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1. 发明申请

US20080171220A1 COPPER CLAD LAMINATE 有权
标题翻译：铜箔层压板
公开(公告)号：US20080171220A1
公开(公告)日：2008-07-17
申请号：US12036537
申请日：2008-02-25
申请人： Takuya YAMAMOTO , Seiji Nagatani , Masahiko Nakano
发明人： Takuya YAMAMOTO , Seiji Nagatani , Masahiko Nakano
IPC分类号： B21C37/00
CPC分类号： B32B15/08 , B32B15/20 , H05K1/0263 , H05K1/0265 , H05K1/0271 , H05K1/09 , H05K3/022 , H05K2201/0352 , H05K2201/0355 , Y10T428/12431 , Y10T428/12438 , Y10T428/31504 , Y10T428/31522
摘要： To reduce warping of a copper clad laminate coated with copper foils of different thicknesses on both sides, and thereby to improve production efficiency of the printed-wiring boards, there is provided a copper clad laminate coated with copper foils of different thicknesses on both sides, wherein a first copper foil on one side of the laminate is not recrystallizable by hot pressing for production of said laminate and a second foil on the other side is recrystallizable by the hot pressing and thicker than the first foil.
摘要翻译：为了减少在两面上涂覆有不同厚度的铜箔的覆铜层压板的翘曲，从而提高印刷电路板的生产效率，提供了一种涂覆有两侧不同厚度的铜箔的覆铜层压板，其中层压体一侧的第一铜箔不能通过热压生成所述层压体而可再结晶，另一侧的第二箔可通过热压可再结晶并且比第一箔更厚。

2. 发明授权

US07358189B2 Copper clad laminate 有权
标题翻译：覆铜层压板
公开(公告)号：US07358189B2
公开(公告)日：2008-04-15
申请号：US09925740
申请日：2001-08-10
申请人： Takuya Yamamoto , Seiji Nagatani , Masahiko Nakano
发明人： Takuya Yamamoto , Seiji Nagatani , Masahiko Nakano
IPC分类号： H01L21/44
CPC分类号： B32B15/08 , B32B15/20 , H05K1/0263 , H05K1/0265 , H05K1/0271 , H05K1/09 , H05K3/022 , H05K2201/0352 , H05K2201/0355 , Y10T428/12431 , Y10T428/12438 , Y10T428/31504 , Y10T428/31522
摘要： To reduce warping of a copper clad laminate coated with copper foils of different thicknesses on both sides, and thereby to improve production efficiency of the printed-wiring boards, there is provided a copper clad laminate coated with copper foils of different thicknesses on both sides, wherein a first copper foil on one side of the laminate is not recrystallizable by hot pressing for production of said laminate and a second foil on the other side is recrystallizable by the hot pressing and thicker than the first foil.
摘要翻译：为了减少在两面上涂覆有不同厚度的铜箔的覆铜层压板的翘曲，从而提高印刷电路板的生产效率，提供了一种涂覆有两侧不同厚度的铜箔的覆铜层压板，其中层压体一侧的第一铜箔不能通过热压生成所述层压体而可再结晶，另一侧的第二箔可通过热压可再结晶并且比第一箔更厚。

3. 发明授权

US07851053B2 Copper clad laminate 有权
标题翻译：覆铜层压板
公开(公告)号：US07851053B2
公开(公告)日：2010-12-14
申请号：US12036537
申请日：2008-02-25
申请人： Takuya Yamamoto , Seiji Nagatani , Masahiko Nakano
发明人： Takuya Yamamoto , Seiji Nagatani , Masahiko Nakano
IPC分类号： B32B27/00
CPC分类号： B32B15/08 , B32B15/20 , H05K1/0263 , H05K1/0265 , H05K1/0271 , H05K1/09 , H05K3/022 , H05K2201/0352 , H05K2201/0355 , Y10T428/12431 , Y10T428/12438 , Y10T428/31504 , Y10T428/31522
摘要： To reduce warping of a copper clad laminate coated with copper foils of different thicknesses on both sides, and thereby to improve production efficiency of the printed-wiring boards, there is provided a copper clad laminate coated with copper foils of different thicknesses on both sides, wherein a first copper foil on one side of the laminate is not recrystallizable by hot pressing for production of said laminate and a second foil on the other side is recrystallizable by the hot pressing and thicker than the first foil.
摘要翻译：为了减少在两面上涂覆有不同厚度的铜箔的覆铜层压板的翘曲，从而提高印刷电路板的生产效率，提供了一种涂覆有两侧不同厚度的铜箔的覆铜层压板，其中层压体一侧的第一铜箔不能通过热压生成所述层压体而可再结晶，另一侧的第二箔可通过热压可再结晶并且比第一箔更厚。

