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1. 发明授权

US07083225B2 Vehicle body structure of periphery of rear suspension 有权
标题翻译：后悬架周边车身结构
公开(公告)号：US07083225B2
公开(公告)日：2006-08-01
申请号：US10803537
申请日：2004-03-18
申请人： Takashi Yakata , Hideki Honjo , Shinsuke Miyoshi , Takashi Kikuchi , Keishi Goto
发明人： Takashi Yakata , Hideki Honjo , Shinsuke Miyoshi , Takashi Kikuchi , Keishi Goto
IPC分类号： B62D25/08
CPC分类号： B62D25/088
摘要： Coupling members include a first coupling portion (X) that couples rear quarter inner members to upper surfaces of rear suspension base members, a second coupling portion (Y) that couples upper surfaces of the rear suspension base members together, which are located on the right and the left in pairs, and a third coupling portion (Z) that joins the second coupling portion to couple the rear quarter inner members together, which are located on the right and the left in pairs, the coupling member being integrally formed, and there is formed a bulkhead structure in a portion surrounded by the first, second and third coupling portions.
摘要翻译：耦合构件包括将后四分之一内部构件耦合到后悬架基座构件的上表面的第一联接部分（X），将后悬架基座构件的上表面联接在一起的第二联接部分（Y），其位于右侧和成对的左侧，以及连接第二联接部分以将后部四分之一内部构件联接在一起的第三联接部分（Z），所述第二联接部分成对地位于左右两对，联接构件一体形成，并且在那里在由第一，第二和第三联接部分围绕的部分中形成隔板结构。

2. 发明授权

US07140674B2 Vehicle body frame structure 有权
标题翻译：车体框架结构
公开(公告)号：US07140674B2
公开(公告)日：2006-11-28
申请号：US10926100
申请日：2004-08-26
申请人： Shinsuke Miyoshi , Takashi Yakata , Takayuki Yatabe , Takashi Kikuchi , Keishi Goto , Koji Shibata
发明人： Shinsuke Miyoshi , Takashi Yakata , Takayuki Yatabe , Takashi Kikuchi , Keishi Goto , Koji Shibata
IPC分类号： B62D25/02 , B62D25/08
CPC分类号： B62D25/082 , B62D25/04
摘要： A vehicle body frame structure capable of realizing the connection to a side body in the form of structural connection. The vehicle body frame structure includes a side body whose skeleton is formed by a body panel that forms a side face of the vehicle body and a reinforcement member that is formed into a shape extending along the inside of the body panel and joined to the body panel, a front frame member that forms a front body disposed to form a shape extending from the side body to the front of the vehicle body, and an outer frame member joined to the front frame member from side of the vehicle body and secured to the reinforcement member by means of bolts extending through the body panel.
摘要翻译：一种能够以结构连接的形式实现与侧体的连接的车身框架结构。车身框架结构包括：侧体，其骨架由形成车体侧面的车身板构成;以及加强构件，其形成为沿着车身板的内部延伸并且接合到车身板的形状形成前置体的前框架构件，其形成从车身侧面延伸到车身前方的形状，以及外框架构件，从车体侧面接合到前框架构件，并固定到加强件通过延伸穿过车身面板的螺栓构成。

3. 发明授权

US06910732B2 Side body structure 失效
公开(公告)号：US06910732B2
公开(公告)日：2005-06-28
申请号：US10926313
申请日：2004-08-26
申请人： Shinsuke Miyoshi , Satoshi Arakawa , Takashi Yakata , Keishi Goto , Takashi Kikuchi
发明人： Shinsuke Miyoshi , Satoshi Arakawa , Takashi Yakata , Keishi Goto , Takashi Kikuchi
IPC分类号： B62D25/02 , B62D25/04 , B62D25/06 , B62D25/20
CPC分类号： B62D25/2036 , B62D25/02
摘要： In a side body structure, a front reinforce is provided between a side body outer panel and a side body inner panel and also, a rear roof side reinforce is provided so as to couple the front reinforce to a rear pillar reinforce along the upper edge of an opening of a rear door, and vehicle body rigidity of the periphery of the opening of the rear door as well as the periphery of an opening of a front door is enhanced.

