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1. 发明授权

US5264815A Fastener for electronic component 失效
标题翻译：电子元件紧固件
公开(公告)号：US5264815A
公开(公告)日：1993-11-23
申请号：US527076
申请日：1990-05-21
申请人： Tatuo Umeya , Hidetoshi Suzuki , Toru Mizuno , Tokio Tadano , Takashi Shioura
发明人： Tatuo Umeya , Hidetoshi Suzuki , Toru Mizuno , Tokio Tadano , Takashi Shioura
IPC分类号： H01F27/06 , H01F5/04 , H01F17/04 , H01F27/29 , H01F27/26 , H01F27/30
CPC分类号： H01F27/292 , H01F17/041 , H01F5/04 , Y10T24/3431 , Y10T24/44923
摘要： A combination of a fastener with an electronic component, wherein the electronic component includes a bobbin having an axial portion, windings around the axial portion of the bobbin, external terminals projecting from the bobbin, around each of which external terminals a termination of one of the windings is coiled, a mold covering the bobbin in a manner to allow portions of the external terminals to be projected outwardly from the mold, the mold being formed of electrically insulating resin material, and a pair of cores assembled to the mold so as to be opposed to each other. The fastener fitted on the electronic component includes a first engaging member engaged in assembly with the cores to clamp the cores, a second engaging member engaged in assembly with a portion of the mold, and an interconnecting member interconnecting the first and second engaging members.
摘要翻译：紧固件与电子部件的组合，其中所述电子部件包括具有轴向部分的绕线管，围绕所述线轴的轴向部分绕组，从所述绕线管突出的外部端子，每个所述外部端子的端接部分绕组被卷绕，模具以允许外部端子的一部分从模具向外突出的方式覆盖线轴，模具由电绝缘树脂材料形成，并且一对芯体组装到模具上，以便于相互对立安装在电子部件上的紧固件包括：第一接合构件，其与芯组装成与夹紧芯部接合;第二接合构件与模具的一部分接合;以及互连构件，其将第一和第二接合构件互连。

2. 外观设计

USD359726S Fastener for an electronic component 失效
公开(公告)号：USD359726S
公开(公告)日：1995-06-27
申请号：US440564
申请日：1989-11-22
申请人： Tatuo Umeya , Toru Mizuno , Hidetoshi Suzuki , Tokio Tadano , Takashi Shioura
设计人： Tatuo Umeya , Toru Mizuno , Hidetoshi Suzuki , Tokio Tadano , Takashi Shioura

3. 发明申请

US20090001054A1 BONDING METHOD AND BONDING APPARATUS 审中-公开
标题翻译：接合方法和接合装置
公开(公告)号：US20090001054A1
公开(公告)日：2009-01-01
申请号：US12143267
申请日：2008-06-20
申请人： Toru Mizuno , Tatsuya Wagou , Hidetoshi Suzuki
发明人： Toru Mizuno , Tatsuya Wagou , Hidetoshi Suzuki
IPC分类号： B23K11/00 , B23K11/24
CPC分类号： B23K1/0056 , B23K3/0623 , B23K2101/36 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/742 , H01L2924/00014 , H05K3/3478 , H05K3/3494 , H05K2203/0195 , H05K2203/041 , H05K2203/074 , H05K2203/107 , H01L2224/05599
摘要： The present invention relates to a bonding method or an apparatus for projecting a conductive element from a nozzle onto an object to be bonded and electrically bonding the object to be bonded and the conductive element. The method of invention comprises the steps of: preparing the conductive element having an outer diameter with a curvature radius larger than a curvature radius of a portion of an opening of the nozzle which is in contact with the conductive element; pressurizing and attaching the conductive element to the opening of the nozzle; and supplying a compressed gas into an inner space of the nozzle and projecting the conductive element in a solid phase state onto the object to be bonded.
摘要翻译：本发明涉及一种用于将导电元件从喷嘴突出到待接合物体上并将待接合物体与导电元件电接合的接合方法或装置。本发明的方法包括以下步骤：制备具有曲率半径大于与导电元件接触的喷嘴的开口部分的曲率半径的外径的导电元件; 将导电元件加压并附着到喷嘴的开口; 并将压缩气体供给到所述喷嘴的内部空间，并将所述导电元件以固相状态投影到所述被接合物上。

