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1. 发明授权

US5777150A Substituted amic acid derivatives 失效
标题翻译：取代的酰胺酸衍生物
公开(公告)号：US5777150A
公开(公告)日：1998-07-07
申请号：US696152
申请日：1996-08-13
申请人： Takashi Nomoto , Masahiro Hayashi , Jun Shibata , Yoshikazu Iwasawa , Morihiro Mitsuya , Yoshiaki Iida , Katsumasa Nonoshita , Yasufumi Nagata
发明人： Takashi Nomoto , Masahiro Hayashi , Jun Shibata , Yoshikazu Iwasawa , Morihiro Mitsuya , Yoshiaki Iida , Katsumasa Nonoshita , Yasufumi Nagata
IPC分类号： C07C69/34 , C07C211/27 , C07C211/29 , C07C215/52 , C07C217/60 , C07C233/05 , C07C233/13 , C07C233/18 , C07C235/06 , C07D213/38 , C07D213/40 , C07D215/12 , C07D215/48 , C07D263/32 , C07D307/14 , C07D307/52 , C07D307/81 , C07D317/58 , C07D333/20 , C07D333/28 , C07D333/54 , C07D333/58 , C07C69/78 , C07C69/767 , C07C69/773 , C07D317/34
CPC分类号： C07D213/40 , C07C211/27 , C07C211/29 , C07C215/52 , C07C217/60 , C07C233/05 , C07C233/13 , C07C233/18 , C07C235/06 , C07C69/34 , C07D213/38 , C07D215/12 , C07D215/48 , C07D263/32 , C07D307/14 , C07D307/52 , C07D307/81 , C07D317/58 , C07D333/20 , C07D333/28 , C07D333/54 , C07D333/58
摘要： A compound of the formula (I) or its pharmaceutically acceptable salt or ester: ##STR1## wherein each of ##STR2## which are the same or different, is an aryl group or a heteroaromatic ring group; A is a C.sub.3-8 linear saturated or unsaturated aliphatic hydrocarbon group which may have substituent(s) selected from the group consisting of a lower alkyl group, a hydroxyl group, a lower alkoxy group, a carboxyl group, an aryl group and an aralkyl group; Q is a single bond or a group of the formula --CO--O--, --O--CO--, --CH.sub.2 CH.sub.2 --, --CH.dbd.CH--, --OCH.sub.2 --, --SCH.sub.2 --, --CH.sub.2 O-- or --CH.sub.2 S--; each of R.sup.1, R.sup.2, R.sup.3 and R.sup.4 which are the same or different, is a hydrogen atom, a halogen atom, a lower alkyl group, a hydroxyl group, a lower alkoxy group, or an aryl or heteroaromatic ring group which may have substituent(s) selected from the group consisting of a halogen atom, a lower alkyl group and a lower alkoxy group; each of R.sup.5, R.sup.6 and R.sup.7 which are the same or different, is a hydrogen atom or a lower alkyl group; and R.sup.8 is a hydrogen atom, a lower alkyl group, a lower alkenyl group, a lower alkynyl group or an aralkyl group, provided that when Q is a single bond, ##STR3## are not simultaneously 4-chlorophenyl groups.
摘要翻译：式（I）化合物或其药学上可接受的盐或酯：其中每个相同或不同的芳基是芳基或杂芳环; A是可以具有选自低级烷基，羟基，低级烷氧基，羧基，芳基和芳烷基的取代基的C3-8直链饱和或不饱和脂族烃基组; Q是单键或式-CO-O-，-O-CO-，-CH 2 CH 2 - ， - CH = CH - ， - OCH 2 - ， - CH 2 - ， - CH 2 O-或-CH 2 S--的基团; R 1，R 2，R 3和R 4相同或不同的是氢原子，卤素原子，低级烷基，羟基，低级烷氧基或可具有取代基的芳基或杂芳族环基选自卤素原子，低级烷基和低级烷氧基的基团; R 5，R 6和R 7各自相同或不同，为氢原子或低级烷基; 并且R8是氢原子，低级烷基，低级烯基，低级炔基或芳烷基，条件是当Q为单键时，＆lt; IMAGE＆gt;不同时为4-氯苯基。

