专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07857874B2 Micro-reactor and method of manufacturing the same 失效
标题翻译：微反应器及其制造方法
公开(公告)号：US07857874B2
公开(公告)日：2010-12-28
申请号：US10589853
申请日：2005-02-25
申请人： Takeshi Kihara , Hiroshi Yagi , Koichi Suzuki , Yoshiaki Ogiwara , Junji Ninomiya , Kazunori Ishikawa
发明人： Takeshi Kihara , Hiroshi Yagi , Koichi Suzuki , Yoshiaki Ogiwara , Junji Ninomiya , Kazunori Ishikawa
IPC分类号： H01M8/06 , B21D51/16
CPC分类号： B01J19/0093 , B01J23/80 , B01J37/0226 , B01J2219/00783 , B01J2219/00822 , B01J2219/00835 , B01J2219/0086 , B01J2219/00873 , C01B3/323 , C01B2203/0227 , C01B2203/1076 , C25D11/02 , C25D13/02 , C25D13/12 , Y02P20/52 , Y10T29/49345 , Y10T156/10
摘要： A structure of a microreactor includes a joined body having a pair of substrates joined together, a flow path formed by a microchannel portion formed on a joining surface of at least one of the substrates, and a catalyst carrying member disposed in the flow path. In the production of such a microreactor, the catalyst carrying member is produced separately from formation of the joined body and the catalyst carrying member is disposed in the flow path at the time of forming the joined body.
摘要翻译：微反应器的结构包括具有连接在一起的一对基板的接合体，由形成在至少一个基板的接合表面上的微通道部分形成的流路和设置在流路中的催化剂承载部件。在这种微反应器的制造中，催化剂承载部件与接合体的形成分开制造，催化剂负载部件在形成接合体时设置在流路中。

2. 发明申请

US20070163175A1 Micro-reactor and method of manufacturing the same 失效
标题翻译：微反应器及其制造方法
公开(公告)号：US20070163175A1
公开(公告)日：2007-07-19
申请号：US10589853
申请日：2005-02-25
申请人： Takeshi Kihara , Hiroshi Yagi , Koichi Suzuki , Yoshiaki Ogiwara , Junji Ninomiya , Kazunori Ishikawa
发明人： Takeshi Kihara , Hiroshi Yagi , Koichi Suzuki , Yoshiaki Ogiwara , Junji Ninomiya , Kazunori Ishikawa
IPC分类号： H01M8/06 , B21D51/16
CPC分类号： B01J19/0093 , B01J23/80 , B01J37/0226 , B01J2219/00783 , B01J2219/00822 , B01J2219/00835 , B01J2219/0086 , B01J2219/00873 , C01B3/323 , C01B2203/0227 , C01B2203/1076 , C25D11/02 , C25D13/02 , C25D13/12 , Y02P20/52 , Y10T29/49345 , Y10T156/10
摘要： A structure of a microreactor includes a joined body having a pair of substrates joined together, a flow path formed by a microchannel portion formed on a joining surface of at least one of the substrates, and a catalyst carrying member disposed in the flow path. In the production of such a microreactor, the catalyst carrying member is produced separately from formation of the joined body and the catalyst carrying member is disposed in the flow path at the time of forming the joined body.
摘要翻译：微反应器的结构包括具有连接在一起的一对基板的接合体，由形成在至少一个基板的接合表面上的微通道部分形成的流路和设置在流路中的催化剂承载部件。在这种微反应器的生产中，催化剂承载构件与接合体的形成分开制造，催化剂承载构件在形成接合体时设置在流路中。

3. 发明申请

US20110041986A1 MICRO-REACTOR AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：微反应器及其制造方法
公开(公告)号：US20110041986A1
公开(公告)日：2011-02-24
申请号：US12940174
申请日：2010-11-05
申请人： Takeshi KIHARA , Hiroshi Yagi , Koichi Suzuki , Yoshiaki Ogiwara , Junji Ninomiya , Kazunori Ishikawa
发明人： Takeshi KIHARA , Hiroshi Yagi , Koichi Suzuki , Yoshiaki Ogiwara , Junji Ninomiya , Kazunori Ishikawa
IPC分类号： B32B38/00 , B32B37/02 , C25D5/34
CPC分类号： B01J19/0093 , B01J23/80 , B01J37/0226 , B01J2219/00783 , B01J2219/00822 , B01J2219/00835 , B01J2219/0086 , B01J2219/00873 , C01B3/323 , C01B2203/0227 , C01B2203/1076 , C25D11/02 , C25D13/02 , C25D13/12 , Y02P20/52 , Y10T29/49345 , Y10T156/10
摘要： A structure of a microreactor includes a joined body having a pair of substrates joined together, a flow path formed by a microchannel portion formed on a joining surface of at least one of the substrates, and a catalyst carrying member disposed in the flow path. In the production of such a microreactor, the catalyst carrying member is produced separately from formation of the joined body and the catalyst carrying member is disposed in the flow path at the time of forming the joined body.
摘要翻译：微反应器的结构包括具有连接在一起的一对基板的接合体，由形成在至少一个基板的接合表面上的微通道部分形成的流路和设置在流路中的催化剂承载部件。在这种微反应器的生产中，催化剂承载构件与接合体的形成分开制造，催化剂承载构件在形成接合体时设置在流路中。

