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    • 1. 发明授权
    • Method for manufacturing three-dimensional photonic structure
    • 制造三维光子结构的方法
    • US07682551B2
    • 2010-03-23
    • US10525379
    • 2004-06-04
    • Takuji NakagawaKikuo Wakino
    • Takuji NakagawaKikuo Wakino
    • B29C35/08B29C41/02B29C41/20
    • B29C64/135B33Y10/00B33Y30/00B33Y70/00B33Y80/00
    • A three-dimensional component having cavities containing a photocurable resin material and having a structure in which a plurality of cured resin layers composed of the photo-cured resin material are stacked, is manufactured by stereolithography. Inorganic members are inserted into concave portions when the concave portions are formed before covering the cavities, each of the concave portions being at least a portion of the corresponding cavity, and the photocurable resin material remaining. When the three-dimensional component is completed, the photocurable resin material remaining in the cavity is thermally cured, thus being brought into contact with the inorganic members. In this manner, a three-dimensional photonic structure having the plurality of inorganic members precisely disposed at desired periodic positions within the resin matrix is efficiently manufactured.
    • 通过立体光刻法制造具有包含光固化树脂材料并具有多个由光固化树脂材料构成的多个固化树脂层的结构的具有空腔的三维部件。 当在覆盖空腔之前形成凹部时,将无机构件插入到凹部中,每个凹部至少部分相应的空腔,并且光固化树脂材料残留。 当三维成分完成时,留在空腔中的光固化树脂材料被热固化,从而与无机部件接触。 以这种方式,有效地制造了具有精确设置在树脂基体内的期望周期位置的多个无机部件的三维光子结构。
    • 2. 发明申请
    • Photonic three-dimensional structure and method for production thereof
    • 光子三维结构及其制备方法
    • US20050285115A1
    • 2005-12-29
    • US10525379
    • 2004-06-04
    • Takuji NakagawaKikuo Wakino
    • Takuji NakagawaKikuo Wakino
    • B29C67/00G02B1/02H01L29/15H01L31/0256
    • B29C64/135B33Y10/00B33Y30/00B33Y70/00B33Y80/00
    • A three-dimensional component having cavities containing a photocurable resin material and having a structure in which a plurality of cured resin layers composed of the photo-cured resin material are stacked, is manufactured by stereolithography. Inorganic members are inserted into concave portions when the concave portions are formed before covering the cavities, each of the concave portions being at least portion of the corresponding cavity, and the photocurable resin material remaining. When the three-dimensional component is completed, the photocurable resin material remaining in the cavity is thermally cured, thus being brought into contact with the inorganic members. In this manner, a three-dimensional photonic structure having the plurality of inorganic members precisely disposed at desired periodic positions within the resin matrix is efficiently manufactured.
    • 通过立体光刻法制造具有包含光固化树脂材料并具有多个由光固化树脂材料构成的多个固化树脂层的结构的具有空腔的三维部件。 当在覆盖空腔之前形成凹部时,将无机构件插入到凹部中,每个凹部为相应空腔的至少一部分,并且光固化树脂材料残留。 当三维成分完成时,留在空腔中的光固化树脂材料被热固化,从而与无机部件接触。 以这种方式,有效地制造了具有精确设置在树脂基体内的期望周期位置的多个无机部件的三维光子结构。
    • 8. 发明授权
    • Fixing structure of dielectric resonator
    • 电介质谐振器固定结构
    • US5164691A
    • 1992-11-17
    • US634733
    • 1990-12-27
    • Kikuo WakinoAtsushi InoueFumiaki Kinoshita
    • Kikuo WakinoAtsushi InoueFumiaki Kinoshita
    • H01P7/10
    • H01P7/10
    • Structure for use in forming a resonant circuit eliminates a support block for the installation of a dielectric resonator, by providing a satisfactory way to directly install the dielectric resonator on a microwave circuit board having a microstrip line. The dielectric resonator is directly fixed on the microwave circuit board in such a manner that mutually opposing planar surfaces thereof do not face one planar surface of the microwave circuit board, and an axial line passing normally through these planar surfaces intersects a normal plane projected from the microstrip line. As a result, production costs can be reduced and simplified work processes can be used to fabricate the structure. Further, an electrode film may be formed on a flat part of the outer periphery of the dielectric resonator, and such a dielectric resonator is fixed on the microwave circuit board with the flat part on which said electrode film is formed, facing upwards. As a result, a metallic case which is to cover the microwave circuit board can be brought close to the dielectric resonator, thereby achieving a compact overall structure.
    • 用于形成谐振电路的结构通过提供将介质谐振器直接安装在具有微带线的微波电路板上的令人满意的方式来消除用于安装介质谐振器的支撑块。 介质谐振器直接固定在微波电路板上,使得它们相互相对的平面不面对微波电路板的一个平面,通过这些平面的正交轴线与从 微带线。 结果,可以减少生产成本,并且可以简化工作流程来制造结构。 此外,可以在介质谐振器的外周的平坦部分上形成电极膜,并且将这种介质谐振器固定在微波电路板上,其上形成有所述电极膜的​​平坦部分面向上。 结果,覆盖微波电路板的金属壳体可以靠近介质谐振器,从而实现了紧凑的整体结构。