2. 发明授权

US5606101A Substitute amic acid derivatives 失效
标题翻译：取代酰胺酸衍生物
公开(公告)号：US5606101A
公开(公告)日：1997-02-25
申请号：US540329
申请日：1995-10-06
申请人： Takashi Nomoto , Masahiro Hayashi , Jun Shibata , Yoshikazu Iwasawa , Morihiro Mitsuya , Yoshiaki IIda , Katsumasa Nonoshita , Yasufumi Nagata
发明人： Takashi Nomoto , Masahiro Hayashi , Jun Shibata , Yoshikazu Iwasawa , Morihiro Mitsuya , Yoshiaki IIda , Katsumasa Nonoshita , Yasufumi Nagata
IPC分类号： C07C69/34 , C07C211/27 , C07C211/29 , C07C215/52 , C07C217/60 , C07C233/05 , C07C233/13 , C07C233/18 , C07C235/06 , C07D213/38 , C07D213/40 , C07D215/12 , C07D215/48 , C07D263/32 , C07D307/14 , C07D307/52 , C07D307/81 , C07D317/58 , C07D333/20 , C07D333/28 , C07D333/54 , C07D333/58 , C07C69/353
CPC分类号： C07D213/40 , C07C211/27 , C07C211/29 , C07C215/52 , C07C217/60 , C07C233/05 , C07C233/13 , C07C233/18 , C07C235/06 , C07C69/34 , C07D213/38 , C07D215/12 , C07D215/48 , C07D263/32 , C07D307/14 , C07D307/52 , C07D307/81 , C07D317/58 , C07D333/20 , C07D333/28 , C07D333/54 , C07D333/58
摘要： A compound of the formula (I) or its pharmaceutically acceptable salt or ester: ##STR1## and intermediates thereof.
摘要翻译：式（I）化合物或其药学上可接受的盐或酯：其中和（I）及其中间体。

3. 发明授权

US5488149A Substituted amic acid derivatives 失效
标题翻译：取代的酰胺酸衍生物
公开(公告)号：US5488149A
公开(公告)日：1996-01-30
申请号：US471081
申请日：1995-06-06
申请人： Takashi Nomoto , Masahiro Hayashi , Jun Shibata , Yoshikazu Iwasawa , Morihiro Mitsuya , Yoshiaki Iida , Katsumasa Nonoshita , Yasufumi Nagata
发明人： Takashi Nomoto , Masahiro Hayashi , Jun Shibata , Yoshikazu Iwasawa , Morihiro Mitsuya , Yoshiaki Iida , Katsumasa Nonoshita , Yasufumi Nagata
IPC分类号： C07C69/34 , C07C211/27 , C07C211/29 , C07C215/52 , C07C217/60 , C07C233/05 , C07C233/13 , C07C233/18 , C07C235/06 , C07D213/38 , C07D213/40 , C07D215/12 , C07D215/48 , C07D263/32 , C07D307/14 , C07D307/52 , C07D307/81 , C07D317/58 , C07D333/20 , C07D333/28 , C07D333/54 , C07D333/58 , C07C235/72
CPC分类号： C07D213/40 , C07C211/27 , C07C211/29 , C07C215/52 , C07C217/60 , C07C233/05 , C07C233/13 , C07C233/18 , C07C235/06 , C07C69/34 , C07D213/38 , C07D215/12 , C07D215/48 , C07D263/32 , C07D307/14 , C07D307/52 , C07D307/81 , C07D317/58 , C07D333/20 , C07D333/28 , C07D333/54 , C07D333/58
摘要： A compound of the formula (I) or its pharmaceutically acceptable salt or ester: ##STR1## wherein each of the substituents are herein defined.
摘要翻译：式（I）化合物或其药学上可接受的盐或酯：其中每个取代基在本文中定义。

4. 发明授权

US5616803A Substituted amic acid derivatives 失效
标题翻译：取代的酰胺酸衍生物
公开(公告)号：US5616803A
公开(公告)日：1997-04-01
申请号：US540628
申请日：1995-10-06
申请人： Takashi Nomoto , Masahiro Hayashi , Jun Shibata , Yoshikazu Iwasawa , Morihiro Mitsuya , Yoshiaki Iida , Katsumasa Nonoshita , Yasufumi Nagata
发明人： Takashi Nomoto , Masahiro Hayashi , Jun Shibata , Yoshikazu Iwasawa , Morihiro Mitsuya , Yoshiaki Iida , Katsumasa Nonoshita , Yasufumi Nagata
IPC分类号： C07C69/34 , C07C211/27 , C07C211/29 , C07C215/52 , C07C217/60 , C07C233/05 , C07C233/13 , C07C233/18 , C07C235/06 , C07D213/38 , C07D213/40 , C07D215/12 , C07D215/48 , C07D263/32 , C07D307/14 , C07D307/52 , C07D307/81 , C07D317/58 , C07D333/20 , C07D333/28 , C07D333/54 , C07D333/58
CPC分类号： C07D213/40 , C07C211/27 , C07C211/29 , C07C215/52 , C07C217/60 , C07C233/05 , C07C233/13 , C07C233/18 , C07C235/06 , C07C69/34 , C07D213/38 , C07D215/12 , C07D215/48 , C07D263/32 , C07D307/14 , C07D307/52 , C07D307/81 , C07D317/58 , C07D333/20 , C07D333/28 , C07D333/54 , C07D333/58
摘要： A compound of the formula (I) or its pharmaceutically acceptable salt or ester: ##STR1## wherein each of the substituents are herein defined.
摘要翻译：式（I）化合物或其药学上可接受的盐或酯：其中每个取代基在本文中定义。

