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    • 2. 发明授权
      US06842663B2 Production managing system of semiconductor device 失效
    • Production managing system of semiconductor device
    • 半导体器件生产管理系统
    • US06842663B2
    • 2005-01-11
    • US10790276
    • 2004-03-01
    • Keizo Yamada , Yousuke Itagaki , Takeo Ushiki , Tohru Tsujide
    • Keizo Yamada , Yousuke Itagaki , Takeo Ushiki , Tohru Tsujide
    • H01L21/02 , H01L21/00 , G06F19/99
    • H01L21/67276
    • A production managing system for semiconductor devices includes, in a semiconductor producing center C, production devices 11a-11c for producing semiconductor devices, in-line measuring devices 12a-12c for measuring data of a lot, a database 2 storing data of production methods, the measured data, the specifications of the process steps corresponding to the measured data, the estimated yield, the data of lot input date and hour, the data of the scheduled date on which the process step is performed, the data of actual date of completion in every step and the data of the scheduled date of completion of the semiconductor devices of every lot, correspondingly to a lot number data of the semiconductor devices (chips) and a server 1 including an estimated yield operating unit 1a for calculating the estimated yield, which is a final yield, on the basis of the specifications and the measured data, and a production managing unit 1b for performing a production management of semiconductor devices ordered by a user on the basis of the respective data inputted by the user and the estimated yield, wherein a user terminal of the user not only performs a determination whether or not the process processing in every process is normal but also estimates the final number of normal products ordered by the user and obtainable finally.
    • 半导体装置的生产管理系统包括半导体制造中心C，用于制造半导体器件的生产装置11a-11c，用于测量批次数据的在线测量装置12a-12c，存储生产方法数据的数据库2， 测量数据，对应于测量数据的过程步骤的规格，估计产量，批次输入日期和时间的数据，执行处理步骤的预定日期的数据，实际完成日期的数据 在每个步骤和每个批次的半导体器件的预定完成日期的数据中，对应于半导体器件（芯片）的批号数据和包括用于计算估计产量的估计产量操作单元1a的服务器1， 根据规格和测量数据是最终产量，以及用于执行半导体器件的生产管理的生产管理单元1b 由用户根据用户输入的相应数据和估计的收益进行排序，其中用户的用户终端不仅执行每个处理中的处理处理是否正常的确定，还估计 正品由用户订购，最终可以获得。
    • 基本信息 添加关注 加入工作空间 PDF全文 PDF下载 全文下载 相似专利 双屏查看 权利要求书 说明书全文 Espacenet 法律信息 同族专利 专利引用
    • 4. 发明申请
      US20050106803A1 Production managing system of semiconductor device 失效
    • Production managing system of semiconductor device
    • 半导体器件生产管理系统
    • US20050106803A1
    • 2005-05-19
    • US11005330
    • 2004-12-06
    • Keizo Yamada , Yousuke Itagaki , Takeo Ushiki , Tohru Tsujide
    • Keizo Yamada , Yousuke Itagaki , Takeo Ushiki , Tohru Tsujide
    • H01L21/02 , H01L21/00 , H01L21/20
    • H01L21/67276
    • A production managing system for semiconductor devices includes, in a semiconductor producing center C, production devices 11a-11c for producing semiconductor devices, in-line measuring devices 12a-12c for measuring data of a lot, a database 2 storing data of production methods, the measured data, the specifications of the process steps corresponding to the measured data, the estimated yield, the data of lot input date and hour, the data of the scheduled date on which the process step is performed, the data of actual date of completion in every step and the data of the scheduled date of completion of the semiconductor devices of every lot, correspondingly to a lot number data of the semiconductor devices (chips) and a server 1 including an estimated yield operating unit 1a for calculating the estimated yield, which is a final yield, on the basis of the specifications and the measured data, and a production managing unit 1b for performing a production management of semiconductor devices ordered by a user on the basis of the respective data inputted by the user and the estimated yield, wherein a user terminal of the user not only performs a determination whether or not the process processing in every process is normal but also estimates the final number of normal products ordered by the user and obtainable finally.