4. 发明授权

US08499924B2 Chip component carrying method and system, and visual inspection method and system 有权
标题翻译：芯片组件携带方法和系统，目视检查方法和系统
公开(公告)号：US08499924B2
公开(公告)日：2013-08-06
申请号：US13174001
申请日：2011-06-30
申请人： Masayoshi Kobayashi , Toru Mizuno
发明人： Masayoshi Kobayashi , Toru Mizuno
IPC分类号： B65G29/00
CPC分类号： G01N21/95 , G01N21/8803 , G01R31/013
摘要： A method and a system for stabilizing the sight line of a chip component being carried on two discs, for stabilizing delivery of the chip component between the two discs, and improving and stabilizing the inspection accuracy in the visual check of the chip component. This is achieved by employing a mechanism for carrying the chip component while supporting it on the horizontal plane of the first rotary disc and then carrying the chip component while suction-holding it on the vertical plane of the second rotary disc. When the chip component is carried on the first rotary disc, the upper surface and one side face of the chip component are imaged by first and second cameras. When the chip component is carried on the second rotary disc, the lower surface and the other side face of the chip component are imaged by third and fourth cameras.
摘要翻译：一种用于稳定在两个盘上承载的芯片部件的瞄准线的方法和系统，用于稳定两个盘之间的芯片部件的传递，并且改善和稳定芯片部件的视觉检查中的检查精度。这通过采用用于承载芯片部件的机构来实现，同时将其支撑在第一旋转盘的水平面上，然后在将其保持在第二旋转盘的垂直平面上的同时承载芯片部件。当芯片部件承载在第一旋转盘上时，芯片部件的上表面和一个侧面由第一和第二相机成像。当芯片部件承载在第二旋转盘上时，芯片部件的下表面和另一侧面由第三和第四相机成像。

5. 发明授权

US07987968B2 Chip component carrying method and system, and visual inspection method and system 有权
标题翻译：芯片组件携带方法和系统，目视检查方法和系统
公开(公告)号：US07987968B2
公开(公告)日：2011-08-02
申请号：US11578062
申请日：2004-09-07
申请人： Masayoshi Kobayashi , Toru Mizuno
发明人： Masayoshi Kobayashi , Toru Mizuno
IPC分类号： B65G29/00
CPC分类号： G01N21/95 , G01N21/8803 , G01R31/013
摘要： A method and a system for stabilizing the sight line of a chip component being carried on two discs, for stabilizing delivery of the chip component between the two discs, and improving and stabilizing the inspection accuracy in the visual check of the chip component. This is achieved by employing a mechanism for carrying the chip component while supporting it on the horizontal plane of the first rotary disc and then carrying the chip component while suction-holding it on the vertical plane of the second rotary disc. When the chip component is carried on the first rotary disc, the upper surface and one side face of the chip component are imaged by first and second cameras. When the chip component is carried on the second rotary disc, the lower surface and the other side face of the chip component are imaged by third and fourth cameras.
摘要翻译：一种用于稳定在两个盘上承载的芯片部件的瞄准线的方法和系统，用于稳定两个盘之间的芯片部件的传递，并且改善和稳定芯片部件的视觉检查中的检查精度。这通过采用用于承载芯片部件的机构来实现，同时将其支撑在第一旋转盘的水平面上，然后在将其保持在第二旋转盘的垂直平面上的同时承载芯片部件。当芯片部件承载在第一旋转盘上时，芯片部件的上表面和一个侧面由第一和第二相机成像。当芯片部件承载在第二旋转盘上时，芯片部件的下表面和另一侧面由第三和第四相机成像。