5. 发明授权

US07709475B2 Selective inhibitors against Cdk4 and Cdk6 having aminothiazole skeleton 失效
标题翻译：具有氨基噻唑骨架的Cdk4和Cdk6选择性抑制剂
公开(公告)号：US07709475B2
公开(公告)日：2010-05-04
申请号：US11596735
申请日：2005-05-19
申请人： Yoshikazu Iwasawa , Jun Shibata , Tadashi Shimamura , Hideki Kurihara , Takashi Mita , Nobuhiko Kawanishi , Takashi Hashihayata , Mikako Kawamura , Takeshi Sagara , Sachie Arai , Hiroshi Hirai
发明人： Yoshikazu Iwasawa , Jun Shibata , Tadashi Shimamura , Hideki Kurihara , Takashi Mita , Nobuhiko Kawanishi , Takashi Hashihayata , Mikako Kawamura , Takeshi Sagara , Sachie Arai , Hiroshi Hirai
IPC分类号： C07D417/12 , A61K31/506 , C07D417/14 , C07D491/08
CPC分类号： C07D417/14 , C07D417/12 , C07D491/08
摘要： The present invention relates to a compound represented by Formula [I]: wherein X is O, S, NH or CH2; Y1, Y2, Y3, Y4 and Y5, which may be identical or different, are each CH or N; however, at least one of Y1, Y2, Y3, Y4 and Y5 is N; Z1 and Z2, which may be identical or different, are each CH or N; n is an integer from 1 to 3; R1 is a C3-C8 cycloalkyl group, a C6-C10 aryl group, an aliphatic heterocyclic ring or an aromatic heterocyclic ring, or a bicyclic aliphatic saturated hydrocarbon group; R2 and R3, which may be identical or different, are each a hydrogen atom, a lower alkyl group, a lower alkenyl group, a C3-C8 cycloalkyl group, a C6-C10 aryl group, an aromatic heterocyclic ring, or the like; and R4 is a hydrogen atom, a lower alkyl group, a C3-C6 cycloalkyl group or the like, or a pharmaceutically acceptable salt or ester thereof, and a selective inhibitor against Cdk4 and/or Cdk6 or an anticancer agent containing the compound or a pharmaceutically acceptable salt or ester thereof.
摘要翻译：本发明涉及由式[I]表示的化合物：其中X是O，S，NH或CH 2; Y1，Y2，Y3，Y4和Y5可以相同或不同，分别为CH或N; 然而，Y 1，Y 2，Y 3，Y 4和Y 5中的至少一个为N; 可以相同或不同的Z 1和Z 2各自为CH或N; n为1〜3的整数， R1是C3-C8环烷基，C6-C10芳基，脂族杂环或芳族杂环，或双环脂族饱和烃基; R2和R3可以相同或不同，分别为氢原子，低级烷基，低级烯基，C3-C8环烷基，C6-C10芳基，芳族杂环等; R4为氢原子，低级烷基，C3-C6环烷基等，或其药学上可接受的盐或酯，以及对Cdk4和/或Cdk6的选择性抑制剂或含有该化合物或其药学上可接受的盐或酯。