4. 发明申请

US20110189503A1 SURFACE-TREATED COPPER FOIL 有权
标题翻译：表面处理铜箔
公开(公告)号：US20110189503A1
公开(公告)日：2011-08-04
申请号：US13002394
申请日：2009-06-26
申请人： Seiji Nagatani , Hiroshi Watanabe , Kazufumi Izumida
发明人： Seiji Nagatani , Hiroshi Watanabe , Kazufumi Izumida
IPC分类号： B32B15/04
CPC分类号： H05K3/382 , B32B15/08 , B32B15/20 , B32B27/06 , B32B2255/06 , B32B2255/20 , B32B2255/26 , B32B2255/28 , B32B2307/206 , B32B2307/50 , B32B2307/538 , B32B2307/714 , B32B2307/732 , B32B2307/75 , C23C14/024 , C23C14/14 , H05K3/388 , H05K2201/0179 , H05K2201/0317 , H05K2201/0323 , Y10T428/12028 , Y10T428/12438 , Y10T428/12625 , Y10T428/12681 , Y10T428/12806 , Y10T428/12903 , Y10T428/24975 , Y10T428/265
摘要： Object is to provide a surface-treated copper foil free from chromium in the surface-treatment layer and excellent in peel strength of a circuit and chemical resistance against to degradation of the peel strength after processing into a printed wiring board. To achieve the object, the surface-treated copper foil having a surface-treatment layer on a bonding surface of a copper foil for manufacturing a copper-clad laminate by laminating it to an insulating resin substrate has the surface-treatment layer formed by depositing a metal component having high melting point not lower than 1400° C. by dry process film formation method to the bonding surface of the copper foil after the cleaning treatment and further depositing a carbon component to the surface.
摘要翻译：本发明提供一种在表面处理层中不含铬的表面处理铜箔，并且电路的剥离强度优异，并且在加工成印刷线路板之后，耐化学性能降低剥离强度。为了实现该目的，在覆铜层压板的制造用铜箔的接合面上具有表面处理层的表面处理铜箔通过层叠在绝缘性树脂基板上而形成有表面处理层，通过干法成膜法将熔点不低于1400℃的高熔点金属成分施加到清洁处理后的铜箔的接合面上，并进一步在表面上沉积碳成分。

5. 发明授权

US08394509B2 Surface-treated copper foil 有权
标题翻译：表面处理铜箔
公开(公告)号：US08394509B2
公开(公告)日：2013-03-12
申请号：US13002394
申请日：2009-06-26
申请人： Seiji Nagatani , Hiroshi Watanabe , Kazufumi Izumida
发明人： Seiji Nagatani , Hiroshi Watanabe , Kazufumi Izumida
IPC分类号： B32B15/04
CPC分类号： H05K3/382 , B32B15/08 , B32B15/20 , B32B27/06 , B32B2255/06 , B32B2255/20 , B32B2255/26 , B32B2255/28 , B32B2307/206 , B32B2307/50 , B32B2307/538 , B32B2307/714 , B32B2307/732 , B32B2307/75 , C23C14/024 , C23C14/14 , H05K3/388 , H05K2201/0179 , H05K2201/0317 , H05K2201/0323 , Y10T428/12028 , Y10T428/12438 , Y10T428/12625 , Y10T428/12681 , Y10T428/12806 , Y10T428/12903 , Y10T428/24975 , Y10T428/265
摘要： Object is to provide a surface-treated copper foil free from chromium in the surface-treatment layer and excellent in peel strength of a circuit and chemical resistance against to degradation of the peel strength after processing into a printed wiring board. To achieve the object, the surface-treated copper foil having a surface-treatment layer on a bonding surface of a copper foil for manufacturing a copper-clad laminate by laminating it to an insulating resin substrate has the surface-treatment layer formed by depositing a metal component having high melting point not lower than 1400° C. by dry process film formation method to the bonding surface of the copper foil after the cleaning treatment and further depositing a carbon component to the surface.
摘要翻译：本发明提供一种在表面处理层中不含铬的表面处理铜箔，并且电路的剥离强度优异，并且在加工成印刷线路板之后，耐化学性能降低剥离强度。为了实现该目的，在覆铜层压板的制造用铜箔的接合面上具有表面处理层的表面处理铜箔通过层叠在绝缘性树脂基板上而形成有表面处理层，通过干法成膜法将熔点不低于1400℃的高熔点金属成分施加到清洁处理后的铜箔的接合面上，并进一步在表面上沉积碳成分。

