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1. 发明授权

US06756011B2 High-strength, high corrosion-resistant and non-magnetic stainless steel 有权
标题翻译：高强度，高耐腐蚀和非磁性不锈钢
公开(公告)号：US06756011B2
公开(公告)日：2004-06-29
申请号：US10062448
申请日：2002-02-05
申请人： Takeshi Koga , Tetsuya Shimizu , Toshiharu Noda
发明人： Takeshi Koga , Tetsuya Shimizu , Toshiharu Noda
IPC分类号： C22C3820
CPC分类号： C22C38/38 , C22C38/001
摘要： A high-strength, high corrosion-resistant and non-magnetic stainless steel which is further excellent in strength and corrosion resistance and safe in the living body and also can stand against various corrosive environments. The stainless steel comprises 0.15% by weight or less of C, 1.0% or less of Si, 3.0 to 12.0% of Mn, 0.030% or less of P, 0.50% or less of Ni, 15.0 to 21.0% of Cr, 0.70 to 1.50% of N, 0.020% or less of Al and 0.020% or less of O, and a remainder of Fe and inevitable impurities.
摘要翻译：高强度，高耐腐蚀，无磁性的不锈钢，其强度和耐腐蚀性进一步优异，机体安全，也可抵抗各种腐蚀环境。不锈钢包含C：0.15重量％以下，Si 1.0％以下，Mn：3.0〜12.0％，P：0.030％以下，Ni：0.50％以下，Cr：15.0〜21.0％，Cr：0.70〜 N为1.50％，Al为0.020％以下，O为0.020％以下，余量为Fe和不可避免的杂质。

2. 发明授权

US06673165B2 High-hardness martensitic stainless steel excellent in corrosion resistance 有权
标题翻译：高硬度马氏体不锈钢耐腐蚀性优良
公开(公告)号：US06673165B2
公开(公告)日：2004-01-06
申请号：US10083120
申请日：2002-02-27
申请人： Takeshi Koga , Tetsuya Shimizu , Toshiharu Noda
发明人： Takeshi Koga , Tetsuya Shimizu , Toshiharu Noda
IPC分类号： C22C3818
CPC分类号： C22C38/001 , C22C38/18 , C22C38/42
摘要： A high-hardness martensitic stainless steel excellent in corrosion resistance, comprising less than 0.15% by weight of C, from 0.10 to 1.0% by weight of Si, from 0.10 to 2.0% by weight of Mn, 0.010% or less of S, from 12.0 to 18.5% by weight of Cr, from 0.40 to 0.80% by weight of N, less than 0.030% by weight of Al, less than 0.020% by weight of O, and substantially the balance of Fe. The martensitic stainless steel of the present invention has cold-workability and hardness after tempering higher than that of SUS420J2 and corrosion resistance equivalent to or higher than that of an austenitic stainless steel SUS316.
摘要翻译：耐腐蚀性优异的高硬度马氏体系不锈钢，含有0.15重量％以下的C，0.10〜1.0重量％的Si，0.10〜2.0重量％的Mn，0.010％以下的S， 12.0-18.5重量％的Cr，0.40-0.80重量％的N，小于0.030重量％的Al，小于0.020重量％的O和基本上余量的Fe。本发明的马氏体系不锈钢的冷加工性和回火后的硬度高于SUS420J2，耐腐蚀性等于或高于奥氏体不锈钢SUS316。

3. 发明授权

US5940267A Heat sink for cooling a heat producing element and application 失效
公开(公告)号：US5940267A
公开(公告)日：1999-08-17
申请号：US710279
申请日：1996-09-13
申请人： Tadashi Katsui , Katsuhiko Nakata , Takeshi Koga , Tadanobu Matsumura , Yoshimi Tanaka , Yasuaki Sugimoto , Takashi Kitahara , Takayuki Horinishi
发明人： Tadashi Katsui , Katsuhiko Nakata , Takeshi Koga , Tadanobu Matsumura , Yoshimi Tanaka , Yasuaki Sugimoto , Takashi Kitahara , Takayuki Horinishi
IPC分类号： H01L23/36 , G06F1/20 , H01L23/40 , H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , F28F3/022 , G06F1/20 , G06F1/203 , G06F1/206 , H01L23/4006 , H01L2924/0002
摘要： A heat sink mounted on a heat producing element for cooling the heat producing element attached on the printed board of the electronic apparatus, having a heat sink body made of a good heat conductive material and a fan assembly installed inside the heat sink body. The heat sink body is efficiently air-cooled by a cooling air generated by the rotation of the fan assembly. The cooling air forcibly cools a base and a fixing wall of the base adjacent to the heat producing element and plate-like radiating fins or a pin-like radiating fins are protruded on the heat sink body to radiate the heat effectively. The position of the fan assembly is at the center of the heat sink body or is at the offset position from the center of the heat sink body. The heat sink of the present invention can be installed in a portable electronic apparatus such as a portable computer.