4. 发明申请

US20050046237A1 Vehicle body frame structure 有权
标题翻译：车体框架结构
公开(公告)号：US20050046237A1
公开(公告)日：2005-03-03
申请号：US10926100
申请日：2004-08-26
申请人： Shinsuke Miyoshi , Takashi Yakata , Takayuki Yatabe , Takashi Kikuchi , Keishi Goto , Koji Shibata
发明人： Shinsuke Miyoshi , Takashi Yakata , Takayuki Yatabe , Takashi Kikuchi , Keishi Goto , Koji Shibata
IPC分类号： B62D25/04 , B62D25/08
CPC分类号： B62D25/082 , B62D25/04
摘要： A vehicle body frame structure capable of realizing the connection to a side body in the form of structural connection. The vehicle body frame structure includes a side body whose skeleton is formed by a body panel that forms a side face of the vehicle body and a reinforcement member that is formed into a shape extending along the inside of the body panel and joined to the body panel, a front frame member that forms a front body disposed to form a shape extending from the side body to the front of the vehicle body, and an outer frame member joined to the front frame member from side of the vehicle body and secured to the reinforcement member by means of bolts extending through the body panel.
摘要翻译：一种能够以结构连接的形式实现与侧体的连接的车身框架结构。车身框架结构包括：侧体，其骨架由形成车体侧面的车身板构成;以及加强构件，其形成为沿着车身板的内部延伸并且接合到车身板的形状形成前置体的前框架构件，其形成从车身侧面延伸到车身前方的形状，以及外框架构件，从车体侧面接合到前框架构件，并固定到加强件通过延伸穿过车身面板的螺栓构成。

5. 发明申请

US20050046238A1 Side body structure 失效
标题翻译：侧体结构
公开(公告)号：US20050046238A1
公开(公告)日：2005-03-03
申请号：US10926313
申请日：2004-08-26
申请人： Shinsuke Miyoshi , Satoshi Arakawa , Takashi Yakata , Keishi Goto , Takashi Kikuchi
发明人： Shinsuke Miyoshi , Satoshi Arakawa , Takashi Yakata , Keishi Goto , Takashi Kikuchi
IPC分类号： B62D25/02 , B62D25/04 , B62D25/06 , B62D25/20 , B62D25/00
CPC分类号： B62D25/2036 , B62D25/02
摘要： In a side body structure, a front reinforce is provided between a side body outer panel and a side body inner panel and also, a rear roof side reinforce is provided so as to couple the front reinforce to a rear pillar reinforce along the upper edge of an opening of a rear door, and vehicle body rigidity of the periphery of the opening of the rear door as well as the periphery of an opening of a front door is enhanced.
摘要翻译：在侧体结构中，在侧体外板和侧体内板之间设置有前加强件，并且还设置有后车顶侧加强件，以将前加强件沿着上侧边缘的上边缘连接到后支柱加强件后门的开口，后门的开口的周边的车身刚性以及前门的开口的周边被增强。

6. 发明授权

US08314493B2 Method for manufacturing a package-on-package type semiconductor device 有权
标题翻译：制造封装型封装型半导体器件的方法
公开(公告)号：US08314493B2
公开(公告)日：2012-11-20
申请号：US12900407
申请日：2010-10-07
申请人： Takashi Kikuchi , Tomoaki Hashimoto , Tatsuya Hirai
发明人： Takashi Kikuchi , Tomoaki Hashimoto , Tatsuya Hirai
IPC分类号： H01L23/48
CPC分类号： H01L23/3128 , H01L21/565 , H01L23/49827 , H01L23/49838 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/50 , H01L2224/05553 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/49173 , H01L2224/73204 , H01L2224/73265 , H01L2224/83191 , H01L2224/85181 , H01L2224/85186 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2225/06562 , H01L2225/1005 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10162 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2224/03 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/4554
摘要： Bump electrodes (conductive members) bonded onto lands disposed at a peripheral portion side than terminals (bonding leads) electrically coupled to pads (electrode pads) of a microcomputer chip (semiconductor chip) are sealed with sealing resin (a sealing body). Thereafter, the sealing resin is ground (removed) partially such that a part of each of the bump electrodes is exposed. The step of protruding the part of each of the bump electrodes from a front surface of the sealing resin is performed, after the grinding step.
摘要翻译：与微电脑芯片（半导体芯片）的焊盘（电极焊盘）电连接的端子（接合引线）配置在周边部分侧的焊盘上的凸起电极（导电部件）用密封树脂（密封体）密封。此后，密封树脂被部分地研磨（去除），使得每个凸起电极的一部分露出。在研磨步骤之后，执行从密封树脂的前表面突出每个凸起电极的一部分的步骤。

