in production efficiency.
摘要翻译： PCT No.PCT / JP94 / 00122 Sec。 371日期：1995年6月26日 102（e）日期1995年6月26日PCT 1994年1月28日PCT PCT。 WO94 / 16965 PCT公开号日期1995年8月4日通过将待包装物体放置在由热塑性降冰片烯类树脂制成的片材的真空成型等形成的容纳袋中，特别优选开环聚合的氢化产物二环戊二烯型单体的产物，然后用诸如金属箔的另一片材封闭片材的袋口的开口以包装要包装的物品，该包装使得包装物体在袋部分中清晰可见防止了水分阻滞性优良，生产效率好。

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