4. 发明申请

US20060166030A1 Heat exchanger and fin material for the heat exchanger 有权
公开(公告)号：US20060166030A1
公开(公告)日：2006-07-27
申请号：US11336272
申请日：2006-01-20
申请人： Yoshikazu Suzuki , Nobuyuki Kakimoto , Junji Ninomiya , Yoshiyuki Oya
发明人： Yoshikazu Suzuki , Nobuyuki Kakimoto , Junji Ninomiya , Yoshiyuki Oya
IPC分类号： B32B15/20
CPC分类号： F28F21/084 , Y10S165/905 , Y10T428/12764
摘要： A heat exchanger which has i) a fin material comprising a triple-layer clad material constituted of a core material composed of an aluminum alloy containing from 0.5 to 1.8% by weight of Mn and from 0.5 to 3.0% by weight of Zn and, provided on both sides of the core material, a brazing filler material composed of an Al—Si alloy containing from 6.5 to 13.0% by weight of Si and from 0.15 to 0.60% by weight of Cu and ii) an aluminum alloy tube having a Zn concentrated surface; the both having been brazed with each other; wherein, after brazing, recrystallized grains of the core material have an average length of from 100 to 1,000 μm in the lengthwise section of a fin and the recrystallized grains of the core material are 4 or less in average number in the thickness direction of that lengthwise section. This heat exchanger is improved in the durability of fin joints and fins themselves and their strength after corrosion.

5. 发明授权

US5981085A Composite substrate for heat-generating semiconductor device and semiconductor apparatus using the same 失效
标题翻译：用于发热半导体器件的复合衬底和使用其的半导体器件
公开(公告)号：US5981085A
公开(公告)日：1999-11-09
申请号：US814111
申请日：1997-03-10
申请人： Junji Ninomiya , Akira Hideno , Takahiro Okada
发明人： Junji Ninomiya , Akira Hideno , Takahiro Okada
IPC分类号： H01L21/48 , H01L23/373 , H05K1/05 , H05K3/00 , B32B15/20 , H01L23/14
CPC分类号： H01L23/3733 , H01L21/4871 , H01L23/3736 , H01L2924/0002 , H05K1/05 , H05K3/0058 , Y10T428/12486 , Y10T428/12528
摘要： A composite substrate on which a heat-generating semiconductor device is to be mounted, comprising a composite layer which includes a matrix made of a metal having a high thermal conductivity and a fibrous or particulate dispersion material having low thermal expansion properties present in the matrix, and a metal layer provided onto one main surface of the composite layer, wherein either one of a heat-generating semiconductor device or a substrate with low thermal expansion properties having a heat-generating semiconductor device provided thereon, is mounted on the other main surface of the composite layer.
摘要翻译：其上安装有发热半导体装置的复合基板包括复合层，该复合层包括由具有高导热性的金属制成的基体和在基质中存在的具有低热膨胀性质的纤维或颗粒分散材料，以及设置在复合层的一个主表面上的金属层，其中在其上设置有发热半导体器件的发热半导体器件或具有低热膨胀特性的基板中的任一个安装在另一个主表面上复合层。

6. 发明授权

US07485374B2 Heat exchanger and fin material for the heat exchanger 有权
标题翻译：用于热交换器的热交换器和翅片材料
公开(公告)号：US07485374B2
公开(公告)日：2009-02-03
申请号：US11336272
申请日：2006-01-20
申请人： Yoshikazu Suzuki , Nobuyuki Kakimoto , Junji Ninomiya , Yoshiyuki Oya
发明人： Yoshikazu Suzuki , Nobuyuki Kakimoto , Junji Ninomiya , Yoshiyuki Oya
IPC分类号： B32B15/20
CPC分类号： F28F21/084 , Y10S165/905 , Y10T428/12764
摘要： A heat exchanger which has i) a fin material comprising a triple-layer clad material constituted of a core material composed of an aluminum alloy containing from 0.5 to 1.8% by weight of Mn and from 0.5 to 3.0% by weight of Zn and, provided on both sides of the core material, a brazing filler material composed of an Al—Si alloy containing from 6.5 to 13.0% by weight of Si and from 0.15 to 0.60% by weight of Cu and ii) an aluminum alloy tube having a Zn concentrated surface; the both having been brazed with each other; wherein, after brazing, recrystallized grains of the core material have an average length of from 100 to 1,000 μm in the lengthwise section of a fin and the recrystallized grains of the core material are 4 or less in average number in the thickness direction of that lengthwise section. This heat exchanger is improved in the durability of fin joints and fins themselves and their strength after corrosion.
摘要翻译：一种热交换器，其具有包括由包含0.5〜1.8重量％的Mn和0.5〜3.0重量％的Zn的铝合金构成的芯材构成的三层包覆材料的翅片材料，在芯材的两侧，由含有6.5〜13.0重量％的Si和0.15〜0.60重量％的Cu的Al-Si合金构成的钎料，以及ii）具有Zn浓缩的铝合金管表面; 两者相互钎焊; 其中，在钎焊后，芯材的再结晶晶粒在翅片的长度方向上的平均长度为100〜1000μm，芯材的再结晶晶粒的长度方向的平均数为4个以下部分。该热交换器改善了翅片接头和翅片本身的耐久性及其腐蚀后的强度。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式