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    • 1. 发明授权
    • Optical data storage medium
    • 光学数据存储介质
    • US06228457B1
    • 2001-05-08
    • US09399108
    • 1999-09-20
    • Takashi UenoKeiichiro JinushiKatsuhisa ArataniMasaaki IwasakiRyohei Miyake
    • Takashi UenoKeiichiro JinushiKatsuhisa ArataniMasaaki IwasakiRyohei Miyake
    • B32B300
    • G11B7/258C23C14/185G11B7/24G11B7/243G11B7/2534G11B7/2542G11B7/256G11B7/2585Y10S428/913Y10S430/146Y10T428/21
    • There is disclosed an optical data storage medium in which the weather resistance of the semitransparent reflective film is improved and the adhesive property between the semitransparent reflective film and a substrate is enhanced, and which has a higher reliability. In an optical data storage medium (6), on the side on which a reproduction light (8) is incident, a first information layer (9) is located while on the side opposite to the side on which the reproduction light (8) is incident, a second information layer (10) is located. A semitransparent reflective film (3) of first information layer (9) is AgPdCu alloy thin films containing 0.5 to 3.0 weight % Pd and 0.1 to 3.0 weight % Cu or AgPdTi alloy thin films containing 0.5 to 3.0 weight % Pd and 0.1 to 3.0 weight % Ti. At the wavelength 650 nm, the optimum film thickness of AgPdCu alloy thin film is 5 to 18 nm and the optimum film thickness of AgPdTi alloy thin film is 10 to 25 nm. At the wavelength 450 nm, the optimum film thickness of AgPdCu alloy thin film is 10 to 25 nm, and the optimum film thickness of AgPdTi alloy thin film is 15 to 25 nm.
    • 公开了一种光学数据存储介质,其中半透明反射膜的耐候性得到改善,并且半透明反射膜和基板之间的粘合性提高,并且其具有更高的可靠性。 在光学数据存储介质(6)中,在再现光(8)入射的一侧上,第一信息层(9)位于与再现光(8)所在的一侧相反的一侧 事件中,定位第二信息层(10)。 第一信息层(9)的半透明反射膜(3)是包含0.5〜3.0重量%的Pd和0.1〜3.0重量%的含有0.5〜3.0重量%的Pd和0.1〜3.0重量%的Cu或AgPdTi合金薄膜的AgPdCu合金薄膜 %Ti。 在波长650nm处,AgPdCu合金薄膜的最佳膜厚为5〜18nm,AgPdTi合金薄膜的最佳膜厚为10〜25nm。 在波长450nm处,AgPdCu合金薄膜的最佳膜厚为10〜25nm,AgPdTi合金薄膜的最佳膜厚为15〜25nm。
    • 6. 发明授权
    • Electrostatic capacitance type input device
    • 静电电容式输入装置
    • US08614403B2
    • 2013-12-24
    • US13322052
    • 2010-05-26
    • Hiroshi TanakaTakashi Ueno
    • Hiroshi TanakaTakashi Ueno
    • H03K17/975
    • G06F3/044G06F2203/04111H03K17/9622H03K2217/96042H03K2217/960755
    • An electrostatic capacitance type input device is provided which has a structure in which translucent electrodes are aligned on the same layer in two axial directions, and has features that jumpers for connecting among the translucent electrodes in one of the two axial directions can be prevented from becoming conspicuous, and disconnection is less likely to occur. Jumpers 8 formed of an electrically conductive material are formed on a surface of a substrate 2, and thereafter an insulating film 6 is provided so as to cover the jumpers 8 and the substrate 2, and first translucent electrodes 3 and second translucent electrodes 4 are provided on the insulating film 6 so as to form a matrix. The first translucent electrodes 3 aligned in the leftward/rightward direction in the drawings are electrically connected to each other by the jumpers 8 via through holes 7 formed in the insulating film 6. On the other hand, the second translucent electrodes 4 aligned in the direction orthogonal to the surface of a sheet are connected to each other by connecting portions 5 which are formed by patterning so as to be integrated with the second translucent electrodes 4. Since the jumpers 8 for connecting among the first translucent electrodes 3 are formed on the substrate 2, the jumper 8 can be prevented from becoming conspicuous as viewed from the surface side.
