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    • 1. 发明授权
    • SRAM-based semiconductor integrated circuit testing element
    • 基于SRAM的半导体集成电路测试元件
    • US06445002B1
    • 2002-09-03
    • US09621452
    • 2000-07-21
    • Takehiro HashimotoYutaka TanakaTetsuya AsamiYouichi SatouNoriaki Okumiya
    • Takehiro HashimotoYutaka TanakaTetsuya AsamiYouichi SatouNoriaki Okumiya
    • H01L2358
    • H01L22/20H01L2924/0002H01L2924/00
    • In a method for setting appropriate initial-failure screening conditions when mass-producing semiconductor devices of multiple types, devices of each type being manufactured in a small number, the step of subjecting products of every type to an acceleration test is excluded, and instead, the failure ratio on the market of semiconductor devices of each type is estimated using a testing semiconductor device. Specifically, {circle around (1)} first, all types of semiconductor devices to be developed and mass-produced are classified into several groups. {circle around (2)} A test semiconductor device is developed which has the same number of elements, the same gate area, the same multi-layer wiring length and the same number of contact holes as the average number of elements, the average gate area, the average wiring length and the average number of contact holes of the semiconductor devices included in one of the type groups, respectively. The testing semiconductor device has main features (design rules, MOSFET structure, wiring structure, etc.) common to the types included in its corresponding type group, and a failed portion thereof, if any, can be easily detected by an analysis using a tester.
    • 在批量生产多种类型的半导体器件的情况下设置适当的初始故障筛选条件的方法中,每种类型的器件被少量制造,不考虑每种类型的产品进行加速度测试的步骤, 使用测试半导体器件来估计每种类型的半导体器件市场的故障率。 具体来说,首先,围绕(1)圆)将要开发和批量生产的所有类型的半导体器件分为几组。 {circle around(2)}开发了一种测试半导体器件,其具有与元件的平均数目相同数量的元件,相同的栅极面积,相同的多层布线长度和相同数量的接触孔,平均栅极 面积,平均布线长度和包括在一个类型组中的半导体器件的接触孔的平均数量。 测试半导体器件具有与其对应类型组中包括的类型相同的主要特征(设计规则,MOSFET结构,布线结构等),并且其故障部分(如果有的话)可以通过使用测试仪的分析容易地检测 。
    • 2. 发明授权
    • Semiconductor integrated circuit device, method of estimating failure ratio of such devices on the market, and method of manufacturing the devices
    • 半导体集成电路器件,市场上这种器件的故障率的估计方法以及器件的制造方法
    • US06223097B1
    • 2001-04-24
    • US09265876
    • 1999-03-11
    • Takehiro HashimotoYutaka TanakaTetsuya AsamiYouichi SatouNoriaki Okumiya
    • Takehiro HashimotoYutaka TanakaTetsuya AsamiYouichi SatouNoriaki Okumiya
    • B07C1700
    • H01L22/20H01L2924/0002H01L2924/00
    • In a method for setting appropriate initial-failure screening conditions when mass-producing semiconductor devices of multiple types, devices of each type being manufactured in a small number, the step of subjecting products of every type to an acceleration test is excluded, and instead, the failure ratio on the market of semiconductor devices of each type is estimated using a testing semiconductor device. Specifically, {circle around (1)} first, all types of semiconductor devices to be developed and mass-produced are classified into several groups. {circle around (2)} A test semiconductor device is developed which has the same number of elements, the same gate area, the same multi-layer wiring length and the same number of contact holes as the average number of elements, the average gate area, the average wiring length and the average number of contact holes of the semiconductor devices included in one of the type groups, respectively. The testing semiconductor device has main features (design rules, MOSFET structure, wiring structure, etc.) common to the types included in its corresponding type group, and a failed portion thereof, if any, can be easily detected by an analysis using a tester.
    • 在批量生产多种类型的半导体器件的情况下设置适当的初始故障筛选条件的方法中,每种类型的器件被少量制造,不考虑每种类型的产品进行加速度测试的步骤, 使用测试半导体器件来估计每种类型的半导体器件市场的故障率。 具体来说,首先,围绕(1)圆)将要开发和批量生产的所有类型的半导体器件分为几组。 {circle around(2)}开发了一种测试半导体器件,其具有与元件的平均数目相同数量的元件,相同的栅极面积,相同的多层布线长度和相同数量的接触孔,平均栅极 面积,平均布线长度和包括在一个类型组中的半导体器件的接触孔的平均数量。 测试半导体器件具有与其对应类型组中包括的类型相同的主要特征(设计规则,MOSFET结构,布线结构等),并且其故障部分(如果有的话)可以通过使用测试仪的分析容易地检测 。