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    • 7. 发明申请
    • Disposable diaper
    • 一次性尿布
    • US20060184151A1
    • 2006-08-17
    • US10830426
    • 2004-08-23
    • Kazuaki OnishiYusuke Kawakami
    • Kazuaki OnishiYusuke Kawakami
    • A61F13/15
    • A61F13/495A61F13/15203
    • Here is disclosed a disposable diaper, which includes a liquid-absorbent zone in a crotch region having first through fourth sections. A stiffness of the first and second sections formed from top- and backsheets is lower than a stiffness of the third and fourth sections formed from the top- and backsheets and an absorent core. Stretchably elastic members extending in a longitudinal direction are contractibly attached to the fourth section. A liquid-absorbent zone in the crotch region is formed with a concavity (feces pocket) as the fourth section contract in the longitudinal direction under a contractile force of the elastic members.
    • 这里公开了一次性尿布,其包括在具有第一至第四部分的裆部区域中的吸液区域。 由顶片和底片形成的第一和第二部分的刚度低于由顶片和底片形成的第三部分和第四部分的刚度以及不完整的核心。 沿纵向方向延伸的可伸缩的弹性构件可收缩地附接到第四部分。 裆部区域中的吸液区形成有凹部(粪便袋),第四部分在弹性部件的收缩力下沿纵向收缩。
    • 10. 发明授权
    • Semiconductor device and method for manufacturing same
    • 半导体装置及其制造方法
    • US08278744B2
    • 2012-10-02
    • US12536331
    • 2009-08-05
    • Kazuaki Onishi
    • Kazuaki Onishi
    • H01L23/02
    • H05K1/144H01L25/072H01L25/16H01L2924/0002H01L2924/13055H01L2924/13091H01L2924/19041H01L2924/19043H05K3/3421H05K2201/1031H05K2201/10409H05K2201/10424Y02P70/611H01L2924/00
    • A semiconductor device includes: a semiconductor chip mounting substrate, a control circuit board, a power terminal holder and a semi-fixing member. The semiconductor chip mounting substrate includes a substrate, a semiconductor chip provided on a first major surface of the substrate, and a first and second semiconductor chip connection electrodes. The control circuit board is provided generally in parallel to the first major surface and includes a control circuit, a control signal terminal connected to the control circuit, and a through hole extending in a direction generally perpendicular to the first major surface. The power terminal holder is provided on opposite side of the control circuit board from the semiconductor chip mounting substrate and includes a power terminal. The semi-fixing member includes a shank portion and an end portion. The shank portion is fixed to the power terminal holder and penetrates through the through hole. A cross section of the shank portion in a plane orthogonal to the extending direction of the through hole is smaller than a size of the through hole. The end portion is connected to a tip of the shank portion. A cross section of the end portion in the plane is larger than the size of the through hole. The first semiconductor chip connection electrode is connected to a first terminal of the semiconductor chip and the control signal terminal. The second semiconductor chip connection electrode is connected to a second terminal of the semiconductor chip and the power terminal.
    • 半导体器件包括:半导体芯片安装基板,控制电路板,电源端子保持器和半固定部件。 半导体芯片安装基板包括基板,设置在基板的第一主表面上的半导体芯片以及第一和第二半导体芯片连接电极。 控制电路板大致平行于第一主表面设置,并且包括控制电路,连接到控制电路的控制信号端子以及沿大致垂直于第一主表面的方向延伸的通孔。 电源端子保持器设置在控制电路板的与半导体芯片安装基板相对的一侧,并且包括电源端子。 半固定构件包括柄部和端部。 柄部分固定在电源端子支架上并穿过通孔。 在与通孔的延伸方向正交的平面中的柄部的横截面小于通孔的尺寸。 端部连接到柄部的尖端。 平面中的端部的横截面大于通孔的尺寸。 第一半导体芯片连接电极连接到半导体芯片的第一端子和控制信号端子。 第二半导体芯片连接电极连接到半导体芯片的第二端子和电源端子。