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1. 发明授权

US07324715B2 Optical information processing circuit assembly 有权
标题翻译：光信息处理电路组件
公开(公告)号：US07324715B2
公开(公告)日：2008-01-29
申请号：US10317750
申请日：2002-12-12
申请人： Tecktiong Tan , Binghua Pan , Jeffrey H. Burns , Arun K. Chaudhuri , John R. Troxell , Su Liang Chan
发明人： Tecktiong Tan , Binghua Pan , Jeffrey H. Burns , Arun K. Chaudhuri , John R. Troxell , Su Liang Chan
IPC分类号： G02B6/12
CPC分类号： G02B6/4232
摘要： An optical information processing circuit assembly includes an optically transmissive substrate and a resiliently compressible circuit member affixed to the substrate and defining an opening therethrough with a number of leads disposed about the opening. An integrated imaging circuit defines a corresponding number of pads wherein the pads align with and electrically contact the leads. An optically transmissive medium may be disposed between and in contact with the substrate and the integrated imaging circuit to allow light transmission therethrough from the substrate to the imaging circuit. In one embodiment, resilient bumps are provided between the integrated imaging circuit and the resiliently compressible circuit member to form the electrical connection therebetween. Alternatively, solder bumps may replace the resilient bumps. Additional circuit components may be similarly mounted to the resiliently compressible circuit member to complete the assembly.
摘要翻译：光学信息处理电路组件包括光学透射衬底和固定到衬底的弹性可压缩电路构件，并且限定穿过其中的开口，其中围绕开口设置有多个引线。集成成像电路限定相应数量的焊盘，其中焊盘与引线对准并电接触引线。光学透射介质可以设置在衬底之间并与衬底和集成成像电路接触，以允许从衬底到成像电路的光透射。在一个实施例中，弹性凸块设置在集成成像电路和弹性可压缩电路部件之间以形成它们之间的电连接。或者，焊料凸块可以代替弹性凸块。附加的电路部件可以类似地安装到弹性可压缩电路部件上以完成组装。

2. 发明授权

US07294827B2 Electronic module with light-blocking features 有权
标题翻译：电子模块具有遮光功能
公开(公告)号：US07294827B2
公开(公告)日：2007-11-13
申请号：US10711476
申请日：2004-09-21
申请人： Teck Tiong Tan , Binghua Pan , Jeffrey H. Burns , John R. Troxell
发明人： Teck Tiong Tan , Binghua Pan , Jeffrey H. Burns , John R. Troxell
IPC分类号： H01J5/02 , H01L31/203 , H01L21/00
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L31/02325 , H01L2924/0002 , H04N5/2253 , H04N5/2254 , H01L2924/00
摘要： An electronic module adapted to sense light and configured to minimize the entry of stray light into the module. The module includes a housing having an opening through which light enters the housing, a first substrate coupled to the housing, a second substrate on the first substrate opposite the housing, and a chip on the second substrate. The first substrate defines a window aligned with the housing so that light traveling through the housing also passes through window. The second substrate defines an opening aligned with the window, and the chip is located over the opening in the second substrate so that a light-sensing element on the chip senses light passing through the opening. The module is equipped with features that prevent light from entering the module through the second substrate, the first substrate, and between the chip and second substrate.
摘要翻译：一种电子模块，适于感测光并被配置为使杂散光进入模块最小化。模块包括具有开口的壳体，光通过该开口进入壳体，耦合到壳体的第一基板，与壳体相对的第一基板上的第二基板和第二基板上的芯片。第一基板限定与壳体对准的窗口，使得穿过壳体的光也穿过窗口。第二基板限定与窗口对准的开口，并且芯片位于第二基板中的开口上方，使得芯片上的感光元件感测穿过开口的光。该模块配备有防止光通过第二基板，第一基板以及芯片与第二基板之间进入模块的特征。

