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1. 发明授权

US4901325A Semiconductor laser device 失效
标题翻译：半导体激光器件
公开(公告)号：US4901325A
公开(公告)日：1990-02-13
申请号：US173658
申请日：1988-03-25
申请人： Takeshi Kato , Kenichi Mizuishi , Katuaki Chiba , Takeshi Nakao , Masahiro Ojima , Shigeru Nakamura , Takeshi Maeda
发明人： Takeshi Kato , Kenichi Mizuishi , Katuaki Chiba , Takeshi Nakao , Masahiro Ojima , Shigeru Nakamura , Takeshi Maeda
IPC分类号： G11B7/125 , H01S5/022 , H01S5/024 , H01S5/40
CPC分类号： H01S5/02212 , G11B7/127 , H01S5/024 , H01S5/4025 , H01S5/02288
摘要： A semiconductor laser device utilizing at least a pair of semiconductor laser chips; and a fixing device for fixing the semiconductor laser chips so that electrode surfaces are approximately parallel and opposite to each other and the interval between light emitting spots of the semiconductor laser chips is small.
摘要翻译：一种利用至少一对半导体激光芯片的半导体激光器件; 以及用于固定半导体激光器芯片使得电极表面彼此大致平行且相反并且半导体激光器芯片的发光点之间的间隔小的定影装置。

2. 发明授权

US4812002A Optical coupling device and method of making the same 失效
标题翻译：光耦合装置及其制造方法
公开(公告)号：US4812002A
公开(公告)日：1989-03-14
申请号：US111590
申请日：1987-10-23
申请人： Takeshi Kato , Kenichi Mizuishi , Katuaki Chiba
发明人： Takeshi Kato , Kenichi Mizuishi , Katuaki Chiba
IPC分类号： G02B6/30 , G02B6/36 , G02B6/42
CPC分类号： G02B6/4249 , G02B6/30 , G02B6/4202 , G02B6/423 , G02B6/4248 , G02B6/3644 , G02B6/3672 , G02B6/3692 , G02B6/4203 , G02B6/4238
摘要： Disclosed are an optical coupling device including an optical device, an optical fiber, and a guide, and a method for their production. The guide has a through-hole whose diameter is smaller than the outer diameter of the optical fiber. The through-hole is optical-axis aligned with the optical device. An end of the optical fiber is processed in such a manner that its diameter is decreased, and is fitted into the through-hole so as to optically couple the optical fiber to the optical device.
摘要翻译：公开了包括光学装置，光纤和引导件的光耦合装置及其制造方法。引导件具有直径小于光纤外径的通孔。通孔与光学装置光轴对准。光纤的端部以直径减小的方式进行加工，并且嵌入到通孔中以将光纤光耦合到光学装置。

3. 发明授权

US4819857A Method for fabricating composite structure 失效
标题翻译：复合结构制作方法
公开(公告)号：US4819857A
公开(公告)日：1989-04-11
申请号：US109449
申请日：1987-10-19
申请人： Kenichi Mizuishi , Masahide Tokuda , Katuaki Chiba
发明人： Kenichi Mizuishi , Masahide Tokuda , Katuaki Chiba
IPC分类号： B23K35/14 , H01L21/60 , H01L23/433
CPC分类号： H01L24/83 , H01L23/4332 , H01L24/29 , H01L24/32 , H01L2224/13111 , H01L2224/29011 , H01L2224/29101 , H01L2224/29111 , H01L2224/29116 , H01L2224/73253 , H01L2224/73257 , H01L2224/83101 , H01L2224/83194 , H01L2224/83801 , H01L2224/83805 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/157 , H01L2924/15787
摘要： A method for fabricating a composite structure, in which an intermediate member is sandwiched between first and second members, is disclosed. In this method, the intermediate member is disposed along the periphery of a spatial region formed between facing surfaces of the first and second members so that the spatial region is enclosed by the intermediate member, the fluidity of the intermediate member is enhanced under an atmosphere having a predetermined pressure, and then the pressure of the atmosphere is increased to make the intermediate member flow into the spatial region.
摘要翻译：公开了一种制造复合结构的方法，其中中间构件夹在第一和第二构件之间。在该方法中，中间构件沿着形成在第一和第二构件的相对表面之间的空间区域的周边设置，使得空间区域被中间构件包围，中间构件的流动性在具有预定压力，然后增加气氛的压力，使中间部件流入空间区域。