6. 发明授权

US08187722B2 Copper foil with carrier sheet, method for manufacturing copper foil with carrier sheet, and surface-treated copper foil with carrier sheet 有权
标题翻译：具有载体片的铜箔，带有载体片的铜箔的制造方法和具有载体片的表面处理的铜箔
公开(公告)号：US08187722B2
公开(公告)日：2012-05-29
申请号：US12301338
申请日：2007-05-18
申请人： Seiji Nagatani , Hiroshi Watanabe , Kazufumi Izumida
发明人： Seiji Nagatani , Hiroshi Watanabe , Kazufumi Izumida
IPC分类号： B32B15/04 , B32B15/20 , C23C14/00 , C23C14/06 , C23C16/26 , C23C28/00
CPC分类号： H05K3/025 , C23C30/00 , C25D1/04 , C25D1/20 , C25D5/10 , C25D5/34 , H05K2201/0323 , Y10T428/12438 , Y10T428/12625 , Y10T428/12806 , Y10T428/12903 , Y10T428/24967 , Y10T428/24975 , Y10T428/265 , Y10T428/30
摘要： An object of the present invention is to provide a copper foil with carrier sheet which permits releasing of the carrier sheet from the copper foil layer even when hot pressing at a temperature exceeding 300° C. is applied in the production of a printed wiring board. In order to achieve the object, a copper foil with physically releasable carrier sheet having a copper foil layer on the surface of the carrier sheet through a bonding interface layer, characterized in that the bonding interface layer is composed of a metal layer and a carbon layer. It is preferable for the bonding interface layer to be composed of a metal layer of 1 nm to 50 nm thick and a carbon layer of 1 nm to 20 nm thick.
摘要翻译：本发明的目的是提供一种具有载体片的铜箔，即使在印刷线路板的制造中也应用了在超过300℃的温度下进行热压时，能够从铜箔层剥离载体片。为了实现该目的，通过接合界面层在载体片的表面上具有具有铜箔层的物理上可释放的载体片的铜箔，其特征在于，所述接合界面层由金属层和碳层。接合界面层优选由1nm〜50nm厚的金属层和1nm〜20nm厚的碳层构成。

7. 发明申请

US20090291319A1 COPPER FOIL WITH CARRIER SHEET, METHOD FOR MANUFACTURING COPPER FOIL WITH CARRIER SHEET, SURFACE-TREATED COPPER FOIL WITH CARRIER SHEET AND COPPER-CLAD LAMINATE USING THE SURFACE-TREATED COPPER FOIL WITH CARRIER SHEET 有权
标题翻译：具有载体片的铜箔，使用载体片制造铜箔的方法，带载体片的表面处理铜箔和使用带有载体片的表面处理铜箔的铜箔层压板
公开(公告)号：US20090291319A1
公开(公告)日：2009-11-26
申请号：US12301338
申请日：2007-05-18
申请人： Seiji Nagatani , Hiroshi Watanabe , Kazufumi Izumida
发明人： Seiji Nagatani , Hiroshi Watanabe , Kazufumi Izumida
IPC分类号： B32B15/20 , B32B15/04 , B05D1/36 , C25D5/00 , C23C14/34 , C25D5/10 , C25D5/34
CPC分类号： H05K3/025 , C23C30/00 , C25D1/04 , C25D1/20 , C25D5/10 , C25D5/34 , H05K2201/0323 , Y10T428/12438 , Y10T428/12625 , Y10T428/12806 , Y10T428/12903 , Y10T428/24967 , Y10T428/24975 , Y10T428/265 , Y10T428/30
摘要： An object of the present invention is to provide a copper foil with carrier sheet which permits releasing of the carrier sheet from the copper foil layer even when hot pressing at a temperature exceeding 300° C. is applied in the production of a printed wiring board. In order to achieve the object, a copper foil with physically releasable carrier sheet having a copper foil layer on the surface of the carrier sheet through a bonding interface layer, characterized in that the bonding interface layer is composed of a metal layer and a carbon layer. It is preferable for the bonding interface layer to be composed of a metal layer of 1 nm to 50 nm thick and a carbon layer of 1 nm to 20 nm thick.
摘要翻译：本发明的目的是提供一种具有载体片的铜箔，即使在印刷线路板的制造中也应用了在超过300℃的温度下进行热压时，能够从铜箔层剥离载体片。为了实现该目的，通过接合界面层在载体片的表面上具有具有铜箔层的物理上可释放的载体片的铜箔，其特征在于，所述接合界面层由金属层和碳层。接合界面层优选由1nm〜50nm厚的金属层和1nm〜20nm厚的碳层构成。