6. 发明申请

US20080081811A1 Selective Inhibitors Against Cdk4 and Cdk6 Having Aminothiazole Skeleton 失效
标题翻译：对具有氨基噻唑骨架的Cdk4和Cdk6的选择性抑制剂
公开(公告)号：US20080081811A1
公开(公告)日：2008-04-03
申请号：US11596735
申请日：2005-05-19
申请人： Yoshikazu Iwasawa , Jun Shibata , Tadashi Shimamura , Hideki Kurihara , Takashi Mita , Nobuhiko Kawanishi , Takashi Hashihayata , Mikako Kawamura , Takeshi Sagara , Sachie Arai , Hiroshi Hirai
发明人： Yoshikazu Iwasawa , Jun Shibata , Tadashi Shimamura , Hideki Kurihara , Takashi Mita , Nobuhiko Kawanishi , Takashi Hashihayata , Mikako Kawamura , Takeshi Sagara , Sachie Arai , Hiroshi Hirai
IPC分类号： A61K31/496 , A61K31/497 , A61K31/505 , A61K31/5377 , A61P35/00 , C07D239/32 , C07D403/14 , C07D413/14
CPC分类号： C07D417/14 , C07D417/12 , C07D491/08
摘要： The present invention relates to a compound represented by Formula [I]: wherein X is O, S, NH or CH2; Y1, Y2, Y3, Y4 and Y5, which may be identical or different, are each CH or N; however, at least one of Y1, Y2, Y3, Y4 and Y5 is N; Z1 and Z2, which may be identical or different, are each CH or N; n is an integer from 1 to 3; R1 is a C3-C8 cycloalkyl group, a C6-C10 aryl group, an aliphatic heterocyclic ring or an aromatic heterocyclic ring, or a bicyclic aliphatic saturated hydrocarbon group; R2 and R3, which may be identical or different, are each a hydrogen atom, a lower alkyl group, a lower alkenyl group, a C3-C8 cycloalkyl group, a C6-C10 aryl group, an aromatic heterocyclic ring, or the like; and R4 is a hydrogen atom, a lower alkyl group, a C3-C6 cycloalkyl group or the like, or a pharmaceutically acceptable salt or ester thereof, and a selective inhibitor against Cdk4 and/or Cdk6 or an anticancer agent containing the compound or a pharmaceutically acceptable salt or ester thereof.
摘要翻译：本发明涉及由式[I]表示的化合物：其中X是O，S，NH或CH 2; Y 1，Y 2，Y 3，Y 4和Y 5，其可以相同或不同，各自为CH或N; 然而，Y 1，Y 2，Y 3，Y 4和Y 3中的至少一个， 5 是N; Z 1和Z 2可以相同或不同，各自为CH或N; n为1〜3的整数， R 1是C 3 -C 8环烷基，C 6 -C 10环烷基，C 6 -C 15环烷基，芳基，脂族杂环或芳族杂环，或双环脂族饱和烃基; R 2和R 3可以相同或不同，分别为氢原子，低级烷基，低级烯基，C 3， C 1 -C 8环烷基，C 6 -C 10芳基，芳族杂环等; 和R 4是氢原子，低级烷基，C 3 -C 6环烷基等，或药学上可接受的盐或酯，以及对Cdk4和/或Cdk6的选择性抑制剂或含有该化合物或其药学上可接受的盐或酯的抗癌剂。

7. 发明授权

US07046960B2 Relay apparatus 失效
标题翻译：继电器
公开(公告)号：US07046960B2
公开(公告)日：2006-05-16
申请号：US10001759
申请日：2001-10-24
申请人： Makoto Takemoto , Katsuyuki Kawase , Tetsu Takase , Jun Shibata
发明人： Makoto Takemoto , Katsuyuki Kawase , Tetsu Takase , Jun Shibata
IPC分类号： H04B7/14
CPC分类号： H04H20/06 , H04B1/52 , H04B1/525 , H04B7/15585 , H04H20/67
摘要： While a spectrum waveform of an output signal from a subtracter (207) is visibly monitored, an operator controls a variable phases shifter (208) based upon a second control signal (CL2) so that a shape of a spectrum waveform of an output signal from a subtracter (207) is approximated to a spectrum waveform of a desirable wave to change a phase of a local oscillation frequency signal from a local oscillator (206). As a result, a phase of a duplicated loop signal is changed. Also, the operator controls a variable attenuator (209) based upon a first control signal (CL1) so that a shape of this spectrum waveform is approximated to a spectrum waveform of a desirable wave (20) to change a signal level of the duplicated loop signal.
摘要翻译：当可见地监视来自减法器（207）的输出信号的频谱波形时，操作员基于第二控制信号（CL 2）控制可变相移器（208），使得输出信号的频谱波形的形状近似于从本地振荡器（206）改变本地振荡频率信号的相位的期望波的频谱波形。结果，改变了重复的环路信号的相位。另外，操作员根据第一控制信号（CL 1）控制可变衰减器（209），使得该频谱波形的形状近似于期望波（20）的频谱波形，以改变复制的信号的信号电平回路信号。

