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    • 4. 发明申请
    • NITRIDE SEMICONDUCTOR LASER DEVICE AND METHOD FOR FABRICATION THEREOF
    • 氮化物半导体激光器件及其制造方法
    • US20080080578A1
    • 2008-04-03
    • US11877551
    • 2007-10-23
    • Takeshi KamikawaYoshika Kaneko
    • Takeshi KamikawaYoshika Kaneko
    • H01S5/22
    • H01S5/3202H01L33/20H01L33/32H01S5/0207H01S5/32341H01S2304/12
    • A nitride semiconductor light-emitting device includes a nitride semiconductor substrate of which at least part of a surface is formed from a nitride semiconductor and a nitride film semiconductor growth layer laid on the surface of the nitride semiconductor substrate. A carved region in the shape of a depressed portion may be formed on the surface of the nitride semiconductor substrate. The carved region may have an inverted tapered shape or a tapered shape in cross-section. Alternatively, or additionally, the nitride film semiconductor growth layer may include a gallium nitride film or an aluminum containing gallium nitride film where the nitride film semiconductor growth layer makes contact with the nitride semiconductor substrate. Alternatively, or additionally, the nitride film semiconductor growth layer may include a light-emitting portion formed at a location 20 μm or more away from the carved region.
    • 氮化物半导体发光器件包括氮化物半导体衬底,其氮化物半导体和氮化物半导体生长层的至少一部分表面由氮化物半导体形成,氮化物半导体生长层位于氮化物半导体衬底的表面上。 可以在氮化物半导体衬底的表面上形成凹陷部形状的雕刻区域。 雕刻区域的截面可以具有倒锥形或锥形形状。 或者或另外,氮化物膜半导体生长层可以包括氮化镓膜或含氮化镓膜,其中氮化物膜半导体生长层与氮化物半导体衬底接触。 或者或另外,氮化物膜半导体生长层可以包括形成在距离雕刻区域20m或更远的位置处的发光部分。
    • 8. 发明授权
    • Nitride semiconductor laser device and method for fabrication thereof
    • 氮化物半导体激光器件及其制造方法
    • US07529283B2
    • 2009-05-05
    • US11877551
    • 2007-10-23
    • Takeshi KamikawaYoshika Kaneko
    • Takeshi KamikawaYoshika Kaneko
    • H01S5/00H01L33/00
    • H01S5/3202H01L33/20H01L33/32H01S5/0207H01S5/32341H01S2304/12
    • A nitride semiconductor light-emitting device includes a nitride semiconductor substrate of which at least part of a surface is formed from a nitride semiconductor and a nitride film semiconductor growth layer laid on the surface of the nitride semiconductor substrate. A carved region in the shape of a depressed portion may be formed on the surface of the nitride semiconductor substrate. The carved region may have an inverted tapered shape or a tapered shape in cross-section. Alternatively, or additionally, the nitride film semiconductor growth layer may include a gallium nitride film or an aluminum containing gallium nitride film where the nitride film semiconductor growth layer makes contact with the nitride semiconductor substrate. Alternatively, or additionally, the nitride film semiconductor growth layer may include a light-emitting portion formed at a location 20 μm or more away from the carved region.
    • 氮化物半导体发光器件包括氮化物半导体衬底,其氮化物半导体和氮化物半导体生长层的至少一部分表面由氮化物半导体形成,氮化物半导体生长层位于氮化物半导体衬底的表面上。 可以在氮化物半导体衬底的表面上形成凹陷部形状的雕刻区域。 雕刻区域的截面可以具有倒锥形或锥形形状。 或者或另外,氮化物膜半导体生长层可以包括氮化镓膜或含氮化镓膜,其中氮化物膜半导体生长层与氮化物半导体衬底接触。 或者或另外,氮化物膜半导体生长层可以包括形成在距离雕刻区域20m或更远的位置处的发光部分。
    • 10. 发明申请
    • Nitride semiconductor laser device and method for fabrication thereof
    • 氮化物半导体激光器件及其制造方法
    • US20050151153A1
    • 2005-07-14
    • US11022892
    • 2004-12-28
    • Takeshi KamikawaYoshika Kaneko
    • Takeshi KamikawaYoshika Kaneko
    • H01S5/343H01L29/22H01S5/02H01S5/323
    • H01S5/3202H01L33/20H01L33/32H01S5/0207H01S5/32341H01S2304/12
    • In a nitride semiconductor light-emitting device, and according to a method for fabricating it, a low-defect region having a defect density of 106 cm−2 or less and a carved region in the shape of a depressed portion are formed on the surface of a nitride semiconductor substrate, and the etching angle θ, which is the angle between the side surface portion of the depressed portion and an extension line of the bottom surface portion thereof as measured with the depressed portion seen in a sectional view, is in a range of 75°≦θ≦140°. This prevents the development of cracks, and reduces the creep-up growth from the bottom growth portion of the carved region, thereby reducing the film thickness of the side growth portion. This makes it possible to produce, with a high yield, a nitride semiconductor laser device having a nitride semiconductor growth layer with good surface flatness.
    • 在氮化物半导体发光装置中,根据其制造方法,具有缺陷密度为10〜0.2cm -2以下的低缺陷区域,以及 在氮化物半导体衬底的表面上形成凹陷形状的雕刻区域,并且作为凹部的侧面部分与其底面部分的延伸线之间的角度的蚀刻角度θ 如在剖视图中看到的凹陷部分所测量的,在75°<θ= 140°的范围内。 这防止了裂纹的发展,并且减小了从雕刻区域的底部生长部分的蠕变生长,从而降低侧面生长部分的膜厚度。 这使得可以以高产率生产具有良好表面平坦度的氮化物半导体生长层的氮化物半导体激光器件。