8. 发明申请

US20080280159A1 Copper Foil and Method of Manufacturing the Same 失效
标题翻译：铜箔及其制造方法
公开(公告)号：US20080280159A1
公开(公告)日：2008-11-13
申请号：US11547517
申请日：2005-03-31
申请人： Kenichiro Iwakiri , Seiji Nagatani
发明人： Kenichiro Iwakiri , Seiji Nagatani
IPC分类号： B23P9/00 , C25F3/00
CPC分类号： C25D7/06 , H05K3/382 , H05K2201/0355 , Y10T428/12438 , Y10T428/12569 , Y10T428/1291 , Y10T428/12993
摘要： The object is to provide copper foil of high adhesion even when the roughness Rz of a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A(S), and a roughness Rz(S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness Rz(S) is 1.0 μm to 3.0 μm, 0.5×Rz(S)+0.5≦C(S) (1) where Rz(S) is a numerical value represented by μm.
摘要翻译：本发明的目的是为了提供铜箔的高粘合性，即使铜箔的结节面的粗糙度R z较低，也可以提供铜箔的制造方法。为了实现该目的，采用铜箔，其特征在于，由三维表面积A（S）由A（S）/ B（S）定义的面积系数C（S），其中通过在激光显微镜下对铜箔样品S的结节面的表面积进行三维测量，并且从作为三维测量区域的测量区域的面积的测量区域B（S）获得，通过针式粗糙度计测量的铜箔样品S的结节表面的尺寸表面积A（S）和粗糙度R z（S）具有等式（1），并且粗糙度R z（S）为1.0μm〜3.0μm，<？在线式描述=“In-line Formulas”end =“lead”？ > 0.5xR z（S）+0.5 <= C（S）（1）<？在线公式描述=“在线公式”end =“tail”？>其中R < （S）是由mum表示的数值。

9. 发明授权

US07883783B2 Electrodeposited copper foil with carrier foil on which a resin layer for forming insulating layer is formed, copper-clad laminate, printed wiring board, method for manufacturing multilayer copper-clad laminate, and method for manufacturing printed wiring board 有权
标题翻译：具有形成绝缘层的树脂层的载体箔的电沉积铜箔，覆铜层压板，印刷布线板，多层覆铜层压板的制造方法以及印刷布线板的制造方法
公开(公告)号：US07883783B2
公开(公告)日：2011-02-08
申请号：US10593152
申请日：2005-03-15
申请人： Seiji Nagatani
发明人： Seiji Nagatani
IPC分类号： B32B15/08
CPC分类号： H05K3/4655 , H05K3/025 , H05K3/384 , H05K3/389 , H05K3/427 , H05K3/4652 , H05K2201/0358 , Y10S428/901 , Y10T428/12431 , Y10T428/12438 , Y10T428/12569 , Y10T428/12903 , Y10T428/1291
摘要： An electrodeposited copper foil with carrier foil on which a resin layer for forming an insulating layer is formed, comprising a carrier foil, a bonding interface layer, an electrodeposited copper foil with smooth surfaces on both sides and a resin layer. The resin layer is composed of 20 to 80 parts by weight of an epoxy resin and a curing agent, 20 to 80 parts by weight of a solvent soluble aromatic polyamide resin polymer and optionally a curing accelerator in a suitable amount.
摘要翻译：一种具有载体箔的电沉积铜箔，其上形成有用于形成绝缘层的树脂层，包括载体箔，接合界面层，两侧具有光滑表面的电沉积铜箔和树脂层。树脂层由20〜80重量份的环氧树脂和固化剂组成，20〜80重量份的溶剂可溶性芳香族聚酰胺树脂聚合物和任选的适当量的固化促进剂。

10. 发明授权

US07749610B2 Copper foil and method of manufacturing the same 失效
标题翻译：铜箔及其制造方法
公开(公告)号：US07749610B2
公开(公告)日：2010-07-06
申请号：US11547517
申请日：2005-03-31
申请人： Kenichiro Iwakiri , Seiji Nagatani
发明人： Kenichiro Iwakiri , Seiji Nagatani
IPC分类号： B32B15/20 , C25D7/06 , C25D3/38 , H05K1/09
CPC分类号： C25D7/06 , H05K3/382 , H05K2201/0355 , Y10T428/12438 , Y10T428/12569 , Y10T428/1291 , Y10T428/12993
摘要： The object is to provide copper foil of high adhesion even when the roughness Rz of a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A(S), and a roughness Rz(S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness Rz(S) is 1.0 μm to 3.0 μm, 0.5×Rz(S)+0.5≦C(S) (1) where Rz(S) is a numerical value represented by μm.
摘要翻译：本发明的目的是提供铜箔的结节面的粗糙度Rz低的高粘合性的铜箔及其制造方法。为了实现该目的，采用铜箔，其特征在于，由三维表面积A（S）由A（S）/ B（S）定义的面积系数C（S），其中通过在激光显微镜下对铜箔样品S的结节面的表面积进行三维测量，并且从作为三维测量区域的测量区域的面积的测量区域B（S）获得，通过触针式粗糙度计测量的铜箔样品S的结节面的尺寸表面积A（S）和粗糙度Rz（S）具有以下等式（1）的关系，并且因此粗糙度Rz（S）为1.0μm〜3.0μm，0.5×Rz（S）+ 0.5＆amp; NlE; C（S）（1）其中，Rz（S）为由μm表示的数值。

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