3. 发明授权

US06703128B2 Thermally-capacitive phase change encapsulant for electronic devices 有权
标题翻译：用于电子设备的热电容相变密封剂
公开(公告)号：US06703128B2
公开(公告)日：2004-03-09
申请号：US10075981
申请日：2002-02-15
申请人： Bruce A. Myers , Arun K. Chaudhuri , Jeffrey H. Burns
发明人： Bruce A. Myers , Arun K. Chaudhuri , Jeffrey H. Burns
IPC分类号： B32B516
CPC分类号： H01L23/295 , H01L23/29 , H01L23/3733 , H01L23/4275 , H01L2924/0002 , Y10T428/2991 , Y10T428/2998 , Y10T428/31663 , H01L2924/00
摘要： An encapsulation material suitable for dissipating heat generated by an electronic module, such as by directly contacting a heat-generating power device or contacting a heat sink of a heat-generating power device. The encapsulation material comprises phase change particles dispersed in a gel material. The phase change particles preferably comprise a solder alloy encapsulated by a dielectric coating so the phase change particles are electrically insulated from each other. The encapsulation material may further comprise dielectric particles dispersed in the gel material for the purpose of increasing the thermal conductivity of the encapsulation material. Alternatively or in addition, the dielectric coating on the phase change particles may comprise dielectric particles that are dispersed in a dielectric matrix, again with the preferred effect of increasing the thermal conductivity of the encapsulation material.
摘要翻译：一种适合于消散由电子模块产生的热量的封装材料，例如通过直接接触发热功率器件或接触发热功率器件的散热片。包封材料包含分散在凝胶材料中的相变颗粒。相变粒子优选包含由电介质涂层包封的焊料合金，使得相变粒子彼此电绝缘。包封材料还可以包括分散在凝胶材料中的介电颗粒，以增加封装材料的热导率。或者或另外，相变粒子上的电介质涂层可以包括分散在电介质基质中的介电颗粒，再次具有提高封装材料的热导率的优选效果。

4. 发明申请

US20080218988A1 Interconnect for an electrical circuit substrate 审中-公开
标题翻译：互连电路基板
公开(公告)号：US20080218988A1
公开(公告)日：2008-09-11
申请号：US11715688
申请日：2007-03-08
申请人： Jeffrey H. Burns , Charles I. Delheimer
发明人： Jeffrey H. Burns , Charles I. Delheimer
IPC分类号： H05K7/02
CPC分类号： H05K1/145 , H05K1/023 , H05K1/0274 , H05K1/141 , H05K3/303 , H05K3/3436 , H05K3/368 , H05K2201/09072 , H05K2201/10121 , H05K2201/10636 , H05K2201/10727 , H05K2201/10734 , H05K2201/2036 , Y02P70/611
摘要： A passive surface mount part such as a capacitor or a resistor is employed to attach a first substrate to a second substrate, or a semiconductor device to a substrate, for an electrical circuit assembly. Applicable forms of substrates include a printed circuit board such as a motherboard and a daughterboard, and applicable forms of semiconductor devices include an integrated circuit. In an aspect, a low profile attachment is provided forming a planar structure. Space is conserved, signal transmission is provided, and electrical performance is increased. In another aspect, a standoff is defined between the substrates setting the substrates apart a desired distance, compensating for any surface irregularities, increasing thermal separation, and increasing interconnect flexibility. As an application, the standoff defined between the substrates can be utilized for a structure such as optical glass structure to be situated between the substrates for use with an optical circuit assembly.
摘要翻译：使用诸如电容器或电阻器的无源表面安装部件将第一基板附接到用于电路组件的第二基板或半导体器件到基板。衬底的适用形式包括诸如母板和子板的印刷电路板，并且适用形式的半导体器件包括集成电路。一方面，提供形成平面结构的低轮廓附件。节省空间，提供信号传输，并提高电气性能。在另一方面，在将基板间隔开期望距离，补偿任何表面不规则性，增加热分离和增加互连柔性的基板之间限定了间隙。作为应用，限定在基板之间的间隔可用于诸如光学玻璃结构之类的结构，其位于用于光学电路组件的基板之间。