6. 发明授权

US07276673B2 Solder bonding method and solder bonding device 有权
标题翻译：焊接方法和焊接接合装置
公开(公告)号：US07276673B2
公开(公告)日：2007-10-02
申请号：US10947294
申请日：2004-09-23
申请人： Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
发明人： Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
IPC分类号： B23K26/00
CPC分类号： H05K3/3494 , B23K1/0056 , H01L2224/11003 , H01L2224/742 , H05K3/3442 , H05K2203/041 , H05K2203/107
摘要： A solder bonding method and a solder bonding device are provided, in which solder is melted, and heating of electrode portions is performed by irradiating laser light to an inner side of a region where electrodes portions are provided, making the temperature difference between the electrode portions and the melted solder smaller to improve the wettability of the solder and increase bonding reliability. The solder bonding method and the solder bonding device perform bonding of the electrode portions that are formed on an object to be bonded by melting the solder. After supplying the solder onto the electrode portions before melting, a laser is irradiated to the solder and to the electrode portions in the periphery of the solder. The solder melts, and the electrode portions are heated. The wettability of the solder with respect to the electrode portions thus improves, and the reliability of an electrical connection between the electrode portions can be increased.
摘要翻译：提供焊料接合方法和焊接接合装置，其中焊料熔化，并且通过向设置有电极部分的区域的内侧照射激光来进行电极部分的加热，使得电极部分之间的温度差并且熔化的焊料更小以改善焊料的润湿性并增加焊接可靠性。焊接接合方法和焊接接合装置通过熔化焊料进行形成在待接合物体上的电极部分的接合。在熔融之前将焊料供应到电极部分之后，激光照射到焊料和焊料周围的电极部分。焊料熔化，电极部分被加热。因此焊料相对于电极部的润湿性提高，可以提高电极部之间的电连接的可靠性。

7. 发明申请

US20070205084A1 Chip Component Carrying Method and System, and Visual Inspection Method and System 有权
标题翻译：芯片组件携带方法与系统，目视检查方法与系统
公开(公告)号：US20070205084A1
公开(公告)日：2007-09-06
申请号：US11578062
申请日：2004-09-07
申请人： Masayoshi Kobayashi , Toru Mizuno
发明人： Masayoshi Kobayashi , Toru Mizuno
IPC分类号： B65G29/00
CPC分类号： G01N21/95 , G01N21/8803 , G01R31/013
摘要： A method and a system for stabilizing the sight line of a chip component being carried on two discs, for stabilizing delivery of the chip component between the two discs, and improving and stabilizing the inspection accuracy in the visual check of the chip component. This is achieved by employing a mechanism for carrying the chip component while supporting it on the horizontal plane of the first rotary disc and then carrying the chip component while suction-holding it on the vertical plane of the second rotary disc. When the chip component is carried on the first rotary disc, the upper surface and one side face of the chip component are imaged by first and second cameras. When the chip component is carried on the second rotary disc, the lower surface and the other side face of the chip component are imaged by third and fourth cameras.
摘要翻译：一种用于稳定在两个盘上承载的芯片部件的瞄准线的方法和系统，用于稳定两个盘之间的芯片部件的传递，并且改善和稳定芯片部件的视觉检查中的检查精度。这通过采用用于承载芯片部件的机构来实现，同时将其支撑在第一旋转盘的水平面上，然后在将其保持在第二旋转盘的垂直平面上的同时承载芯片部件。当芯片部件承载在第一旋转盘上时，芯片部件的上表面和一个侧面由第一和第二相机成像。当芯片部件承载在第二旋转盘上时，芯片部件的下表面和另一侧面由第三和第四相机成像。