    • 半导体装置的生产管理系统包括半导体制造中心C，用于制造半导体器件的生产装置11a-11c，用于测量批次数据的在线测量装置12a-12c，存储生产方法数据的数据库2， 测量数据，对应于测量数据的过程步骤的规格，估计产量，批次输入日期和时间的数据，执行处理步骤的预定日期的数据，实际完成日期的数据 相应于半导体器件（芯片）的批号数据和包括用于计算估计产量的估计收益率操作单元1a的服务器1的每个步骤以及每个批次的半导体器件的预定完成日期的数据 ，其根据规格和测量数据是最终产量，以及用于执行半导体器件的生产管理的生产管理单元1b 由用户根据用户输入的各个数据和估计的收益进行排序，其中用户的用户终端不仅执行每个处理中的处理处理是否正常的判断，还估计最终数 的用户订购的正常产品，最终可以获得。
    • 基本信息 添加关注 加入工作空间 PDF全文 PDF下载 全文下载 相似专利 双屏查看 权利要求书 说明书全文 Global Dossier Espacenet 法律信息 同族专利 专利引用
    • 6. 发明授权
      US07321805B2 Production managing system of semiconductor device 失效
    • Production managing system of semiconductor device
    • 半导体器件生产管理系统
    • US07321805B2
    • 2008-01-22
    • US11005330
    • 2004-12-06
    • Keizo Yamada , Yousuke Itagaki , Takeo Ushiki , Tohru Tsujide
    • Keizo Yamada , Yousuke Itagaki , Takeo Ushiki , Tohru Tsujide
    • G06F19/00
    • H01L21/67276
    • A production managing system for semiconductor devices includes, in a semiconductor producing center C, production devices 11a-11c for producing semiconductor devices, in-line measuring devices 12a-12c for measuring data of a lot, a database 2 storing data of production methods, the measured data, the specifications of the process steps corresponding to the measured data, the estimated yield, the data of lot input date and hour, the data of the scheduled date on which the process step is performed, the data of actual date of completion in every step and the data of the scheduled date of completion of the semiconductor devices of every lot, correspondingly to a lot number data of the semiconductor devices (chips) and a server 1 including an estimated yield operating unit 1a for calculating the estimated yield, which is a final yield, on the basis of the specifications and the measured data, and a production managing unit 1b for performing a production management of semiconductor devices ordered by a user on the basis of the respective data inputted by the user and the estimated yield, wherein a user terminal of the user not only performs a determination whether or not the process processing in every process is normal but also estimates the final number of normal products ordered by the user and obtainable finally.
    • 半导体装置的生产管理系统包括在半导体生产中心C中，用于生产半导体器件的生产装置11a-11c，用于测量批次的数据的在线测量装置12a-12c，存储数据的数据库2 的生产方法，测量数据，对应于测量数据的过程步骤的规格，估计产量，批次输入日期和时间的数据，执行处理步骤的预定日期的数据，数据 相应于半导体器件（芯片）的批号数据和包括估计产量操作单元1a的服务器1，每个步骤的实际完成日期和每个批次的半导体器件的预定完成日期的数据， 根据规格和测量数据计算作为最终产量的估计产量，以及用于进行半导体生产管理的生产管理单元1b 用户根据用户输入的各个数据排序的设备和估计的收益，其中，用户的用户终端不仅执行每个处理中的处理处理是否正常，而且还估计最终数 的用户订购的正常产品，最终可以获得。
    • 基本信息 添加关注 加入工作空间 PDF全文 PDF下载 全文下载 相似专利 双屏查看 权利要求书 说明书全文 Espacenet 法律信息 同族专利 专利引用
    • 9. 发明授权
      US06711453B2 Production managing system of semiconductor device 失效
    • Production managing system of semiconductor device
    • 半导体器件生产管理系统
    • US06711453B2
    • 2004-03-23
    • US10082247
    • 2002-02-26
    • Keizo Yamada , Yousuke Itagaki , Takeo Ushiki , Tohru Tsujide
    • Keizo Yamada , Yousuke Itagaki , Takeo Ushiki , Tohru Tsujide
    • G06F1900
    • H01L21/67276
    • A production managing system for semiconductor devices includes, in a semiconductor producing center C, production devices 11a-11c for producing semiconductor devices, in-line measuring devices 12a-12c for measuring data of a lot, a database 2 storing data of production methods, the measured data, the specifications of the process steps corresponding to the measured data, the estimated yield, the data of lot input date and hour, the data of the scheduled date on which the process step is performed, the data of actual date of completion in every step and the data of the scheduled date of completion of the semiconductor devices of every lot, correspondingly to a lot number data of the semiconductor devices (chips) and a server 1 including an estimated yield operating unit 1a for calculating the estimated yield, which is a final yield, on the basis of the specifications and the measured data, and a production managing unit 1b for performing a production management of semiconductor devices ordered by a user on the basis of the respective data inputted by the user and the estimated yield, wherein a user terminal of the user not only performs a determination whether or not the process processing in every process is normal but also estimates the final number of normal products ordered by the user and obtainable finally.