8. 发明授权

US06545365B2 Resin-sealed chip stack type semiconductor device 失效
标题翻译：树脂密封芯片堆叠型半导体器件
公开(公告)号：US06545365B2
公开(公告)日：2003-04-08
申请号：US09781237
申请日：2001-02-13
申请人： Takashi Kondo , Koji Bando , Jun Shibata , Kazuko Narutaki
发明人： Takashi Kondo , Koji Bando , Jun Shibata , Kazuko Narutaki
IPC分类号： H01L2348
CPC分类号： H01L25/0657 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2225/06582 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： A resin-sealed chip stack type semiconductor device comprises a substrate placed on many balls, a bottom chip to which wires are connected, a top chip to which wires are connected and mounted above the bottom chip, a non-conductive bonding layer which functions to bond and fix the two chips to each other, and a sealing resin which covers and protects all the components mounted on the substrate. The non-conductive bonding layer is provided by die bonding in such a manner that is at least covers the portion of the bottom chip where the corresponding wires are connected and does not allow generation of a gap between the two chips.
摘要翻译：一种树脂密封芯片堆叠型半导体器件，包括放置在许多球上的衬底，连接有导线的底部芯片，连接并且安装在底部芯片上方的导线的顶部芯片，非导电结合层，其功能于将两个芯片彼此粘合并固定，以及密封树脂，其覆盖并保护安装在基板上的所有部件。非导电结合层通过芯片接合以至少覆盖底部芯片的相应导线连接部分并且不允许在两个芯片之间产生间隙的方式提供。

9. 发明授权

US5834340A Plastic molded semiconductor package and method of manufacturing the same 失效
公开(公告)号：US5834340A
公开(公告)日：1998-11-10
申请号：US977666
申请日：1997-11-24
申请人： Akiyoshi Sawai , Haruo Shimamoto , Toru Tachikawa , Jun Shibata
发明人： Akiyoshi Sawai , Haruo Shimamoto , Toru Tachikawa , Jun Shibata
IPC分类号： H01L21/56 , H01L21/58 , H01L21/60 , H01L21/68 , H01L23/12 , H01L23/28 , H01L23/31 , H01L23/367 , H01L23/485 , H01L23/498 , H05K3/30 , H01L21/44
CPC分类号： H01L21/568 , H01L21/563 , H01L21/565 , H01L23/3114 , H01L23/3121 , H01L23/3677 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/28 , H01L24/83 , H01L2224/11 , H01L2224/11003 , H01L2224/1147 , H01L2224/13 , H01L2224/13099 , H01L2224/13111 , H01L2224/1403 , H01L2224/16 , H01L2224/17051 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/81207 , H01L2224/83102 , H01L2224/83104 , H01L2224/8319 , H01L2224/8385 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/1579 , H01L2924/181 , Y10T29/49169
摘要： A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconductor chip is covered with a molding resin which exposes only a top surface of the internal connection conductor. An external connection conductor is formed on a top surface of the internal connection conductor. The external connection conductor has a substantially flat top surface. Thereby, a plastic molded semiconductor package can be easily mounted on a printed board, and can have improved reliability after being joined on the printed board.

10. 发明授权

US5710062A Plastic molded semiconductor package and method of manufacturing the same 失效
公开(公告)号：US5710062A
公开(公告)日：1998-01-20
申请号：US456335
申请日：1995-06-01
申请人： Akiyoshi Sawai , Haruo Shimamoto , Toru Tachikawa , Jun Shibata
发明人： Akiyoshi Sawai , Haruo Shimamoto , Toru Tachikawa , Jun Shibata
IPC分类号： H01L21/56 , H01L21/58 , H01L21/60 , H01L21/68 , H01L23/12 , H01L23/28 , H01L23/31 , H01L23/367 , H01L23/485 , H01L23/498 , H05K3/30 , H01L21/28
CPC分类号： H01L21/568 , H01L21/563 , H01L21/565 , H01L23/3114 , H01L23/3121 , H01L23/3677 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/28 , H01L24/83 , H01L2224/11 , H01L2224/11003 , H01L2224/1147 , H01L2224/13 , H01L2224/13099 , H01L2224/13111 , H01L2224/1403 , H01L2224/16 , H01L2224/17051 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/81207 , H01L2224/83102 , H01L2224/83104 , H01L2224/8319 , H01L2224/8385 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/1579 , H01L2924/181 , Y10T29/49169
摘要： A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconductor chip is covered with a molding resin which exposes only a top surface of the internal connection conductor. An external connection conductor is formed on a top surface of the internal connection conductor. The external connection conductor has a substantially flat top surface. Thereby, a plastic molded semiconductor package can be easily mounted on a printed board, and can have improved reliability after being joined on the printed board.

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