5. 发明授权

US08951181B2 Sound abating heat sink and motor housing 有权
标题翻译：消音散热器和电机外壳
公开(公告)号：US08951181B2
公开(公告)日：2015-02-10
申请号：US12895204
申请日：2010-09-30
申请人： Jeffrey H. Burns
发明人： Jeffrey H. Burns
IPC分类号： B04B15/02 , B04B9/02 , H02K5/18 , H02K5/24
CPC分类号： B04B9/02 , H02K5/18 , H02K5/24
摘要： A centrifuge includes a rotor configured to receive sample containers; a drive shaft operatively coupled to the rotor; and a motor. The motor includes a housing; a plurality of substantially parallel fins integral with the housing, each fin having a free end spaced from the housing, wherein the free ends of the plurality of fins are disposed in a common cylindrical plane; and a plurality of substantially parallel grooves, each groove disposed between a pair of adjacent fins and having a groove depth defined by a distance between the common cylindrical plane and the housing. Wherein the plurality of grooves includes a first multitude of grooves having a common groove depth and a second multitude of grooves having a groove depth that is not the same as the common groove depth, wherein the first and second multitude of grooves are interleaved.
摘要翻译：离心机包括构造成接收样品容器的转子; 可操作地联接到转子的驱动轴; 和电机。电机包括壳体; 多个与所述壳体一体的基本上平行的翼片，每个翅片具有与所述壳体间隔开的自由端，其中所述多个翼片的自由端设置在共同的圆柱面上; 以及多个基本上平行的凹槽，每个凹槽设置在一对相邻的翅片之间，并且具有由公共圆柱形平面和壳体之间的距离限定的凹槽深度。其中多个凹槽包括具有公共凹槽深度的第一多个凹槽和具有与公共凹槽深度不同的凹槽深度的第二多个凹槽，其中第一和第二多个凹槽交错。

6. 发明授权

US06000679A Solenoid coil attachment mechanism 失效
标题翻译：电磁线圈附件机构
公开(公告)号：US06000679A
公开(公告)日：1999-12-14
申请号：US988561
申请日：1997-12-11
申请人： David Fredrick Reuter , Jerry Lee Newton , Jay P. Johnson , Rodney A. Lawrence , Jeffrey H. Burns , Alejandro Moreno , Raymundo Saenz , Richard Michael Parrott
发明人： David Fredrick Reuter , Jerry Lee Newton , Jay P. Johnson , Rodney A. Lawrence , Jeffrey H. Burns , Alejandro Moreno , Raymundo Saenz , Richard Michael Parrott
IPC分类号： B60T8/36 , F15B13/00 , F15B13/08 , F16K27/00 , F16K31/06 , H01R4/02
CPC分类号： F15B13/0853 , B60T8/3675 , F15B13/0814 , F15B13/0835 , F15B13/0857 , F16K27/003 , F16K31/06 , H01R4/02 , Y10T137/87885
摘要： A solenoid coil attachment mechanism includes a coil assembly with a wire end that projects from the coil assembly and an extending elongated leg that includes a latching mechanism. A carrier has a wall with an opening receiving the leg of the coil assembly and has a wire guide that is funnel shaped, has an open end and receives the end of the wire. A circuit board is attached to the carrier and the wire end is soldered directly to the circuit board.
摘要翻译：螺线管线圈附接机构包括具有从线圈组件突出的线端部的线圈组件和包括闩锁机构的延伸细长腿部。载体具有壁，其具有接收线圈组件的腿部的开口，并且具有漏斗形状的导线器，具有开口端并接收线的端部。电路板连接到载体上，线端直接焊接到电路板上。

7. 发明授权

US07095002B2 Adaptive lighting control for vision-based occupant sensing 有权
标题翻译：基于视觉的乘员感知的自适应照明控制
公开(公告)号：US07095002B2
公开(公告)日：2006-08-22
申请号：US10784368
申请日：2004-02-23
申请人： Hongzhi Kong , Qin Sun , Adil Ansari , Jeffrey H. Burns
发明人： Hongzhi Kong , Qin Sun , Adil Ansari , Jeffrey H. Burns
IPC分类号： G01J1/32
CPC分类号： H05B37/0227 , B60R21/01534 , B60R21/01538
摘要： An object surface characterization system with adaptive lighting control includes a light projector, a light source, a camera, a processor and a memory subsystem. The processor is coupled to the light projector, the light source and the camera, as well as the memory subsystem. The memory subsystem stores code that, when executed by the processor, instructs the processor to perform a number of steps to achieve adaptive lighting control for the system.
摘要翻译：具有自适应照明控制的物体表面表征系统包括光投影仪，光源，相机，处理器和存储器子系统。处理器耦合到光投影仪，光源和相机以及存储器子系统。存储器子系统存储当处理器执行时指示处理器执行多个步骤以实现系统的自适应照明控制的代码。