    • 半导体装置的生产管理系统包括半导体制造中心C，用于制造半导体器件的生产装置11a-11c，用于测量批次的数据的在线测量装置12a-12c，存储生产方法数据的数据库2， 测量数据，对应于测量数据的过程步骤的规格，估计产量，批次输入日期和时间的数据，执行处理步骤的预定日期的数据，实际完成日期的数据 在每个步骤和每个批次的半导体器件的预定完成日期的数据中，对应于半导体器件（芯片）的批号数据和包括用于计算估计产量的估计产量操作单元1a的服务器1， 根据规格和测量数据是最终产量，以及用于执行半导体器件的生产管理的生产管理单元1b 由用户根据用户输入的相应数据和估计的收益进行排序，其中用户的用户终端不仅执行每个处理中的处理处理是否正常的确定，还估计 正品由用户订购，最终可以获得。
    • 基本信息 添加关注 加入工作空间 PDF全文 PDF下载 全文下载 相似专利 双屏查看 权利要求书 说明书全文 Espacenet 法律信息 同族专利 专利引用
    • 10. 发明申请
      US20050116726A1 FILM THICKNESS MEASURING APPARATUS AND A METHOD FOR MEASURING A THICKNESS OF A FILM 失效
    • FILM THICKNESS MEASURING APPARATUS AND A METHOD FOR MEASURING A THICKNESS OF A FILM
    • 薄膜厚度测量装置和测量薄膜厚度的方法
    • US20050116726A1
    • 2005-06-02
    • US11005339
    • 2004-12-06
    • Keizo Yamada , Yousuke Itagaki , Takeo Ushiki
    • Keizo Yamada , Yousuke Itagaki , Takeo Ushiki
    • G01B15/02 , H01J1/62 , G01R27/08 , H01J63/04
    • G01B15/02 , H01J2237/2813
    • An apparatus for measuring the thickness of thin-film cause electron beams of first and second energies to strike thin-film to be measured that is formed on a silicon substrate, and measures the first substrate current value of current flowing in the substrate when it is struck by an electron beam of a first energy and the second substrate current value of current flowing in the substrate when it is struck by an electron beam of a second energy. The thin-film measuring apparatus obtains reference data indicating a relationship between the film thickness and a reference function having as variables the substrate current for the case of an electron beam of the first energy striking a standard sample and the substrate current for the case of an electron beam of the second energy striking the standard sample, and calculates the thickness of the thin-film under measurement based on the first and second substrate current values, giving consideration to the reference data.
    • 用于测量薄膜厚度的装置使得第一和第二能量的电子束撞击形成在硅衬底上的要测量的薄膜，并且测量在衬底中流动的电流的第一衬底电流值 被第一能量的电子束撞击并且当其被第二能量的电子束撞击时在衬底中流动的电流的第二衬底电流值。 薄膜测量装置获得指示薄膜厚度和参考功能之间的关系的参考数据，该基准函数具有作为第一能量的电子束冲击标准样品的情况下的衬底电流的变量和用于 电子束的第二能量冲击到标准样品，并且基于第一和第二衬底电流值计算测量的薄膜的厚度，考虑参考数据。
    • 基本信息 添加关注 加入工作空间 PDF全文 PDF下载 全文下载 相似专利 双屏查看 权利要求书 说明书全文 Global Dossier Espacenet 法律信息 同族专利 专利引用
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