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    • 3. 发明授权
    • Composite substrate, method of making, and EL device using the same
    • 复合基板,制造方法以及使用其的EL装置
    • US06709695B2
    • 2004-03-23
    • US09970803
    • 2001-10-05
    • Taku TakeishiKatsuto NaganoSuguru Takayama
    • Taku TakeishiKatsuto NaganoSuguru Takayama
    • B05D512
    • H05B33/22H05B33/02H05B33/10H05B33/12Y10S428/917
    • The invention aims to provide a method for preparing a composite substrate, which prevents an insulating layer surface from becoming rugged under the influence of an electrode layer, and eliminates a polishing step, whereby the composite substrate is easy to manufacture and ensures high display quality when applied to thin-film light emitting devices, the composite substrate and an thin-film EL device using the same. The object is attained by a method for preparing a composite substrate by successively applying an electrode paste and an insulator paste onto an electrically insulating substrate as thick films to form a composite substrate precursor having a green electrode layer and a green insulator layer laminated, subjecting the precursor to pressing treatment for smoothing its surface, and firing; the composite substrate and an EL device using the same.
    • 本发明的目的在于提供一种制备复合基板的方法,其防止绝缘层表面在电极层的影响下变得坚固,并且消除了抛光步骤,由此复合基板易于制造并且确保了高显示质量 应用于薄膜发光器件,复合衬底和使用其的薄膜EL器件。 本发明的目的是通过将电极浆料和绝缘体糊剂依次施加到电绝缘基板上作为厚膜来制备复合基板的方法,以形成具有层压的绿色电极层和绿色绝缘体层的复合基板前体, 用于平滑其表面的压制处理的前体和烧制; 复合基板和使用其的EL器件。
    • 5. 发明授权
    • Method of making a composite substrate
    • 制作复合基板的方法
    • US06800322B2
    • 2004-10-05
    • US09971699
    • 2001-10-09
    • Taku TakeishiKatsuto NaganoJun HagiwaraSuguru Takayama
    • Taku TakeishiKatsuto NaganoJun HagiwaraSuguru Takayama
    • B05D512
    • H05B33/22H05B33/02H05B33/10H05B33/12Y10S428/917
    • The invention aims to provide a method for preparing a composite substrate of substrate/electrode/dielectric layer structure having a thick-film dielectric layer with a smooth surface using a sol-gel solution of high concentration capable of forming a film to a substantial thickness without generating cracks, the composite substrate and an EL device using the same. The object is attained by a method for preparing a composite substrate including in order an electrically insulating substrate, an electrode and an insulator layer formed thereon by a thick film technique, wherein a thin-film insulator layer is formed on the insulator layer by applying to the insulator layer a sol-gel solution obtained by dissolving a metal compound in a diol represented by OH(CH2)nOH as a solvent, followed by drying and firing; the composite substrate and an EL device using the same.
    • 本发明的目的在于提供一种用于制备具有光滑表面的厚膜电介质层的基片/电极/电介质层结构的复合衬底的方法,该方法使用能够形成薄膜的高浓度溶胶 - 凝胶溶液, 产生裂纹,复合基板和使用其的EL器件。 该目的是通过一种制备复合衬底的方法来实现的,该复合衬底包括按照通过厚膜技术在其上形成的电绝缘衬底,电极和绝缘体层的顺序,其中通过施加到绝缘体层上形成薄膜绝缘体层 绝缘体层通过将金属化合物溶解在由OH(CH 2)nOH表示的二醇中作为溶剂而获得的溶胶 - 凝胶溶液,然后干燥和烧制; 复合基板和使用其的EL器件。
    • 7. 发明授权
    • Composite substrate preparing method, composite substrate, and EL device
    • 复合基板制备方法,复合基板和EL器件
    • US06672922B2
    • 2004-01-06
    • US09866697
    • 2001-05-30
    • Yukihiko ShirakawaTaku Takeishi
    • Yukihiko ShirakawaTaku Takeishi
    • H01J902
    • H05B33/10
    • The invention aims to provide a method for preparing a composite substrate which has minimized surface asperities on a dielectric layer, which are otherwise developed under the influence of an electrode layer, unevenness upon printing, and surface roughness inherent to thick-film dielectrics, which eliminates a need for a polishing step, which is easy to manufacture, and which is applicable to the fabrication of a thin-film light-emitting device of high display quality, as well as the resulting composite substrate and a thin-film EL device using the same. The object is attained by a method for preparing a composite substrate, comprising the steps of forming at least an electrode and a green dielectric layer according to a thick-film technique on an electrically insulating substrate, thereby providing a composite substrate precursor, smoothing the surface of the precursor by WIP process, and firing to complete the composite substrate, as well as the resulting composite substrate and a thin-film EL device using the same.
    • 本发明的目的是提供一种制备复合衬底的方法,该复合衬底具有最小化的电介质层上的表面粗糙度,否则在电极层的影响下显影,印刷时的不均匀性以及厚膜电介质固有的表面粗糙度,这消除了 需要易于制造的抛光步骤,并且其可应用于制造具有高显示质量的薄膜发光器件,以及所得到的复合衬底和使用该膜的EL膜器件的薄膜EL器件 相同。 该目的通过一种制备复合衬底的方法来实现,包括以下步骤:在电绝缘衬底上根据厚膜技术形成至少一个电极和一个绿色电介质层,从而提供复合衬底前体,使表面平滑 的前体,通过烧成来完成复合基板,以及所得复合基板和使用其的薄膜EL器件。