8. 发明授权

US07164097B2 Solder ball bonding method and bonding device 有权
标题翻译：焊球接合方法和接合装置
公开(公告)号：US07164097B2
公开(公告)日：2007-01-16
申请号：US10936747
申请日：2004-09-09
申请人： Osamu Shindo , Toru Mizuno , Youichi Andoh , Satoshi Yamaguchi
发明人： Osamu Shindo , Toru Mizuno , Youichi Andoh , Satoshi Yamaguchi
IPC分类号： B23K1/005
CPC分类号： B23K1/0056 , B23K1/0016 , B23K3/0623 , B23K2101/36 , H01L2224/11003 , H01L2224/11334 , H01L2224/742 , H05K3/3442 , H05K3/3478 , H05K3/3494 , H05K2203/0195 , H05K2203/041 , H05K2203/082 , H05K2203/107
摘要： Provided are a solder ball bonding method and a solder ball bonding device for performing bonding of a plurality of electrode portions formed on objects to be bonded by melting solder balls. The solder balls are suctioned by using a plurality of suction nozzles that follow the electrode portions of the objects to be bonded, and conveyed onto the electrode portions. A laser irradiation portion that is positioned above the suction nozzles is then moved in a direction along which the suction nozzles are arranged, while the solder balls are irradiated with laser light passing through suction openings of the suction nozzles by using the laser irradiation portion. Accordingly, it is possible to melt the plurality of solder balls on the electrode portions by using only a single laser irradiation portion.
摘要翻译：提供了一种焊球接合方法和焊球接合装置，用于通过熔化焊球进行形成在待接合物体上的多个电极部分的接合。通过使用跟随待接合物体的电极部分的多个吸嘴来吸引焊球，并将其输送到电极部分上。然后，在吸引喷嘴上方的激光照射部分沿吸引喷嘴排列的方向移动，同时通过使用激光照射部分通过吸嘴的吸入口的激光照射焊球。因此，可以仅使用单个激光照射部来熔化电极部上的多个焊球。

9. 发明授权

US07131720B2 Inkjet printer and maintenance method thereof 有权
标题翻译：喷墨打印机及其维护方法
公开(公告)号：US07131720B2
公开(公告)日：2006-11-07
申请号：US10764459
申请日：2004-01-27
申请人： Toru Mizuno , Masahiko Sasa
发明人： Toru Mizuno , Masahiko Sasa
IPC分类号： B41J2/19 , B41J2/175
CPC分类号： B41J2/16532
摘要： In a maintenance method of an inkjet printer comprising an air discharge device which discharges air accumulated in ink supply paths with pressurized air and an ink vacuum device which vacuums ink from an inkjet head, the pressurized air is in a high pressure mode when the air discharge device is used. The pressurized air is in a low pressure mode when the ink vacuum device is used. The driving time and the rotational speed of a drive motor which drives an air pump are controlled according to the capability and the ambient temperature of the air pump which generates the pressurized air.
摘要翻译：在一种喷墨打印机的维护方法中，所述喷墨打印机包括：用加压空气排出在供墨路径中积聚的空气的排气装置和从喷墨头抽真空墨水的墨水真空装置，当空气排出时，加压空气处于高压模式使用设备。当使用墨水真空装置时，加压空气处于低压模式。根据产生加压空气的气泵的能力和环境温度来控制驱动空气泵的驱动马达的驱动时间和转速。

10. 发明授权

US07128255B2 Magnetic head, and device and method for manufacturing the same 失效
公开(公告)号：US07128255B2
公开(公告)日：2006-10-31
申请号：US10445027
申请日：2003-05-27
申请人： Toru Mizuno , Kouji Tanaka , Satoshi Yamaguchi
发明人： Toru Mizuno , Kouji Tanaka , Satoshi Yamaguchi
IPC分类号： B23K1/06
CPC分类号： G11B5/4853 , G11B5/4826 , Y10T29/49027 , Y10T29/4903
摘要： The present invention provides a magnetic head construction, a connection method and a connecting device by which excellent electrical connection can be carried out between a core electrode and a substrate land face on a flexure in a magnetic head employing the piggy back system. In order to attain the object of interest, in the present invention, a fine adjustment actuator is arranged between a core and a flexure; a projection portion which is projected from the fine adjustment actuator when viewed from the flexure is provided in the core; a hole is provided in the position, on the flexure, corresponding to the projection portion; only the core is fixed by a support portion provided through the hole portion and a clamp pin without applying any load to the fine adjustment actuator; and while maintaining this fixing state, an electrode and a substrate land are bonded to each other with a wire.

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