4. 发明授权

US5650912A Heat sink for cooling a heat producing element and application 失效
标题翻译：散热片用于冷却发热元件和应用
公开(公告)号：US5650912A
公开(公告)日：1997-07-22
申请号：US478667
申请日：1995-06-07
申请人： Tadashi Katsui , Katsuhiko Nakata , Takeshi Koga , Tadanobu Matsumura , Yoshimi Tanaka , Yasuaki Sugimoto , Takashi Kitahara , Takayuki Horinishi
发明人： Tadashi Katsui , Katsuhiko Nakata , Takeshi Koga , Tadanobu Matsumura , Yoshimi Tanaka , Yasuaki Sugimoto , Takashi Kitahara , Takayuki Horinishi
IPC分类号： H01L23/36 , G06F1/20 , H01L23/40 , H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , F28F3/022 , G06F1/20 , G06F1/203 , G06F1/206 , H01L23/4006 , H01L2924/0002
摘要： A heat sink mounted on a heat producing element for cooling the heat producing element attached on the printed board of the electronic apparatus, having a heat sink body made of a good heat conductive material and a fan assembly installed inside the heat sink body. The heat sink body is efficiently air-cooled by a cooling air generated by the rotation of the fan assembly. The cooling air forcibly cools a base and a fixing wall of the base adjacent to the heat producing element and plate-like radiating fins or a pin-like radiating fins are protruded on the heat sink body to radiate the heat effectively. The position of the fan assembly is at the center of the heat sink body or is at the offset position from the center of the heat sink body. The heat sink of the present invention can be installed in a portable electronic apparatus such as a portable computer.
摘要翻译：一种安装在发热元件上的散热器，用于冷却安装在电子设备的印刷电路板上的发热元件，该发热元件具有由热导性材料制成的散热体和安装在散热体内部的风扇组件。通过由风扇组件的旋转产生的冷却空气有效地对散热体进行空气冷却。冷却空气强制地冷却基座和与发热元件相邻的基座的固定壁和板状散热片，或者在散热体上突出有销状的散热片，以有效地散热。风扇组件的位置位于散热器主体的中心，或者位于散热器主体中心的偏移位置。本发明的散热器可以安装在诸如便携式计算机的便携式电子设备中。

5. 发明授权

US5504650A Heat sink for cooling a heat producing element and application 失效
公开(公告)号：US5504650A
公开(公告)日：1996-04-02
申请号：US433131
申请日：1995-05-03
申请人： Tadashi Katsui , Katsuhiko Nakata , Takeshi Koga , Tadanobu Matsumura , Yoshimi Tanaka , Yasuaki Sugimoto , Takashi Kitahara , Takayuki Horinishi
发明人： Tadashi Katsui , Katsuhiko Nakata , Takeshi Koga , Tadanobu Matsumura , Yoshimi Tanaka , Yasuaki Sugimoto , Takashi Kitahara , Takayuki Horinishi
IPC分类号： H01L23/36 , G06F1/20 , H01L23/40 , H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , F28F3/022 , G06F1/20 , G06F1/203 , G06F1/206 , H01L23/4006 , H01L2924/0002
摘要： A heat sink mounted on a heat producing element for cooling the heat producing element attached on the printed board of the electronic apparatus, having a heat sink body made of a good heat conductive material and a fan assembly installed inside the heat sink body. The heat sink body is efficiently air-cooled by a cooling air generated by the rotation of the fan assembly. The cooling air forcibly cools a base and a fixing wall of the base adjacent to the heat producing element and plate-like radiating fins or a pin-like radiating fins are protruded on the heat sink body to radiate the heat effectively. The position of the fan assembly is at the center of the heat sink body or is at the offset position from the center of the heat sink body. The heat sink of the present invention can be installed in a portable electronic apparatus such as a portable computer.

