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    • 6. 发明申请
    • LIGHT EMITTING DEVICE
    • 发光装置
    • US20090267093A1
    • 2009-10-29
    • US12067194
    • 2005-12-28
    • Kazuo KamadaYasushi NishiokaYouji Urano
    • Kazuo KamadaYasushi NishiokaYouji Urano
    • H01L33/00
    • H01L33/483H01L33/505H01L33/507H01L33/58H01L33/60H01L33/642H01L2224/45144H01L2224/48091H01L2224/73265H01L2924/19107H01L2924/00014H01L2924/00
    • A light emitting device includes a light emitting diode chip, a heat conductive plate mounting thereon the light emitting diode chip, a sub-mount member disposed between said light emitting diode chip and said heat conductive plate, a dielectric substrate stacked on the heat conductive plate and being formed with a through-hole through which the sub-mount member is exposed, an encapsulation member for encapsulation of said light emitting diode chip, and a lens superimposed on the encapsulation member. The sub-mount member is formed around a coupling portion of the light emitting diode chip with a reflective film which reflects a light emitted from a side face of the light emitting diode chip. The sub-mount member is selected to have a thickness such that the reflecting film has its surface spaced away from said heat conductive plate by a greater distance than said dielectric substrate.
    • 发光装置包括:发光二极管芯片,安装在发光二极管芯片上的导热板,设置在所述发光二极管芯片和所述导热板之间的副安装构件,堆叠在所述导热板上的电介质基板 并且形成有用于露出子安装构件的通孔,用于封装所述发光二极管芯片的封装构件和叠置在封装构件上的透镜。 副安装构件围绕发光二极管芯片的耦合部分形成有反射膜,该反射膜反射从发光二极管芯片的侧面发射的光。 子安装构件被选择为具有使得反射膜的表面与所述导热板间隔远离所述电介质基板的厚度的厚度。
    • 7. 发明授权
    • LED lighting fixture
    • LED照明灯具
    • US07948001B2
    • 2011-05-24
    • US12066433
    • 2006-09-20
    • Kazuo KamadaYasushi NishiokaYouji Urano
    • Kazuo KamadaYasushi NishiokaYouji Urano
    • H01L23/28H01L23/373
    • F21K9/00F21V21/30F21Y2115/10H01L33/486H01L33/505H01L33/507H01L33/58H01L33/641H01L2224/73265H01L2924/19107
    • A light-emitting device held on a fixture body includes an LED chip, a heat transfer plate made of a thermally conductive material on which the LED chip is mounted, a wiring board having, on one side, patterned conductors, for supplying an electric power to the LED chip and formed with an aperture (exposure part) through which a LED chip mount surface of the heat transfer plate is exposed, an encapsulation part in which the LED chip is encapsulated on the one side of the wiring board, and a dome-shaped color-changing member made of a fluorescent material and an optically transparent material and placed on the one side of the wiring board. The light-emitting device is bonded to the fixture body with an insulating layer interposed therebetween, and the insulating layer has electrical insulating properties and is interposed between the heat transfer plate and the fixture body to thermally couple the same.
    • 保持在固定体上的发光装置包括LED芯片,由其上安装有LED芯片的导热材料制成的传热板,布线板,一侧具有图案导体,用于提供电力 在LED芯片上形成有露出传热板的LED芯片安装面的开口部(曝光部),将LED芯片封装在布线基板一侧的封装部和圆顶部 由荧光材料和光学透明材料制成并设置在布线板的一侧上的彩色变色构件。 发光装置以夹着绝缘层的方式与固定体接合,绝缘层具有电绝缘性,插入在传热板与固定体之间,使其热耦合。
    • 8. 发明申请
    • LED LIGHTING FIXTURE
    • LED照明灯具
    • US20100148196A1
    • 2010-06-17
    • US12066433
    • 2006-09-20
    • Kazuo KamadaYasushi NishiokaYouji Urano
    • Kazuo KamadaYasushi NishiokaYouji Urano
    • H01L33/00
    • F21K9/00F21V21/30F21Y2115/10H01L33/486H01L33/505H01L33/507H01L33/58H01L33/641H01L2224/73265H01L2924/19107
    • A light-emitting device held on a fixture body includes an LED chip, a heat transfer plate made of a thermally conductive material on which the LED chip is mounted, a wiring board having, on one side, patterned conductors, for supplying an electric power to the LED chip and formed with an aperture (exposure part) through which a LED chip mount surface of the heat transfer plate is exposed, an encapsulation part in which the LED chip is encapsulated on the one side of the wiring board, and a dome-shaped color-changing member made of a fluorescent material and an optically transparent material and placed on the one side of the wiring board. The light-emitting device is bonded to the fixture body with an insulating layer interposed therebetween, and the insulating layer has electrical insulating properties and is interposed between the heat transfer plate and the fixture body to thermally couple the same.
    • 保持在固定体上的发光装置包括LED芯片,由其上安装有LED芯片的导热材料制成的传热板,布线板,一侧具有图案导体,用于提供电力 在LED芯片上形成有露出传热板的LED芯片安装面的开口部(曝光部),将LED芯片封装在布线基板一侧的封装部和圆顶部 由荧光材料和光学透明材料制成并设置在布线板的一侧上的彩色变色构件。 发光装置以夹着绝缘层的方式与固定体接合,绝缘层具有电绝缘性,插入在传热板与固定体之间,使其热耦合。
    • 9. 发明授权
    • Light emitting device
    • 发光装置
    • US07956372B2
    • 2011-06-07
    • US12067194
    • 2005-12-28
    • Kazuo KamadaYasushi NishiokaYouji Urano
    • Kazuo KamadaYasushi NishiokaYouji Urano
    • H01L33/48
    • H01L33/483H01L33/505H01L33/507H01L33/58H01L33/60H01L33/642H01L2224/45144H01L2224/48091H01L2224/73265H01L2924/19107H01L2924/00014H01L2924/00
    • A light emitting device includes a light emitting diode chip, a heat conductive plate mounting thereon the light emitting diode chip, a sub-mount member disposed between said light emitting diode chip and said heat conductive plate, a dielectric substrate stacked on the heat conductive plate and being formed with a through-hole through which the sub-mount member is exposed, an encapsulation member for encapsulation of said light emitting diode chip, and a lens superimposed on the encapsulation member. The sub-mount member is formed around a coupling portion of the light emitting diode chip with a reflective film which reflects a light emitted from a side face of the light emitting diode chip. The sub-mount member is selected to have a thickness such that the reflecting film has its surface spaced away from said heat conductive plate by a greater distance than said dielectric substrate.
    • 发光装置包括:发光二极管芯片,安装在发光二极管芯片上的导热板,设置在所述发光二极管芯片和所述导热板之间的副安装构件,堆叠在所述导热板上的电介质基板 并且形成有用于露出子安装构件的通孔,用于封装所述发光二极管芯片的封装构件和叠置在封装构件上的透镜。 副安装构件围绕发光二极管芯片的耦合部分形成有反射膜,该反射膜反射从发光二极管芯片的侧面发射的光。 子安装构件被选择为具有使得反射膜的表面与所述导热板间隔远离所述电介质基板的厚度的厚度。