8. 发明申请

US20110082021A1 Sound Abating Heat Sink and Motor Housing 有权
标题翻译：减震散热器和电机外壳
公开(公告)号：US20110082021A1
公开(公告)日：2011-04-07
申请号：US12895204
申请日：2010-09-30
申请人： Jeffrey H. Burns
发明人： Jeffrey H. Burns
IPC分类号： B04B9/00
CPC分类号： B04B9/02 , H02K5/18 , H02K5/24
摘要： A centrifuge includes a rotor configured to receive sample containers; a drive shaft operatively coupled to the rotor; and a motor. The motor includes a housing; a plurality of substantially parallel fins integral with the housing, each fin having a free end spaced from the housing, wherein the free ends of the plurality of fins are disposed in a common cylindrical plane; and a plurality of substantially parallel grooves, each groove disposed between a pair of adjacent fins and having a groove depth defined by a distance between the common cylindrical plane and the housing. Wherein the plurality of grooves includes a first multitude of grooves having a common groove depth and a second multitude of grooves having a groove depth that is not the same as the common groove depth, wherein the first and second multitude of grooves are interleaved.
摘要翻译：离心机包括构造成接收样品容器的转子; 可操作地联接到转子的驱动轴; 和电机。电机包括壳体; 多个与所述壳体一体的基本上平行的翼片，每个翅片具有与所述壳体间隔开的自由端，其中所述多个翼片的自由端设置在共同的圆柱面上; 以及多个基本上平行的凹槽，每个凹槽设置在一对相邻的翅片之间，并且具有由公共圆柱形平面和壳体之间的距离限定的凹槽深度。其中多个凹槽包括具有公共凹槽深度的第一多个凹槽和具有与公共凹槽深度不同的凹槽深度的第二多个凹槽，其中第一和第二多个凹槽交错。

9. 发明授权

US06177740B1 Integrated motor and motor drive unit 有权
标题翻译：集成电机和电机驱动单元
公开(公告)号：US06177740B1
公开(公告)日：2001-01-23
申请号：US09240158
申请日：1999-01-29
申请人： Jeffrey H. Burns
发明人： Jeffrey H. Burns
IPC分类号： H02K1100
CPC分类号： H02K5/225 , H02K3/50 , H02K11/33 , H02K29/08 , H02K2203/03 , H02K2211/03
摘要： An electric motor and motor drive unit assembly includes a motor assembly having a housing and a motor rotatably coupled within the housing. A power distribution bus is coupled to the housing. The power distribution bus is coupled to an end cap of the motor. A plurality of semiconductor switches are coupled to the power distribution bus. The motor and drive assembly further includes a drive assembly having a case coupled to the power distribution bus. The case is electrically isolated from and is in thermal communication with the power distribution bus. The case has a plurality of openings therethrough. An interconnect circuit board is disposed within the case and is electrically coupled to the power distribution bus through the plurality of openings. A system control board is disposed within the case and is electrically coupled to the interconnect board.
摘要翻译：电动机和电动机驱动单元组件包括具有壳体的电动机组件和可旋转地联接在壳体内的电动机。配电总线耦合到壳体。配电总线连接到电动机的端盖。多个半导体开关耦合到配电总线。电动机和驱动组件还包括具有耦合到配电总线的壳体的驱动组件。该情况与配电总线电隔离并与配电总线热连通。壳体具有穿过其中的多个开口。互连电路板设置在壳体内并且通过多个开口电耦合到配电总线。系统控制板设置在壳体内并电耦合到互连板。

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