7. 发明申请

US20120038182A1 PASSENGER PROTECTION DEVICE FOR VEHICLE 有权
标题翻译：乘客的乘客保护装置
公开(公告)号：US20120038182A1
公开(公告)日：2012-02-16
申请号：US13265392
申请日：2010-04-20
申请人： Kazuhiro Onda , Nobuhiro Kawamoto , Itaru Genpei , Makoto Uchikawa , Takashi Kikuchi , Hajime Ishida
发明人： Kazuhiro Onda , Nobuhiro Kawamoto , Itaru Genpei , Makoto Uchikawa , Takashi Kikuchi , Hajime Ishida
IPC分类号： B60J5/04
CPC分类号： B60N2/449 , B60J5/0443 , B60J5/0458 , B60N2/4235 , B60N2/42709 , B60N2/986 , B60R21/0428 , B62D21/157 , B62D25/04
摘要： Disclosed is a passenger protection device (12) for a vehicle, which protects a passenger (Mn) sitting on a seat (11) when an external force (Fs) is applied to a side surface (16a) of a vehicle body (16). The passenger protection device has a side support (14). The side support is provided on the side portion of a seat back (46), and supports the upper body (Bu) of the passenger. The side support has a deformable portion (47). The deformable portion allows the side support to be deformed by an external force having a predetermined value or more.
摘要翻译：公开了一种用于车辆的乘客保护装置（12），当对车体（16）的侧表面（16a）施加外力（Fs）时，该乘客保护装置保护坐在座椅（11）上的乘客（Mn）。乘客保护装置具有侧支撑件（14）。侧支撑件设置在座椅靠背（46）的侧部，并且支撑乘客的上身（Bu）。侧支撑件具有可变形部分（47）。可变形部分允许侧支撑件通过具有预定值或更大的外力而变形。

8. 发明申请

US20110308725A1 ADHESIVE SHEET AND COPPER-CLAD LAMINATE 有权
标题翻译：粘合片和铜箔层压板
公开(公告)号：US20110308725A1
公开(公告)日：2011-12-22
申请号：US13221358
申请日：2011-08-30
申请人： Hisayasu Kaneshiro , Takashi Kikuchi
发明人： Hisayasu Kaneshiro , Takashi Kikuchi
IPC分类号： C09J7/02
CPC分类号： H05K1/0346 , C09J7/25 , C09J2479/086 , H05K1/0393 , H05K3/386 , H05K2201/0154 , H05K2201/068 , Y10T428/2852 , Y10T428/31678
摘要： Disclosed is an adhesive film having high dimensional stability which can be suitably used for two layer FPCs. Specifically, disclosed is an adhesive sheet composed of an insulting layer and an adhesive layer arranged on one side or both sides of the insulating layer. This adhesive sheet is characterized in that the insulating layer has a ratio E′2/E′1 between the storage elasticity modulus E′1 at 25° C. and the storage elasticity modulus E′2 at 380° C. of not more than 0.2 and a coefficient of thermal expansion in the MD direction of 5-15 ppm at 100-200° C. It is further characterized in that the change in the coefficient of thermal expansion of the adhesive sheet at 100-250° C. after heat treatment at 380° C. for 30 second under tension of 20 kg/m is not more than 2.5 ppm in the tension direction and not more than 10 ppm in the direction perpendicular to the tension direction.
摘要翻译：公开了一种具有高尺寸稳定性的粘合膜，其可以适用于两层FPC。具体地，公开了由绝缘层和布置在绝缘层的一侧或两侧上的粘合层构成的粘合片。该粘合片的特征在于绝缘层在25℃下的储能弹性模量E'1与380℃下的储能弹性模量E'2之间的比率E'2 / E'1不大于 0.2，在100〜200℃下MD方向的热膨胀系数为5〜15ppm。其特征还在于，热处理后的粘合片的热膨胀系数在100〜250℃的变化在拉伸方向下在380℃，30秒的拉伸下处理30秒，在拉伸方向垂直的方向不大于10ppm。