4. 发明授权

US5394490A Semiconductor device having an optical waveguide interposed in the space between electrode members 失效
标题翻译：具有插入在电极构件之间的空间的光波导的半导体装置
公开(公告)号：US5394490A
公开(公告)日：1995-02-28
申请号：US104582
申请日：1993-08-11
申请人： Takeshi Kato , Yuuji Fujita , Kenichi Mizuishi , Atumi Kawata , Hiroyuki Itoh
发明人： Takeshi Kato , Yuuji Fujita , Kenichi Mizuishi , Atumi Kawata , Hiroyuki Itoh
IPC分类号： G02B6/12 , G02B6/13 , G02B6/30 , G02B6/42 , G02B6/43 , G06F1/10 , H05K1/00
CPC分类号： G02B6/43 , G02B6/13 , G02B6/30 , G02B6/42 , G06F1/105 , G02B2006/12104 , G02B6/4232 , H01L2224/16237 , H01L2224/73253 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/15312 , H01L2924/16195 , H01L2924/3011 , H01L2924/3025
摘要： A clock signal supply system is disclosed for a semiconductor device with a semiconductor chip and a wiring substrate connected in flip-chip fashion and an optical waveguide interposed in the space between electrode members, in which the mutual arrangement of the electrical interconnection and the optical waveguide interconnection on the wiring substrate is not affected and can be used separately from each other for different applications, thereby improving the throughput of the interconnections as a whole. In order to distribute a very fast clock signal beyond a 1 GHz in particular without any phase deviation in the clock signal supply system, a clock distributor includes a clock oscillator, a phase adjuster for adjusting the phase at each destination of the clock signal, an optical interconnection for supplying the clock signal to the phase adjuster, a reference signal generator for generating a phase reference signal from the clock signal, and an electrical interconnection for supplying the reference signal to the phase adjuster. The clock signal is supplied by an optical interconnection having a broad frequency bandwidth, and the phase reference signal by an electrical interconnection by which the skew is controlled easily. A clock signal adjusted to high phase accuracy can thus be distributed to following destinations by the phase adjuster.
摘要翻译：公开了一种半导体器件的时钟信号供给系统，半导体器件具有以倒装芯片方式连接的半导体芯片和布线基板，以及插入在电极部件之间的空间中的光波导，其中电互连和光波导布线基板上的互连不受影响，并且可以彼此分开地用于不同的应用，从而提高互连的整体的吞吐量。为了在非常快的时钟信号中分配非常快的时钟信号，特别是在时钟信号供给系统中没有任何相位偏差，时钟分配器包括时钟振荡器，用于调整时钟信号的每个目的地的相位的相位调节器，用于向相位调节器提供时钟信号的光互连，用于从时钟信号产生相位参考信号的参考信号发生器和用于将参考信号提供给相位调节器的电互连。时钟信号由具有宽频带宽的光互连提供，并且相位参考信号由通过电互连的相位参考信号提供，通过该互连可以容易地控制偏斜。因此，调整到高相位精度的时钟信号可以由相位调节器分配到后续目的地。