    • 提供了一种静电电容型输入装置,其具有半透明电极沿两个轴向对准在同一层上的结构,并且具有能够防止在两个轴向中的一个方向上连接透光性电极的跳线变成 显眼,断线不太可能发生。 在基板2的表面上形成由导电材料形成的跳线8,然后设置绝缘膜6以覆盖跳线8和基板2,并且设置第一透光性电极3和第二透光性电极4 在绝缘膜6上形成矩阵。 在图中左右方向排列的第一透光性电极3通过形成在绝缘膜6上的通孔7由跳线8电连接。另一方面,第二透光性电极4在方向 通过图案形成的连接部分5与片材的表面正交地连接,以便与第二透光电极4一体化。由于用于连接第一透光性电极3的跳线8形成在基板上 如图2所示,当从表面侧观察时,可以防止跳线8变得显眼。
    • 7. 发明授权
    • Head cap having air communicating channel, and liquid droplets ejection head recovering mechanism and liquid droplets ejection printer therefor
    • 头盖具有空气连通通道,液滴喷射头回收机构和液滴喷射打印机
    • US08267499B2
    • 2012-09-18
    • US12542782
    • 2009-08-18
    • Takashi Ueno
    • Takashi Ueno
    • B41J2/165B41J2/155
    • B41J2/16588B41J2/16547
    • A head cap, including: a cap including (a) a bottom plate portion and (b) a projecting portion which functions as a side wall, which extends from the bottom plate portion so as to define a recessed portion with the bottom plate portion, and whose distal end contacts with a surrounding of a liquid-droplets ejecting area formed in a liquid-droplets ejecting surface of a liquid-droplets ejecting head so as to enclose the liquid-droplets ejecting area; a holder configured to support the cap; a groove formed in at least one of a first surface of the bottom plate portion which is opposed to the holder and a second surface of the holder which is opposed to the bottom plate portion so as to partly constitute an air communicating channel that communicates the recessed portion and an outside with each other; and a channel wall provided between the first surface and the second surface so as to enclose the groove as seen in a direction perpendicular to one of the first surface and the second surface by contacting with at least one of the first surface and the second surface.
    • 一种头盖,包括:盖,包括(a)底板部分和(b)用作侧壁的突出部分,其从底板部分延伸以限定具有底板部分的凹陷部分, 并且其远端与形成在液滴喷射头的液滴喷射表面中的液滴喷射区域的周围接触,以便包围液滴喷射区域; 保持器,其构造成支撑所述盖; 形成在所述底板部的与所述保持件相对的第一表面和与所述底板部相对的所述保持件的第二表面中的至少一个中的槽,以部分地构成连通所述凹部 部分和外部彼此; 以及设置在所述第一表面和所述第二表面之间的通道壁,以便通过与所述第一表面和所述第二表面中的至少一个接触而在垂直于所述第一表面和所述第二表面中的一个方向的方向上包围所述凹槽。
    • 8. 发明申请
    • COOLING STRUCTURE OF SEMICONDUCTOR DEVICE
    • 半导体器件的冷却结构
    • US20120228757A1
    • 2012-09-13
    • US13511305
    • 2009-11-25
    • Akio KitamiTakashi Ueno
    • Akio KitamiTakashi Ueno
    • H01L23/36
    • H01L23/427F28D15/0266H01L23/36H01L25/074H01L2224/32245H01L2224/33181H01L2924/1305H01L2924/13055H01L2924/00
    • A cooling structure of a semiconductor device includes an output electrode, a semiconductor element and a semiconductor element disposed to face each other with the output electrode interposed therebetween, a radiator disposed for the semiconductor element on a side opposite to the output electrode, and a radiator disposed for the semiconductor element on the side opposite to the output electrode. The output electrode includes an element mounting portion and a heat transport portion. The element mounting portion is electrically connected to the semiconductor element and the semiconductor element, and is formed of a conductive material. The heat transport portion is disposed to extend from the element mounting portion toward the radiator and the radiator. With this structure, a cooling structure of a semiconductor device with which excellent cooling efficiency is realized can be provided.
    • 半导体器件的冷却结构包括输出电极,半导体元件和半导体元件,半导体元件和半导体元件设置成彼此相对,输出电极介于其间;散热器,设置在半导体元件的与输出电极相对的一侧,散热器 设置在与输出电极相对的一侧上的半导体元件。 输出电极包括元件安装部分和热传输部分。 元件安装部分电连接到半导体元件和半导体元件,并且由导电材料形成。 热传输部分从元件安装部分朝向散热器和散热器设置。 利用这种结构,可以提供实现优异的冷却效率的半导体器件的冷却结构。