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    • 5. 发明申请
    • Polyester sealing resin composition
    • 聚酯密封树脂组成
    • US20050101715A1
    • 2005-05-12
    • US10983031
    • 2004-11-05
    • Giichi Konishi
    • Giichi Konishi
    • C09K3/10C08K3/22C08L25/18C08L67/00C08L67/02C09K21/02C09K21/08H01H9/04H01H11/00B29C70/88C08K3/10C08K5/02
    • C08L67/02C08K3/2279C08L25/18H01H9/04C08L2666/06
    • It is intended to provide a sealing and molding resin composition capable of sealing an electric and electronic component to be sealed without degrading function and reliability thereof and providing a switch component excellent in water resistance, durability and flame resistance, and to provide a method for sealing an electronic component using the sealing resin composition; wherein the sealing and molding resin composition is a polyester sealing resin composition comprising a polyester resin (A) having a molten viscosity of 1000 dPa·s or less at 200° C., a glass transition temperature of −10° C. or less and a melting point of 70° C. to 200° C., and antimony trioxide (B) and polydibromostyrene (C) as a flame resistant agent at a weight percentage of (A):((B)+(C))=100:20 to 30 and (B):(C)=1:1 to 4, and the method comprises the step of sealing an electronic component with the sealing resin composition.
    • 本发明提供一种密封和模塑树脂组合物,其能够密封待密封的电气和电子部件,而不会降低其功能和可靠性,并提供耐水性,耐久性和阻燃性优异的开关部件,并提供密封方法 使用密封树脂组合物的电子部件; 其中所述密封和模塑树脂组合物是聚酯密封树脂组合物,其包含在200℃下熔融粘度为1000dPa.s或更低的玻璃化转变温度为-10℃或更低的聚酯树脂(A)和 (A):((B)+(C))= 100的熔点为70℃〜200℃,三氧化锑(B)和聚二溴苯乙烯(C)为阻燃剂 :20〜30,(B):(C)= 1:1〜4,该方法包括用密封树脂组合物密封电子部件的步骤。