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    • 2. 发明授权
    • Ultrasonic probe and method for manufacturing ultrasonic probe
    • 超声波探头及超声波探头制造方法
    • US08647280B2
    • 2014-02-11
    • US13424873
    • 2012-03-20
    • Michiko OoishiSatoru AsagiriTakashi TogasakiTakeshi Miyagi
    • Michiko OoishiSatoru AsagiriTakashi TogasakiTakeshi Miyagi
    • A61B8/14
    • A61B8/4444A61B8/4483
    • An ultrasonic probe includes, a transducer, a substrate includes electrodes formed on a front surface and a back surface and electronic components, first flexible wire substrates connected in such a manner that a first end is connected to the transducer and a second end is connected to a electrode at a side of the front surface of the substrate, second flexible wire substrates connected in such a manner that a first end is connected to the transducer and a second end is connected to a electrode at a side of the back surface of the substrate, and a dummy materials including the same rigidity and thickness as those of the first flexible wire substrate is arranged at a space, adjacent to a electrode at the side of the front surface of the substrate, corresponding to the second end of the second flexible wire substrate.
    • 超声波探头包括换能器,基板包括形成在前表面和后表面上的电极和电子部件,第一柔性线基板以使得第一端连接到换能器的方式连接,第二端连接到 在所述基板的前表面的一侧的电极,以使得第一端连接到所述换能器的方式连接的第二柔性线基板,并且第二端连接到所述基板的背面侧的电极 并且与第一柔性线基板的刚性和厚度相同的虚拟材料布置在与基板的前表面侧的电极相邻的空间处,对应于第二柔性线的第二端 基质。
    • 10. 发明申请
    • MICROMECHANICAL DEVICE AND METHOD OF MANUFACTURING MICROMECHANICAL DEVICE
    • 微生物装置及制造微生物装置的方法
    • US20090236114A1
    • 2009-09-24
    • US12399348
    • 2009-03-06
    • Susumu ObataMichinobu InoueTakeshi Miyagi
    • Susumu ObataMichinobu InoueTakeshi Miyagi
    • H05K5/06H05K7/02
    • B81B3/0078B81B2201/016B81B2203/0109H01H1/50H01H3/60H01H59/0009Y10T29/49002
    • An example of the present invention is a micromechanical device including, a substrate in which a signal line is provided, a micromachine which is mounted on the substrate, is formed of a conductive material into a beam-like shape, is elastically deformed by a function of an electric field in such a manner that the beam-like part moves closer to or apart from the signal line, and changes the electric characteristics concomitantly with the deformation, a deformation restraint section constituted of a material having a higher viscosity coefficient than the conductive material, provided on the opposite side of the micromachine to the signal line, for restraining deformation of the micromachine in a direction in which the micromachine is separated from the signal line, and a sealing body provided on the principal surface of the substrate, for covering the micromachine with a hollow section located therebetween.
    • 本发明的一个实例是一种微机械装置,其特征在于,包括:设置有信号线的基板,安装在基板上的微机械,由导电材料形成为梁状,通过功能弹性变形 电场的方式使得束状部分靠近信号线或离开信号线移动,并且随着变形而改变电特性,变形抑制部分由具有比导电性更高的粘度系数的材料构成 材料,其设置在所述微机械相对于所述信号线的相反侧,用于限制所述微机械从所述微机械与所述信号线分离的方向上的变形;以及设置在所述基板主表面上的密封体, 具有位于其间的中空部分的微机械。