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    • 1. 发明授权
    • Thick film print head structure and control circuit
    • 厚膜打印头结构和控制电路
    • US09186905B2
    • 2015-11-17
    • US13481546
    • 2012-05-25
    • Takeshi ToyosawaJiun-Chung WangChung I. Tan
    • Takeshi ToyosawaJiun-Chung WangChung I. Tan
    • B41J2/14B41J2/335B41J2/345B41J2/355
    • B41J2/3352B41J2/345B41J2/355
    • A new structure (FIG. 11) for a thick-film thermal printhead and a variety of implementation approaches for controlling such a printhead. In the structure of the invention, the conductive lead at each end of the heater element is switched to either the power supply (Vhd) or ground, depending on the corresponding nib data bit. The improvement over a traditional center-tap structure (FIG. 1) is the reduction of density of conductive leads to achieve the resolution of printed dots. Compared to the printhead structure of alternated conductive system, either with diodes (FIG. 2) or without diodes (FIG. 4), which both suffer from the introduction of undesirable leaking currents, the printhead structure of the invention provides the advantage of eliminating leakage current completely. Control of the thermal printhead according to the invention is based on the sequential exclusive-OR (XOR) logic operation applied to the shifted-in nib data bit stream. The XOR functionality may be incorporated in the driver IC, embedded in the raster data processing FPGA (Field Programming Gate Array), or implemented in the form of a lookup table in the memory block of a main processor system. All prior art advanced controls based on a multi-pulse strategy can be applied directly from those used in prior art printhead structures to the controls for the thermal printhead for this invention without modification. A new driver IC (FIG. 26) is also disclosed according to the invention in which the outputs are SPDT (Single-Pole-Double-Throw) switches and the built-in XOR gates can be configured to act in the pass-through mode, if required, so that the new driver IC may be used as a traditional driver IC.
    • 用于厚膜热敏打印头的新结构(图11)和用于控制这种打印头的各种实现方法。 在本发明的结构中,取决于对应的笔尖数据位,加热元件的每一端处的导电引线被切换到电源(Vhd)或接地。 传统的中心抽头结构(图1)的改进是降低导电引线的密度以实现印刷点的分辨率。 与交替导电系统的打印头结构相比,无论是二极管(图2)还是没有二极管(图4),它们都会引入不希望的漏电流,本发明的打印头结构提供了消除泄漏的优点 目前完全 根据本发明的热打印头的控制基于应用于移入的笔尖数据比特流的顺序异或(XOR)逻辑运算。 XOR功能可以并入嵌入在光栅数据处理FPGA(Field Programming Gate Array)中的驱动器IC中,或者以主处理器系统的存储器块中的查找表的形式实现。 基于多脉冲策略的所有现有技术的高级控制可以直接从现有技术的打印头结构中使用的先进控制应用于本发明的热打印头的控制,而无需修改。 根据本发明还公开了一种新的驱动器IC(图26),其中输出是SPDT(单极双掷)开关,并且内置的异或门可被配置为以直通模式 如果需要,使得新的驱动器IC可以用作传统的驱动器IC。
    • 2. 发明申请
    • THICK FILM PRINT HEAD STRUCTURE AND CONTROL CIRCUIT
    • 厚膜打印头结构和控制电路
    • US20130314473A1
    • 2013-11-28
    • US13481546
    • 2012-05-25
    • Takeshi ToyosawaJ. C. WangChung I. Tan
    • Takeshi ToyosawaJ. C. WangChung I. Tan
    • B41J2/335
    • B41J2/3352B41J2/345B41J2/355
    • A thick-film thermal printhead (FIG. 11) and a variety of implementation approaches for controlling such a printhead. The conductive lead at each end of the heater element is switched to either the power supply (Vhd) or ground, depending on the corresponding nib data bit with the advantage of eliminating leakage current completely.Thermal printhead control is based on the sequential exclusive-OR (XOR) logic operation applied to the shifted-in nib data bit stream. The XOR function may be within the driver IC, the raster data processing FPGA (Field Programming Gate Array), or in a lookup table in the memory block of a main processor system.A new driver IC is disclosed in which the outputs are SPDT (Single-Pole-Double-Throw) switches, and the built-in XOR gates are configured to act in the pass-through mode, so that the new driver IC may be used as a traditional driver IC.
    • 厚膜热敏打印头(图11)以及用于控制这种打印头的各种实现方法。 取决于对应的笔尖数据位,加热器元件两端的导电线切换到电源(Vhd)或接地,具有完全消除泄漏电流的优点。 热打印头控制基于应用于移入的笔尖数据位流的顺序异或(XOR)逻辑运算。 XOR功能可能在驱动器IC,栅格数据处理FPGA(现场编程门阵列)中,或者在主处理器系统的存储器块中的查找表中。 公开了一种新的驱动器IC,其中输出是SPDT(单极双掷)开关,并且内置的异或门被配置为以直通模式运行,使得可以使用新的驱动器IC 作为传统驱动IC。