6. 发明授权

US6067227A Heat sink for cooling a heat producing element and application 有权
标题翻译：散热片用于冷却发热元件和应用
公开(公告)号：US6067227A
公开(公告)日：2000-05-23
申请号：US246956
申请日：1999-02-09
申请人： Tadashi Katsui , Katsuhiko Nakata , Takeshi Koga , Tadanobu Matsumura , Yoshimi Tanaka , Yasuaki Sugimoto , Takashi Kitahara , Takayuki Horinishi
发明人： Tadashi Katsui , Katsuhiko Nakata , Takeshi Koga , Tadanobu Matsumura , Yoshimi Tanaka , Yasuaki Sugimoto , Takashi Kitahara , Takayuki Horinishi
IPC分类号： H01L23/36 , G06F1/20 , H01L23/40 , H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , F28F3/022 , G06F1/20 , G06F1/203 , G06F1/206 , H01L23/4006 , H01L2924/0002
摘要： A heat sink mounted on a heat producing element for cooling the heat producing element attached on the printed board of the electronic apparatus, having a heat sink body made of a good heat conductive material and a fan assembly installed inside the heat sink body. The heat sink body is efficiently air-cooled by a cooling air generated by the rotation of the fan assembly. The cooling air forcibly cools a base and a fixing wall of the base adjacent to the heat producing element and plate-like radiating fins or a pin-like radiating fins are protruded on the heat sink body to radiate the heat effectively. The position of the fan assembly is at the center of the heat sink body or is at the offset position from the center of the heat sink body. The heat sink of the present invention can be installed in a portable electronic apparatus such as a portable computer.
摘要翻译：一种安装在发热元件上的散热器，用于冷却安装在电子设备的印刷电路板上的发热元件，该发热元件具有由热导性材料制成的散热体和安装在散热体内部的风扇组件。通过由风扇组件的旋转产生的冷却空气有效地对散热体进行空气冷却。冷却空气强制地冷却基座和与发热元件相邻的基座的固定壁和板状散热片，或者在散热体上突出有销状的散热片，以有效地散热。风扇组件的位置位于散热器主体的中心，或者位于散热器主体中心的偏移位置。本发明的散热器可以安装在诸如便携式计算机的便携式电子设备中。

7. 发明申请

US20060285992A1 Steel for a plastic molding die 审中-公开
标题翻译：塑钢成型模具
公开(公告)号：US20060285992A1
公开(公告)日：2006-12-21
申请号：US11444460
申请日：2006-06-01
申请人： Motohiro Ibuki , Shuji Hamano , Takeshi Koga
发明人： Motohiro Ibuki , Shuji Hamano , Takeshi Koga
IPC分类号： C22C38/22
CPC分类号： C22C38/44 , C21D1/18 , C21D6/002 , C21D8/06 , C22C1/00 , C22C38/001 , C22C38/002 , C22C38/02 , C22C38/04 , C22C38/06 , C22C38/46 , C22C38/60
摘要： To provide a steel for plastic molding die which possesses enough hardness, wear resistance and corrosion resistance, and is excellent in high-precision processability and mirror polishing properties. The steel for a plastic molding die contains not more than 0.80 wt % C, not less than 0.01 wt % and less than 1.40 wt % Si, not less than 0.05 wt % and not more than 2.0 wt % Mn, not less than 0.005 wt % and not more than 1.00 wt % Ni, not less than 13.0 wt % and not more than 20.0 wt % Cr, not less than 0.20 wt % and not more than 4.0 wt % Mo+½ W, not less than 0.01 wt % and not more than 1.00 wt % V, not less than 0.36 wt % and not more than 0.80 wt % N, not more than 0.02 wt % O, not more than 0.80 wt % Al, and the remainder substantially including Fe and unavoidable impurities.
摘要翻译：提供具有足够硬度，耐磨性和耐腐蚀性的塑料模具用钢，并且具有优异的高精度加工性和镜面抛光性能。用于塑料模具的钢包含不大于0.80重量％的C，不小于0.01重量％且小于1.40重量％的Si，不小于0.05重量％且不大于2.0重量％的Mn，不小于0.005重量％％，不大于1.00重量％的Ni，不小于13.0重量％且不大于20.0重量％的Cr，不小于0.20重量％且不大于4.0重量％的Mo +½W，不小于0.01重量％，以及不大于1.00重量％的V，不小于0.36重量％且不大于0.80重量％的N，不大于0.02重量％的O，不大于0.80重量％的Al，其余部分基本上包括Fe和不可避免的杂质。

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