5. 发明授权

US5424573A Semiconductor package having optical interconnection access 失效
标题翻译：具有光互连接入的半导体封装
公开(公告)号：US5424573A
公开(公告)日：1995-06-13
申请号：US26037
申请日：1993-03-04
申请人： Takeshi Kato , Katsuya Tanaka , Kenichi Mizuishi
发明人： Takeshi Kato , Katsuya Tanaka , Kenichi Mizuishi
IPC分类号： H01L31/0232 , G02B6/38 , G02B6/42 , H01L25/16 , H01L31/0203 , H01L33/58 , H01L33/62 , H01L29/161 , H01L29/205 , H01L29/225 , H01L33/00
CPC分类号： H01L25/167 , G02B6/4249 , H01L31/0203 , G02B6/3885 , G02B6/4232 , H01L2224/16 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01014 , H01L2924/10253 , H01L2924/1301 , H01L2924/15312 , H01L2924/16195 , H01L2924/3025
摘要： A semiconductor package includes a semiconductor chip, an interconnection substrate having the semiconductor chip mounted on one surface of the interconnection substrate, and a package base having the interconnection substrate mounted on one surface of the package base. An optical transmission medium is provided on the package base at a location corresponding to an optical device provided on the interconnection substrate. On the other surface of the package base is provided a receptacle for making an optical connection between an optical fiber cable and the optical transmission medium. Signals are input and/or output via the optical fiber cable connected to the receptacle.
摘要翻译：半导体封装包括半导体芯片，具有安装在互连基板的一个表面上的半导体芯片的互连基板，以及安装在封装基板的一个表面上的具有互连基板的封装基板。光传输介质在对应于设置在互连基板上的光学装置的位置处设置在封装基座上。在封装基座的另一个表面设置有用于在光纤电缆和光传输介质之间进行光连接的插座。通过连接到插座的光纤电缆输入和/或输出信号。

6. 发明授权

US07603194B2 Fabrication system and fabrication method 失效
标题翻译：制造系统及制造方法
公开(公告)号：US07603194B2
公开(公告)日：2009-10-13
申请号：US12153926
申请日：2008-05-28
申请人： Natsuki Yokoyama , Yoshifumi Kawamoto , Eiichi Murakami , Fumihiko Uchida , Kenichi Mizuishi , Yoshio Kawamura
发明人： Natsuki Yokoyama , Yoshifumi Kawamoto , Eiichi Murakami , Fumihiko Uchida , Kenichi Mizuishi , Yoshio Kawamura
IPC分类号： G06F19/00
CPC分类号： C23C14/568 , C23C16/54 , G05B19/41865 , G05B2219/45031 , H01L21/67161 , H01L21/67167 , H01L21/67173 , H01L21/67184 , H01L21/67276 , H01L21/67727 , H01L21/67745 , Y02P90/14 , Y02P90/20 , Y02P90/28 , Y10S414/135 , Y10S414/137 , Y10S438/908 , Y10T29/41
摘要： A fabricating method for a system that includes a plurality of processing apparatuses connected to each other by an inter-apparatus transporter and a computer storing managing information of processing and transporting of semiconductor wafers. The processing apparatuses have an interface for loading and unloading a plurality of the semiconductor wafers that are contained in a carrier. The semiconductor waters are processed in processing chambers of the processing apparatuses and the result of processing is monitored. In the processing, a first carrier containing the plurality of the semiconductor wafers having been processed in the first processing apparatus is transported toward the second processing apparatus by the inter-apparatus transporter prior to unloading of a second carrier containing semiconductor wafers processed in the second processing apparatus, according to the managing information.
摘要翻译：一种系统的制造方法，其包括通过机器间运输机彼此连接的多个处理装置和存储管理半导体晶片的处理和传输信息的计算机。处理装置具有用于装载和卸载容纳在载体中的多个半导体晶片的界面。在处理装置的处理室中处理半导体水，并监视处理结果。在处理中，在卸载包含在第二处理中处理的半导体晶片的第二载体之前，将包含在第一处理装置中处理的多个半导体晶片的第一载体通过装置间传送器传送到第二处理装置装置，根据管理信息。

