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    • 8. 发明授权
    • Method of reactive ion etching of a thin copper film
    • 薄铜膜的反应离子蚀刻方法
    • US5578166A
    • 1996-11-26
    • US449340
    • 1995-05-24
    • Takatoshi Hirota
    • Takatoshi Hirota
    • H01L21/302H01L21/3065H01L21/3205H01L21/3213H01L23/52H01L21/28
    • H01L21/32136
    • The method to etch an electrically conductive film comprises the steps of: forming a metal conductor film comprising copper or copper alloy, upon a substrate; and forming a mask pattern upon the metal conductor film; and etching an exposed part of the metal conductor film by the use of the mask pattern and a reactive ion-etching (RIE) employing a plasma of a gas mixture comprising a silicon tetra-chloride (SiCl.sub.4) gas, a nitrogen (N.sub.2) gas and a carbon compound gas, so that the exposed part of the metal conductor film is removed so as to leave the masked part. The metal conductor film may further comprise a diffusion protection layer formed of a refractory metal or its alloy upon and/or underneath the copper/mainly-copper layer. The mask pattern may be typically formed of silicon dioxide (SiO.sub.2). The substrate may further comprise an insulating layer thereon, typically formed of silicon dioxide (SiO.sub.2), for contacting said metal conductor film. The carbon compound gas may typically be a carbon tetra-chloride (CCl.sub.4), methane (CH.sub.4), ethane (C.sub.2 H.sub.6) or propane (C.sub.3 H.sub.8) and so on. When SiCl.sub.4 is employed the content may typically be 6.6 to 15% by volume in the gas mixture. When methane (CH.sub.4) gas is employed the content may typically be 8 to 18% by volume in the gas mixture. The etching step may preferably performed at a substrate temperature higher than 250.degree. C.
    • 蚀刻导电膜的方法包括以下步骤:在基底上形成包含铜或铜合金的金属导体膜; 并在所述金属导体膜上形成掩模图案; 以及通过使用掩模图案和使用包含四氯化硅(SiCl 4),氮(N 2)气体的气体混合物的等离子体的反应离子蚀刻(RIE)来蚀刻金属导体膜的暴露部分 和碳化合物气体,从而去除金属导体膜的暴露部分,以便离开掩模部分。 金属导体膜还可以包括由铜/主要铜层上和/或之下的难熔金属或其合金形成的扩散保护层。 掩模图案通常可以由二氧化硅(SiO 2)形成。 衬底还可包括其上通常由二氧化硅(SiO 2)形成的绝缘层,用于接触所述金属导体膜。 碳化合物气体通常可以是四氯化碳(CCl4),甲烷(CH4),乙烷(C2H6)或丙烷(C3H8)等。 当使用SiCl 4时,气体混合物中的含量通常可以为6.6至15体积%。 当使用甲烷(CH 4)气体时,气体混合物中的含量通常可以为8至18体积%。 蚀刻步骤可优选在高于250℃的衬底温度下进行。