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    • 3. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08143725B2
    • 2012-03-27
    • US12650733
    • 2009-12-31
    • Dai Motojima
    • Dai Motojima
    • H01L29/40
    • H01L23/5226H01L23/53238H01L23/53295H01L2924/0002H01L2924/00
    • A semiconductor device includes a first interconnect 31; a second interconnect 32 which is formed in a different interconnect layer from that of the first interconnect 31, and which has a wider line width than that of the first interconnect 31; and first and second plugs 51 and 52 which are formed in a region where the first and second interconnects 31 and 32 extend in the same direction so as to overlap one above the other, and which electrically connect the first and second interconnects 31 and 32. The first plug 51 has a larger base area than that of the second plug 52, and is formed on an end side of the first interconnect 31 with respect to the second plug 52.
    • 半导体器件包括第一互连31; 第二互连件32,其形成在与第一互连件31不同的互连层中,并且具有比第一互连件31宽的线宽; 以及第一和第二插头51和52,其形成在第一和第二互连件31和32沿相同方向延伸以便彼此重叠的区域中,并且将第一和第二互连件31和32电连接。 第一插头51具有比第二插头52更大的基座面积,并且相对于第二插头52形成在第一互连件31的端侧上。