7. 发明授权

US5858863A Fabrication system and method having inter-apparatus transporter 失效
标题翻译：具有装置间输送器的制造系统和方法
公开(公告)号：US5858863A
公开(公告)日：1999-01-12
申请号：US722944
申请日：1996-09-27
申请人： Natsuki Yokoyama , Yoshifumi Kawamoto , Eiichi Murakami , Fumihiko Uchida , Kenichi Mizuishi , Yoshio Kawamura
发明人： Natsuki Yokoyama , Yoshifumi Kawamoto , Eiichi Murakami , Fumihiko Uchida , Kenichi Mizuishi , Yoshio Kawamura
IPC分类号： B65G49/07 , B23Q41/00 , B23Q41/02 , C23C14/56 , C23C16/54 , G05B19/418 , H01L21/00 , H01L21/02 , H01L21/027 , H01L21/205 , H01L21/285 , H01L21/304 , H01L21/3065 , H01L21/3205 , H01L21/677 , H01L21/68
CPC分类号： C23C14/568 , C23C16/54 , G05B19/41865 , H01L21/67161 , H01L21/67167 , H01L21/67173 , H01L21/67184 , H01L21/67276 , H01L21/67727 , H01L21/67745 , G05B2219/45031 , Y02P90/14 , Y02P90/20 , Y02P90/28 , Y10S414/135 , Y10S414/137 , Y10S438/908 , Y10T29/41
摘要： Disclosed is a fabricating system including a plurality of processing apparatuses connected to each other by means of an inter-apparatus transporter, wherein one group of semiconductor wafers are processed in processing apparatuses and other group of wafers are transported to specified processing apparatuses for a time interval from (To+T) to a time To; and another group of wafers are processed and the remaining group of wafers are transported for a time interval from (To+T) to (To+2T). Since processing apparatuses can receive at least one of works from the inter-apparatus transporter for a time interval T min, the distribution of works from the transporter to processing apparatuses is completed for the time interval T min. The transporter is emptied for each time interval T min, and works are unloaded to the emptied transporter, which makes easy the scheduling, control and management of the transporting of a plurality of works in the fabricating system. Moreover, since the fabricating system including processing apparatuses is periodically controlled at a cycle time T min, the scheduling of a plurality of works can be made easy, to enhance the level of optimization, thus improving the productivity.
摘要翻译：公开了一种制造系统，其包括通过机构间传送器彼此连接的多个处理装置，其中一组半导体晶片在处理装置中被处理，并且其他组的晶片被传送到指定的处理装置一段时间间隔从（To + T）到一个时间To; 并且处理另一组晶片，并且剩余的晶片组从（To + T）到（To + 2T）的时间间隔被传输。由于处理装置可以从时间间隔T min接收来自装置间运送装置的作品中的至少一个，因此在时间间隔T min内完成从运送装置到处理装置的作品的分配。在每个时间间隔T min内运输运输车被清空，并且卸载到排空运输车，这使得在制造系统中运输多个作业的调度，控制和管理变得容易。此外，由于包括处理装置的制造系统在周期时间T min周期性地进行控制，因此能够容易地进行多个作业的调度，提高优化等级，提高生产率。

8. 发明授权

US4974769A Method of joining composite structures 失效
标题翻译：连接复合结构的方法
公开(公告)号：US4974769A
公开(公告)日：1990-12-04
申请号：US343781
申请日：1989-04-27
申请人： Kenichi Mizuishi
发明人： Kenichi Mizuishi
IPC分类号： B23K1/14 , B23K1/008 , H01L23/02
CPC分类号： B23K1/008 , H01L2224/16225 , H01L2924/16251
摘要： An method and apparatus for integrally joining at least two composite structures using a bonding material which will melt under heating, with a method comprising the steps of heat-melting the bonding material interposed between the composite structures disposed opposite to each other, changing at least once the pressure of the atmospheric gas surrounding the bonding material in a fused state in a reciprocative manner between an initial pressure and pressure different therefrom, and solidifying the fused bonding material.
摘要翻译：一种用于使用将在加热下熔化的接合材料一体地接合至少两个复合结构的方法和装置，其方法包括以下步骤：将插入在彼此相对布置的复合结构之间的接合材料进行加热熔融，至少改变一次将处于熔融状态的接合材料周围的大气气体以不同于其的初始压力和压力之间的往复运动的方式施加压力，并使熔融粘合材料固化。

