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    • 5. 发明申请
    • ELECTRICAL CONNECTION TERMINAL AND CONNECTOR USING SAME
    • 电气连接端子和连接器使用相同
    • US20130288514A1
    • 2013-10-31
    • US13819502
    • 2012-01-11
    • Takashi SekineKenichi Yamaguchi
    • Takashi SekineKenichi Yamaguchi
    • H01R4/10
    • H01R4/10F21K9/232F21V3/00F21V19/004F21V23/06F21Y2115/10H01R4/24H01R4/2404H01R4/4818H01R12/515H01R12/721
    • An electrical connection terminal for securely retaining a connection object without degrading connection reliability, and a connector using the electrical connection terminal. A first contacting portion adapted to cut into a lead wire of a cable to restrict displacement thereof in a counter-insertion direction is provided in the leading-end corner of a first contact piece of a terminal, and a second contacting portion with which the lead wire slidably makes contact is provided on the leading end of a second contact piece of the terminal. Disconnection of the lead wire is prevented by means of the first contacting portion and securing a sufficient area of connect with the lead wire by the second contacting portion. The second contacting portion is formed by chamfering the leading-end corner of the second contact piece. Accordingly, the leading-end side of the second contact piece need not be bent to form a curved-surface contacting portion.
    • 一种用于牢固地保持连接对象而不降低连接可靠性的电连接端子,以及使用该电连接端子的连接器。 在端子的第一接触片的前端角部和第二接触部分中设置适于切割成电缆的引线以限制其沿反向插入方向的位移的第一接触部分, 在端子的第二接触片的前端设有可滑动地接触的线。 通过第一接触部分防止引线的断开,并且通过第二接触部分确保与引线的足够的连接区域。 第二接触部分通过倒角第二接触片的前端角形成。 因此,第二接触片的前端侧不需要弯曲而形成曲面接触部。
    • 6. 发明授权
    • Method for machining chamfer portion of semiconductor wafer and method for correcting groove shape of grinding stone
    • 半导体晶片的倒角部分的加工方法及修磨砂轮的形状的方法
    • US08038511B2
    • 2011-10-18
    • US12086330
    • 2006-12-13
    • Eiichi YamazakiTakashi Sekine
    • Eiichi YamazakiTakashi Sekine
    • B24B1/00
    • H01L21/02021B24B9/065B24B53/07
    • According to the present invention, in a method for subjecting a roughly ground chamfer portion of a semiconductor wafer to helical grinding by relatively inclining the wafer and a second grinding stone to perform precise grinding, an edge portion of a discoid truer is formed into a vertically asymmetrical groove shape of a first grinding stone by using the first grinding stone having a vertically asymmetrical groove formed on a periphery thereof to grind the edge portion of the truer by the groove of the first grinding stone without being relatively inclined, a groove is formed on a periphery of the second grinding stone by relatively inclining the truer and the second grinding stone to subject the second grinding stone to helical grinding, and the chamfer portion of the wafer is precisely ground based on helical grinding by relatively inclining the semiconductor wafer with respect to a direction of the groove formed on the periphery of the second grinding stone. As a result, there is provided the method for machining a chamfer portion of the semiconductor wafer, which can machine the chamfer portion of the wafer into a vertically symmetrical shape when subjecting the chamfer portion of the semiconductor wafer to helical grinding, e.g. a resin grinding stone and the like.
    • 根据本发明,通过使半导体晶片的大致倒角的倒角部通过相对倾斜晶片进行螺旋磨削和第二研磨石进行精密研磨的方法中,将盘状矫正器的边缘部形成为垂直方向 通过使用具有形成在其周边上的垂直不对称槽的第一研磨石,通过第一研磨石的凹槽来研磨修整器的边缘部分而不相对倾斜地在第一研磨石的不对称凹槽形状上形成凹槽, 第二研磨石的周边通过相对地倾斜修整器和第二研磨石以使第二研磨石进行螺旋磨削,并且通过相对于半导体晶片相对倾斜相对于螺旋磨削而精确地研磨晶片的倒角部分 形成在第二研磨石的周边上的槽的方向。 结果,提供了用于加工半导体晶片的倒角部分的方法,当对半导体晶片的倒角部分进行螺旋磨削时,例如可以将晶片的倒角部分加工成垂直对称的形状。 树脂研磨石等。
    • 7. 发明申请
    • AIR CONDITIONER
    • 冷气机
    • US20110048054A1
    • 2011-03-03
    • US12868323
    • 2010-08-25
    • Takashi Sekine
    • Takashi Sekine
    • F25B13/00F25B7/00F25B1/10
    • F25B13/00F25B1/10F25B41/046F25B2313/007F25B2313/0231F25B2313/0233F25B2313/0253F25B2313/02742F25B2313/0292F25B2400/075
    • A triple-pipeline type first outdoor unit 2 provided with a first compressor 20 and a first outdoor heat exchanger 21, a plurality of indoor units 4A to 4D are provided, a second outdoor unit 3 provided with a second compressor 30, a second outdoor heat exchanger 32, and a second expansion valve 33, the first outdoor unit 2 is provided with a first four-way valve 60 that makes a refrigerant discharge pipe 25 of the first compressor 20 and a high-pressure gas pipe 7 capable of communicating with each other and if all the indoor units 4A to 4D perform a cooling operation at the same time, the first four-way valve 60 shuts off the communication between the refrigerant discharge pipe 25 and the high-pressure gas pipe 7, while a third four-way valve 51 is switched so as to connect a gas pipe 35d to the high-pressure gas pipe 7.
    • 设置有第一压缩机20和第一室外热交换器21,多个室内单元4A〜4D的三管路型第一室外机2,设置有第二压缩机30的第二室外机3,第二室外热 交换器32和第二膨胀阀33,第一室外单元2设置有第一四通阀60,其使第一压缩机20的制冷剂排出管25和能够与第一压缩机20连通的高压气体管7 另一方面,如果全部室内机4A〜4D同时进行制冷运转,则第一四通阀60切断制冷剂排出管25与高压气体配管7的连通, 切换单向阀51,将气体管道35d与高压气体管道7连接。