9. 发明申请

US20110073162A1 SUBSTRATE FOR THIN-FILM PHOTOELECTRIC CONVERSION DEVICE, THIN-FILM PHOTOELECTRIC CONVERSION DEVICE INCLUDING THE SAME, AND METHOD FOR PRODUCING SUBSTRATE FOR THIN-FILM PHOTOELECTRIC CONVERSION DEVICE 有权
标题翻译：薄膜光电转换装置用基板，包括该薄膜光电转换装置的薄膜光电转换装置及其生产用于薄膜光电转换装置的基板的方法
公开(公告)号：US20110073162A1
公开(公告)日：2011-03-31
申请号：US12993467
申请日：2009-05-15
申请人： Takashi Kikuchi , Toshiaki Sasaki
发明人： Takashi Kikuchi , Toshiaki Sasaki
IPC分类号： H01L31/052 , H01L31/18 , H01L31/0232
CPC分类号： H01L31/02168 , H01L31/03921 , H01L31/046 , H01L31/0463 , H01L31/076 , H01L31/1804 , Y02E10/547 , Y02E10/548 , Y02P70/521
摘要： Provided is a substrate for a thin-film photoelectric conversion device which makes it possible to produce the device having improved characteristics at low cost and high productivity. The substrate includes a transparent base member, with a transparent underlying layer and a transparent electrode layer successively stacked on one main surface of the transparent base member. The underlying layer includes transparent insulating fine particles and transparent binder, and the particles are dispersed to cover the one main surface with a coverage factor of particles—ranging from 30% or more to less than 80%. An antireflection layer is provided on the other main surface of the transparent base. The antireflection layer includes transparent insulating fine particles and transparent binder, and the particles are dispersed to cover the other main surface with a coverage factor greater than the underlying layer. The transparent electrode layer contains zinc oxide deposited by low-pressure CVD method.
摘要翻译：本发明提供一种薄膜光电转换装置用基板，能够以低成本，高生产率制造具有改善特性的装置。基板包括透明基底构件，透明基底层和依次层叠在透明基底构件的一个主表面上的透明电极层。下层包括透明绝缘细颗粒和透明粘合剂，并且颗粒被分散以覆盖一个主表面，其颗粒的覆盖因子范围为30％以上至小于80％。在透明基材的另一个主表面上设置防反射层。抗反射层包括透明绝缘细颗粒和透明粘合剂，并且颗粒被分散以覆盖另一个主表面，覆盖因子大于下层。透明电极层含有通过低压CVD法沉积的氧化锌。

10. 发明授权

US07511999B1 MIS-transistor-based nonvolatile memory with reliable data retention capability 有权
标题翻译：基于MIS晶体管的非易失性存储器具有可靠的数据保留能力
公开(公告)号：US07511999B1
公开(公告)日：2009-03-31
申请号：US11935458
申请日：2007-11-06
申请人： Takashi Kikuchi
发明人： Takashi Kikuchi
IPC分类号： G11C14/00
CPC分类号： G11C14/00
摘要： A nonvolatile semiconductor memory device includes a nonvolatile memory cell including an odd number of MIS transistor pairs, each of which stores one-bit data by creating an irreversible change of transistor characteristics in one of the two paired MIS transistors, latches equal in number to the odd number of MIS transistor pairs to store the odd number of one-bit data recalled from the MIS transistor pairs, the recalling of the one-bit data of a given MIS transistor pair being performed by sensing a difference in the transistor characteristics between the two paired MIS transistors of the given MIS transistor pair, and a majority decision circuit configured to make a majority decision based on the odd number of one-bit data to determine a bit value of the nonvolatile memory cell.
摘要翻译：非易失性半导体存储器件包括非易失性存储器单元，其包括奇数个MIS晶体管对，其中的每一个通过在两个成对的MIS晶体管中的一个中产生晶体管特性的不可逆变化来存储一位数据，数量等于奇数个MIS晶体管对以存储从MIS晶体管对调用的奇数个1位数据，通过检测两个晶体管特性之间的差异来执行给定MIS晶体管对的一位数据的调用给定MIS晶体管对的成对的MIS晶体管，以及被配置为基于奇数个1位数据做出多数决定以确定非易失性存储单元的位值的多数决定电路。

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