9. 发明申请

US20100008544A1 BIOMETRIC AUTHENTICATION DEVICE AND BIOMETRIC AUTHENTICATION METHOD 失效
标题翻译：生物识别装置和生物识别方法
公开(公告)号：US20100008544A1
公开(公告)日：2010-01-14
申请号：US12417025
申请日：2009-04-02
申请人： Tadayuki ABE , Masayuki Abe , Hiromi Sugo , Kenichi Mizuishi
发明人： Tadayuki ABE , Masayuki Abe , Hiromi Sugo , Kenichi Mizuishi
IPC分类号： G06K9/00
CPC分类号： G06F21/32
摘要： A biometric authentication device includes an accommodation unit and a detection unit in which the accommodation unit accommodates a card-type recording medium providing alternative information alternative to feature information such that the card-type recording medium is faced to the detection unit, with a biologic object absent, and the detection unit detects the alternative information from the card-type recording medium, thereby collating the feature information extracted from an image of the biologic object with the feature information recorded in a memory in the case of placing the finger into the accommodation unit, and collating the alternative information from the card-type recording medium with the alternative information recorded in the memory in the case of placing the card-type recording medium into the accommodation unit.
摘要翻译：一种生物体认证装置，包括一个容纳单元和一个检测单元，其中容纳单元容纳卡式记录介质，提供与特征信息相替的替代信息，使得卡式记录介质面向检测单元，具有生物物体并且检测单元从卡型记录介质检测替代信息，从而在将手指放置到收纳单元的情况下将从生物体的图像提取的特征信息与记录在存储器中的特征信息进行比较并且在将卡式记录介质放入到容纳单元的情况下，将来自卡型记录介质的替代信息与记录在存储器中的备选信息进行核对。

10. 发明授权

US07062344B2 Fabrication system and fabrication method 失效
公开(公告)号：US07062344B2
公开(公告)日：2006-06-13
申请号：US10713012
申请日：2003-11-17
申请人： Natsuki Yokoyama , Yoshifumi Kawamoto , Eiichi Murakami , Fumihiko Uchida , Kenichi Mizuishi , Yoshio Kawamura
发明人： Natsuki Yokoyama , Yoshifumi Kawamoto , Eiichi Murakami , Fumihiko Uchida , Kenichi Mizuishi , Yoshio Kawamura
IPC分类号： G06F19/00
CPC分类号： C23C14/568 , C23C16/54 , G05B19/41865 , G05B2219/45031 , H01L21/67161 , H01L21/67167 , H01L21/67173 , H01L21/67184 , H01L21/67276 , H01L21/67727 , H01L21/67745 , Y02P90/14 , Y02P90/20 , Y02P90/28 , Y10S414/135 , Y10S414/137 , Y10S438/908 , Y10T29/41
摘要： Disclosed is a fabricating system including a plurality of processing apparatuses connected to each other by means of an inter-apparatus transporter, wherein one group of semiconductor wafers are processed in processing apparatuses and other group of wafers are transported to specified processing apparatuses for a time interval from (To+T) to a time To; and another group of wafers are processed and the remaining group of wafers are transported for a time interval from (To+T) to (To+2T). Since processing apparatuses can receive at least one of works from the inter-apparatus transporter for a time interval T min, the distribution of works from the transporter to processing apparatuses is completed for the time interval T min. The transporter is emptied for each time interval T min, and works are unloaded to the emptied transporter, which makes easy the scheduling, control and management of the transporting of a plurality of works in the fabricating system. Moreover, since the fabricating system including processing apparatuses is periodically controlled at a cycle time T min, the scheduling of a plurality of works can be made easy, to enhance the level of optimization, thus improving the productivity.

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